ナノテム Product Lineup

In the image sensor industry, precision machining and efficient processing of materials are required. Particularly in the polishing of hard-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The improper use of grinding wheels can lead to decreased machining accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency machining and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of hard-to-cut materials 【Benefits of Implementation】 - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Decreased dressing frequency

• Grindstone

In the wafer polishing of the memory semiconductor industry, high-precision processing and efficient material handling are required to improve yield. Particularly in the polishing of difficult-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to enhancing productivity, reducing costs, and ultimately improving yield. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges and achieves high-efficiency processing and total cost reduction. 【Usage Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of difficult-to-cut materials 【Effects of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction in dressing frequency

• Grindstone

In the printing industry, precise positioning of sheets is required to produce high-quality printed materials. Especially in cases of complex designs or multi-color printing, even slight misalignments can affect the final output and potentially lead to defective products. There are also concerns about scratches or dirt adhering to the sheets during transport. Our high-precision porous ceramic vacuum chuck, "Aerofix," addresses these challenges and achieves stable sheet positioning. 【Usage Scenarios】 - Positioning during sheet supply to printing machines - Positioning during sheet transport to cutting machines - Positioning during sheet lamination in laminating machines 【Benefits of Implementation】 - Reduction of defective products due to improved positioning accuracy - Stabilization during sheet transport - Reduced risk of contamination of the workpiece

• Chuck

In cleanroom dust-free transport, it is essential to prevent the contamination of fine foreign substances and maintain product quality. Particularly in the transport of delicate workpieces, it is crucial to minimize the risk of contamination and damage due to contact. Our high-precision porous ceramic vacuum chuck and roll, "Aerofix," addresses these challenges by enabling non-contact transport, thereby reducing the risk of workpiece contamination. 【Usage Scenarios】 - Substrate transport within cleanrooms - Wafer transport in semiconductor manufacturing processes - Dust-free transport of precision parts - Non-contact transport of films 【Benefits of Implementation】 - Reduced risk of workpiece contamination - Prevention of scratches during transport - Improved quality through maintained cleanliness

• Chuck

In the gripping of irregularly shaped objects with robotic hands, stable adhesion force is required regardless of the shape of the workpiece. Particularly in the case of complex shapes or delicate materials, conventional adhesion methods can be difficult to apply, leading to risks of transport errors or workpiece damage. Our high-precision porous ceramic vacuum chuck, "Aerofix," addresses these challenges by providing uniform adhesion force, enabling reliable gripping even for irregular objects. 【Application Scenarios】 - Automated transport of complex-shaped parts - Non-contact transport of delicate materials - Robotic hands that accommodate diverse workpieces 【Benefits of Implementation】 - Achieves stable gripping even for irregular objects - Reduces the risk of workpiece damage - Improves transport accuracy

• Chuck

In the automotive parts manufacturing industry, particularly in sensor fixation, precise and stable positioning of fine components is required. The performance and durability of sensors are greatly influenced by the accuracy of their fixation, so even slight misalignments or vibrations are unacceptable. Additionally, improving manufacturing line efficiency and reducing costs are also important challenges. Our high-precision porous ceramic vacuum chuck, "Aerofix," addresses these challenges by providing uniform suction power and reducing the risk of workpiece contamination through non-contact transport. 【Application Scenarios】 - Precise positioning and fixation of automotive sensor components - Stable transport of workpieces on assembly lines - Handling of fine components in clean room environments 【Benefits of Implementation】 - Stabilization of product quality through improved sensor fixation accuracy - Reduction of workpiece contamination risk through non-contact transport - Cost reduction and space-saving through easy integration into existing equipment

