A special grinding stone has been created that can surprisingly cut and polish hard materials like SiC and sapphire!
The "UNIVA-X SPECIAL" is a grinding wheel that promises high-efficiency processing and a reduction in total costs. Diamond abrasive grains are arranged in SPIKE & SPIRAL shapes. The abrasive grains in the core are selected to efficiently utilize the action of free abrasive grains. Since it allows for free shape design according to the type of material being ground, it enables grinding and polishing of various materials as desired. 【Features】 ■ Diamond abrasive grains arranged in SPIKE & SPIRAL shapes ■ Free shape design possible according to the type of material being ground ■ Promises high-efficiency processing and reduction in total costs ■ Reduces waste of the grinding wheel during dressing ■ Load distribution can be controlled through diamond patterning *For more details, please download the PDF or feel free to contact us.
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【Grinding Stone Lineup】 ■Lap Grinding Stones ■Peripheral Blade Grinding Stones ■Mounted Grinding Stones *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Our company is engaged in the manufacturing and sales of special grinding stones, vacuum suction plates, and surface grinding machines, as well as contract processing services for precision grinding, polishing, and dicing. We also handle high-precision porous ceramic vacuum chucks, such as "Aerofix." Please feel free to contact us if you have any inquiries.
