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ナノテム

addressNiigata/Nagaoka-shi/3-2-10 Jōgōka, Chūō-ku
phone0258-22-6725
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last updated:Jun 01, 2026
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エアロフィックス エアロフィックス
ダイヤモンド砥石 ダイヤモンド砥石
加工装置 加工装置
コア技術 コア技術
ダイヤモンド砥石

ダイヤモンド砥石

特殊ダイヤモンド砥石 UNIVA-X(ユニバックス)

Precision diamond grinding wheel

Achieved high-efficiency grinding of advanced electronic component materials! Capable of intake and exhaust of water and air.

The "Precision Diamond Grinding Wheel" has a higher bonding strength in the diamond section compared to the core part. When the workpiece is pressed against it, the core part wears out faster. The diamond section is approximately 10 microns higher, ensuring that the workpiece is always in contact with the diamond. The size of the core part and the width of the diamond section can be designed arbitrarily to match the material of the workpiece, allowing for a higher load distribution on the diamond, which maximizes the grinding wheel's capabilities. Additionally, it is a porous body with over 40% porosity, allowing for the ingress and egress of water and air. 【Features】 ■ The abrasive grains in the core part improve processing efficiency due to the action of free abrasive grains. ■ Maximizes non-dress and dress intervals. ■ Load distribution can be controlled through diamond patterning. ■ Achieves high-efficiency processing and reduces total costs. *For more details, please refer to the related links or feel free to contact us.

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Diamond grinding stone "Dicing Blade"

Enables high-speed cutting of hard-to-machine materials such as sapphire, quartz glass, and silicon!

"Dyshing Blade" is a completely custom-made diamond grinding stone. It features a blade design that can accommodate groove shapes and more. It has a porous structure with a porosity of 40%. It demonstrates exceptional performance in high-speed cutting of difficult-to-machine materials such as sapphire, quartz glass, silicon, and ceramics. 【Features】 ■ Porous structure with 40% porosity ■ Blade design that can accommodate groove shapes and more ■ Completely custom-made ■ Exceptional performance in high-speed cutting of difficult-to-machine materials such as sapphire, quartz glass, silicon, and ceramics *For more details, please refer to the related links or feel free to contact us.

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Reduction of processing time for SiC and GaN | Porous diamond grinding wheel for clogging elimination

Ideal cutting performance and whetstone lifespan! Are you wasting your whetstone with dressing?

"UNIVA-X" is a grinding wheel that achieves high-efficiency processing and reduces total costs. The size and thickness of the honeycomb provide ideal cutting performance and grinding wheel lifespan. The abrasive grains in the core enhance processing efficiency through the action of free abrasive grains. Additionally, load distribution can be controlled through diamond patterning. 【Features】 ■ Ideal cutting performance and grinding wheel lifespan through the size and thickness of the honeycomb ■ Abrasive grains in the core enhance processing efficiency through the action of free abrasive grains ■ Maximizes non-dress and dress intervals ■ Load distribution can be controlled through diamond patterning ■ Achieves high-efficiency processing and reduces total costs *For more details, please refer to the PDF document or feel free to contact us.

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Special Diamond Grinding Stone "UNIVA-X SPECIAL"

A special grinding stone has been created that can surprisingly cut and polish hard materials like SiC and sapphire!

The "UNIVA-X SPECIAL" is a grinding wheel that promises high-efficiency processing and a reduction in total costs. Diamond abrasive grains are arranged in SPIKE & SPIRAL shapes. The abrasive grains in the core are selected to efficiently utilize the action of free abrasive grains. Since it allows for free shape design according to the type of material being ground, it enables grinding and polishing of various materials as desired. 【Features】 ■ Diamond abrasive grains arranged in SPIKE & SPIRAL shapes ■ Free shape design possible according to the type of material being ground ■ Promises high-efficiency processing and reduction in total costs ■ Reduces waste of the grinding wheel during dressing ■ Load distribution can be controlled through diamond patterning *For more details, please download the PDF or feel free to contact us.

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