• Chuck

In the optical lens manufacturing industry, reliable adhesion is required while preventing the attachment of scratches and dirt during the precise holding of lenses. In particular, damage to delicate lens surfaces directly affects product quality, necessitating careful handling. Additionally, to enhance production efficiency, rapid and stable adhesion and release are crucial. The high-precision porous ceramic vacuum chuck "Aerofix" addresses these challenges, ensuring the safe and efficient holding of lenses. 【Usage Scenarios】 - Holding during lens polishing and processing - Fixing lenses during inspection processes - Holding lenses during transportation 【Benefits of Implementation】 - Reduction of the risk of scratches and contamination on lens surfaces - Improved work accuracy due to stable adhesion - Reduced risk of workpiece contamination through non-contact floating transport

• Chuck

In the precision machining industry, the adhesion of parts is a crucial process that directly affects machining accuracy and production efficiency. Particularly when handling fine parts or workpieces with delicate surfaces, a uniform and stable adhesion force, along with a reduction in damage to the workpiece, is required. Inappropriate adhesion methods can lead to misalignment, damage, and surface contamination of parts, potentially resulting in decreased product quality and the need for reprocessing. The high-precision porous ceramic vacuum chuck "Aerofix" addresses these challenges by providing a uniform adhesion force through its unique ceramic sintering technology, ensuring reliable holding of the workpiece. 【Usage Scenarios】 - Precise positioning and adhesion of fine parts - Handling of workpieces with delicate surfaces - Parts transportation in clean rooms - Fixing parts in high-temperature environments 【Benefits of Implementation】 - Improved machining accuracy - Reduced risk of contamination of workpieces - Enhanced production efficiency - Cost reduction through easy integration into existing equipment

• Chuck

In the liquid crystal panel manufacturing industry and in the fixation of glass substrates, precise positioning and stable adhesion are required. Especially when handling thin and delicate glass substrates, uniform and reliable adhesive force is essential, as even slight misalignments or shocks can affect product quality. Additionally, responding to environmental changes during the manufacturing process (dry, wet, high temperature) is also important. The high-precision porous ceramic vacuum chuck "Aerofix" addresses these challenges with high-performance and high-precision uniform adhesive force. 【Application Scenarios】 - Fixation of glass substrates - Processes requiring precise positioning - Use in dry, wet, and high-temperature environments 【Benefits of Implementation】 - Improved quality through stable fixation of glass substrates - Increased efficiency in the manufacturing process - Enhanced versatility through use in a wide range of environments

• Chuck

In the semiconductor manufacturing industry, wafer transport requires stable adhesion without damaging the fine circuits. Particularly in handling delicate wafers, uniform adhesion is essential, as even slight variations in adhesion can lead to reduced product yield. Additionally, the use in clean room environments and the ability to respond to temperature changes are also important challenges. Our high-precision porous ceramic vacuum chuck, "Aerofix," addresses these challenges with uniform adhesion and excellent durability. 【Usage Scenarios】 - Wafer adhesion and transport - Use in clean room environments - Use in environments with temperature changes 【Benefits of Implementation】 - Stable adhesion and safe transport of wafers - Improved product yield - Compatibility with clean room environments - Adaptation to various transport environments

• Chuck

In precision polishing of substrate materials, high-precision processing and efficient handling of materials are required. Particularly in the polishing of difficult-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency processing and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of difficult-to-cut materials 【Effects of Implementation】 - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction of dressing frequency

• Grindstone

In the GaN wafer manufacturing industry, achieving high-precision surface quality and efficient material processing is essential. Particularly in the polishing of difficult-to-machine materials like GaN, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The improper use of grinding wheels can lead to decreased surface quality, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, enabling high-efficiency processing and total cost reduction. 【Application Scenarios】 - Polishing of GaN wafers - Polishing of other difficult-to-machine material wafers 【Benefits of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Decreased dressing frequency

• Grindstone

In the polishing of SiC wafers, it is essential to perform high-precision processing while maintaining flatness. Particularly in the polishing of difficult-to-machine materials like SiC, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, damage to the wafers, and even stoppages in the production line. The special diamond grinding wheel 'UNIVA-X SPECIAL' addresses these challenges, achieving the maintenance of flatness and high-efficiency processing for SiC wafers. 【Application Scene】 - Polishing of SiC wafers 【Effects of Introduction】 - Maintenance of flatness through high-precision polishing - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Decreased dressing frequency

• Grindstone

In the power semiconductor industry, high-precision processing and efficient handling of materials are required. In particular, when polishing difficult-to-cut materials such as SiC, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency processing and total cost reduction. 【Application Scenarios】 - Polishing SiC wafers - Polishing wafers of other difficult-to-cut materials 【Benefits of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction in dressing frequency

• Grindstone

In the wafer polishing of the logic semiconductor industry, high-precision processing and efficient material handling are required. Particularly in the polishing of hard-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The improper use of grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency processing and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of hard-to-cut materials 【Benefits of Implementation】 - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction of dressing frequency

• Grindstone

In the semiconductor manufacturing industry, the wafer protection process requires precise fixation to prevent fine scratches and contamination. Particularly when handling thin and delicate wafers, there have been cases where the warping caused by the material being drawn into the air release holes of conventional vacuum chuck products has led to quality issues. Our high-precision porous ceramic vacuum chuck, "Aerofix," was developed to address such challenges. It enables partial adsorption without warping, stabilizing and protecting the wafer. 【Usage Scenarios】 - Transporting and fixing wafers - Processes requiring precise positioning 【Benefits of Implementation】 - Reduces the occurrence of suction marks on wafers - Ensures stable adsorption of delicate materials

• Chuck

In the logistics industry, particularly in picking operations, reliable and efficient handling of lightweight items and film materials is required. Traditional vacuum chucks often draw materials into holes on the suction surface, causing deformation, which can make accurate picking and stable holding difficult. This has led to decreased work efficiency and an increased risk of mis-picking. Therefore, the introduction of the high-precision porous ceramic vacuum chuck "Aerofix" contributes to solving these issues. 【Application Scenarios】 - Picking operations for thin film materials - Reliable handling of lightweight items - Dust suppression in the work area 【Effects of Introduction】 - Reliable handling through localized suction without deformation - Wide applicability due to large area compatibility - Maintenance of a clean work environment without dust generation - Compatibility with materials that suppress static electricity generation - High cost performance

• Chuck

In the printing industry, it is anticipated that the warping and shifting of materials in the fixation of thin films can lead to quality issues. Particularly during precision printing, even slight movements of the film are not tolerated, and accurate positioning is required. In conventional vacuum chucks, the film is drawn into the air release holes of the suction surface, causing warping, which leads to printing misalignment and a decline in quality. Our high-precision porous ceramic vacuum chuck, "Aerofix," addresses these challenges by achieving localized suction without warping and ensuring reliable fixation, thereby contributing to improved print quality. 【Usage Scenarios】 - Fixation of thin films - Prevention of misalignment in precision printing processes - Film fixation platform for displays (OLED) 【Benefits of Implementation】 - Suppression of film warping and shifting - Achievement of high-quality printed materials - Reduction of dust generation and static electricity occurrence

• Chuck

In the semiconductor manufacturing industry, wafer polishing requires high-precision processing and efficient material handling. Particularly in the polishing of hard-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel 'UNIVA-X SPECIAL' addresses these challenges, achieving high-efficiency processing and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of hard-to-cut materials 【Benefits of Introduction】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Decreased dressing frequency

• Grindstone

The "UNIVA-X SPECIAL" is a grinding wheel that promises high-efficiency processing and a reduction in total costs. Diamond abrasive grains are arranged in SPIKE & SPIRAL shapes. The abrasive grains in the core are selected to efficiently utilize the action of free abrasive grains. Since it allows for free shape design according to the type of material being ground, it enables grinding and polishing of various materials as desired. 【Features】 ■ Diamond abrasive grains arranged in SPIKE & SPIRAL shapes ■ Free shape design possible according to the type of material being ground ■ Promises high-efficiency processing and reduction in total costs ■ Reduces waste of the grinding wheel during dressing ■ Load distribution can be controlled through diamond patterning *For more details, please download the PDF or feel free to contact us.

• Grindstone

"Aerofix" is a vacuum chuck made of porous ceramics. Thanks to NanoTem's unique ceramic sintering technology, which controls the eutectic reaction between the main agent and the auxiliary agent, it uniformly generates pores of 2μm. It achieves a porosity of 40%, balancing lightness and strength. It can be used in dry environments, as well as wet environments and high-temperature environments up to 150°C. Please feel free to contact us when needed. 【Features】 ■ Solves contamination issues of workpieces such as ultra-thin substrates as an electrostatic prevention material ■ High-performance, high-precision uniform adsorption force ■ Partial adsorption capability ■ Suction roll that realizes space-saving ■ Achieves non-contact floating transport that reduces the risk of contamination of workpieces ■ Simple and cost-effective, just place it on existing equipment *For more details, please download the PDF or feel free to contact us.

• Chuck

"UNIVA-X" is a grinding wheel that achieves high-efficiency processing and reduces total costs. The size and thickness of the honeycomb provide ideal cutting performance and grinding wheel lifespan. The abrasive grains in the core enhance processing efficiency through the action of free abrasive grains. Additionally, load distribution can be controlled through diamond patterning. 【Features】 ■ Ideal cutting performance and grinding wheel lifespan through the size and thickness of the honeycomb ■ Abrasive grains in the core enhance processing efficiency through the action of free abrasive grains ■ Maximizes non-dress and dress intervals ■ Load distribution can be controlled through diamond patterning ■ Achieves high-efficiency processing and reduces total costs *For more details, please refer to the PDF document or feel free to contact us.

• Grindstone
• Wafer processing/polishing equipment
• Other abrasives

The "NRG2000" is a large grinding machine for processing glass substrates, equipped with a cup grinding wheel on the left axis and a straight grinding wheel on the right axis, allowing for versatile processing of flat and curved surfaces. Along with the manufacturing technology of special diamond grinding wheels and large porous chucks, it represents the achievement of our unique grinding technology development cultivated over the years, providing processing solutions for the flat panel display industry, which is on a path of increasing size. After self-cutting the surface of the porous chuck, the workpiece is securely held by suction, enabling high-precision processing. 【Features】 ■ The diamond grinding wheel is porous, allowing for the entry and exit of water and air. ■ Controls the surface condition of the workpiece. ■ Capable of freely processing flat and curved surfaces. ■ Achieves high-precision processing. *For more details, please refer to the related links or feel free to contact us.

• Grinding Machine

"Dyshing Blade" is a completely custom-made diamond grinding stone. It features a blade design that can accommodate groove shapes and more. It has a porous structure with a porosity of 40%. It demonstrates exceptional performance in high-speed cutting of difficult-to-machine materials such as sapphire, quartz glass, silicon, and ceramics. 【Features】 ■ Porous structure with 40% porosity ■ Blade design that can accommodate groove shapes and more ■ Completely custom-made ■ Exceptional performance in high-speed cutting of difficult-to-machine materials such as sapphire, quartz glass, silicon, and ceramics *For more details, please refer to the related links or feel free to contact us.

• Grindstone

The "Precision Diamond Grinding Wheel" has a higher bonding strength in the diamond section compared to the core part. When the workpiece is pressed against it, the core part wears out faster. The diamond section is approximately 10 microns higher, ensuring that the workpiece is always in contact with the diamond. The size of the core part and the width of the diamond section can be designed arbitrarily to match the material of the workpiece, allowing for a higher load distribution on the diamond, which maximizes the grinding wheel's capabilities. Additionally, it is a porous body with over 40% porosity, allowing for the ingress and egress of water and air. 【Features】 ■ The abrasive grains in the core part improve processing efficiency due to the action of free abrasive grains. ■ Maximizes non-dress and dress intervals. ■ Load distribution can be controlled through diamond patterning. ■ Achieves high-efficiency processing and reduces total costs. *For more details, please refer to the related links or feel free to contact us.

• Grindstone

"UNIVA-X" is a grinding wheel that achieves high-efficiency processing and reduction of total costs. The size and thickness of the honeycomb provide ideal cutting performance and grinding wheel lifespan. The abrasive grains in the core enhance processing efficiency through the action of free abrasive grains. Additionally, load distribution can be controlled through diamond patterning. 【Features】 ■ Ideal cutting performance and grinding wheel lifespan achieved through the size and thickness of the honeycomb ■ Abrasive grains in the core enhance processing efficiency through the action of free abrasive grains ■ Maximizes non-dress and dress intervals ■ Load distribution can be controlled through diamond patterning ■ Achieves high-efficiency processing and reduction of total costs *For more details, please refer to the PDF document or feel free to contact us.

• Grindstone

Solving your problems and further extracting business opportunities from them, the developer group Nanotem will open the door to the future of industry together with you. We possess solutions including core technologies, grinding, jigs, polishing, and cutting. We support equipment development, contract processing business, and system sales. Additionally, we develop custom-made new technologies tailored to your company's needs. Please feel free to reach out regarding any processing or development issues. 【Solutions】 ■ Core Technology: Ceramic Sintering Technology ■ Grinding: Constant Torque Infeed Processing ■ Jigs: Porous Ceramic Vacuum Chucks ■ Polishing: Precision Diamond Grinding Wheels ■ Cutting: Dicing Blades *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing
• Processing Contract

"Specific Grinding Energy" is a parameter that represents the relationship between input and output in grinding processes. In other words, it expresses the relationship between the energy input into the process and the resulting grinding rate. Once the parameters of individual grinding wheels are understood, it becomes possible to determine the appropriate grinding rate for specific processing conditions. At Nanotem, we provide suitable tools and equipment for various processing based on this theory. [Features] - A parameter that represents the relationship between input and output in grinding processes - Capable of expressing the relationship between the energy input into the process and the resulting grinding rate - Allows for the determination of the appropriate grinding rate for processing conditions - Provides suitable tools and equipment for various processing *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing
• Processing Contract

Facing new materials such as sapphire, quartz glass, and silicon that cannot be processed with conventional tools, the desire of those in the field for "if only there were such tools..." becomes the driving force behind the evolution of processing technologies such as cutting, polishing, and grinding. To avoid wasting time and materials, new tools are necessary for new materials. With NanoTem's unique "ceramic sintering technology," we develop the ideal tools desired by the field and realize the evolution of cutting-edge technology. 【What is ceramic sintering technology?】 - Control of sinterability through the addition of additives - Complete sintering is possible through the eutectic reaction between additives and the main material, with no dust generation - Free control of pore diameter (1-200 microns) and porosity (10-60%) *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing
• Processing Contract

We have sample chucks available for you. The lending period is one week. In principle, it is one week, but if you provide a reason, an extension is possible. As for the cost of the loan, it is free of charge, offset by the evaluation content and results provided by the customer. 【Features】 ■ Lending period is one week ■ When lending, please include the following two items: - Precautions for using the test samples - Evaluation form for the loaned samples ■ Lineup: □ 100 chuck, □ 220 chuck *For more details, please refer to the PDF document or feel free to contact us.

• Chuck

Company D was engaged in the development and sales of polishing equipment, but they faced challenges with workpiece fixation during polishing and felt the need for product development utilizing new technologies. Therefore, they visited our actual facilities and technologies. They were impressed by our technical capabilities and uniqueness, which exceeded their expectations. Additionally, they recognized the potential of our technology, which is not mainstream at present, developed through techniques involving porous alumina and polishing. [Case Overview] ■ Client: Company D ■ Application: Adsorption and polishing ■ Utilization: Vacuum chuck, general polishing *For more details, please refer to the PDF document or feel free to contact us.

• Chuck

Company C had quality issues with traditional vacuum chuck products due to film material being drawn into the air release holes on the suction surface, causing deformation. Therefore, they introduced "Aerofix." It received high evaluations in all categories: "no deformation during partial suction," "capable of handling large areas," "no dust generation," "no static electricity," and "high cost performance." 【Case Overview】 ■ Client: Company C ■ Application: Suction ■ Use: As a film holding platform for displays (OLED) *For more details, please refer to the PDF document or feel free to contact us.

• Chuck

Company B was having trouble with the time and effort required for a series of tasks such as applying, removing, and cleaning the wax used to secure sapphire substrates during polishing. Therefore, they introduced "Aerofix." This solution achieved stable fixation without the use of wax, significantly improving work efficiency and reducing costs by eliminating wax-related tasks. 【Case Overview】 ■ Client: Company B ■ Application: Polishing ■ Use: As a fixture for polishing artificial sapphire for LCDs and LEDs *For more details, please refer to the PDF document or feel free to contact us.

• Chuck

Company A had difficulty focusing the laser on the workpiece due to the challenges of laser annealing, and wanted to apply the laser while keeping the workpiece suspended. However, they were struggling to secure it properly with conventional chucks. Therefore, they introduced "Aerofix." This allowed for precise and stable levitation, making it easier to focus the laser. Additionally, the effectiveness of fine micropores for partial adhesion significantly improved work efficiency. [Case Overview] - Client: Company A - Application: Levitation - Utilization: Levitation platform for excimer laser annealing equipment for small to medium-sized displays *For more details, please refer to the PDF document or feel free to contact us.*

• Chuck

"Aerofix" is a vacuum chuck made of porous ceramics. It features a unique ceramic from Nanotem, controlled by the eutectic reaction of the main agent and the auxiliary agent. Sintering technology uniformly generates 2μm pores, achieving a porosity of 40%, balancing lightness and strength. It allows for "partial adsorption," enabling secure fixation even for workpieces like fine parts that only cover a portion of the adsorption surface. There is no need to change the chuck depending on the workpiece. [Features] ■ Vacuum chuck made of porous ceramics ■ Uniformly generates 2μm pores ■ 40% porosity ■ Balances lightness and strength ■ Usable in dry environments, as well as wet environments and high-temperature environments up to 150°C *For more details, please refer to the PDF document or feel free to contact us.

• Chuck

The "High Precision Multi-Functional Double-Sided Lapping Machine" achieves high precision through the supply of water and air from within the grinding wheel. It comes standard with a porous diamond grinding wheel. In addition to being able to control the processing speed through water pressure and air pressure, it also prevents the workpiece from falling. Furthermore, our diamond grinding wheels are porous, allowing for the entry and exit of water and air. 【Features】 ■ Standard equipped with a porous diamond grinding wheel ■ Our diamond grinding wheels are porous, allowing for the entry and exit of water and air ■ Prevents workpiece from falling (prevents it from sticking to the upper plate) ■ Processing speed can be controlled by water pressure and air pressure *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

"Aerofix" is a vacuum chuck that solves the challenges of conventional through-hole type vacuum chucks through its unique ceramic sintering technology. It accommodates wet and dry environments as well as various work sizes. There is no need to prepare different types and sizes for each workpiece, achieving cost reduction and improved work efficiency. To eliminate static electricity without charging or discharging, additional equipment such as "ionizers" is unnecessary, making it safe for precision product workpieces. 【Features】 - Solves contamination issues for ultra-thin substrates and other workpieces as an anti-static material. - Capable of partial adsorption, allowing one unit to handle various work sizes. - Reduces the risk of workpiece contamination and enables non-contact floating transport. - Suitable for delicate thin workpieces with high-performance, high-precision uniform adsorption force. - Space-saving suction roll design. - Simply place it on existing equipment for convenience and cost reduction. *For more details, please refer to the PDF document or feel free to contact us.

• Chuck