ナノテム Product Lineup

The "Precision Diamond Grinding Wheel" has a higher bonding strength in the diamond section compared to the core part. When the workpiece is pressed against it, the core part wears out faster. The diamond section is approximately 10 microns higher, ensuring that the workpiece is always in contact with the diamond. The size of the core part and the width of the diamond section can be designed arbitrarily to match the material of the workpiece, allowing for a higher load distribution on the diamond, which maximizes the grinding wheel's capabilities. Additionally, it is a porous body with over 40% porosity, allowing for the ingress and egress of water and air. 【Features】 ■ The abrasive grains in the core part improve processing efficiency due to the action of free abrasive grains. ■ Maximizes non-dress and dress intervals. ■ Load distribution can be controlled through diamond patterning. ■ Achieves high-efficiency processing and reduces total costs. *For more details, please refer to the related links or feel free to contact us.

"Dyshing Blade" is a completely custom-made diamond grinding stone. It features a blade design that can accommodate groove shapes and more. It has a porous structure with a porosity of 40%. It demonstrates exceptional performance in high-speed cutting of difficult-to-machine materials such as sapphire, quartz glass, silicon, and ceramics. 【Features】 ■ Porous structure with 40% porosity ■ Blade design that can accommodate groove shapes and more ■ Completely custom-made ■ Exceptional performance in high-speed cutting of difficult-to-machine materials such as sapphire, quartz glass, silicon, and ceramics *For more details, please refer to the related links or feel free to contact us.

"UNIVA-X" is a grinding wheel that achieves high-efficiency processing and reduces total costs. The size and thickness of the honeycomb provide ideal cutting performance and grinding wheel lifespan. The abrasive grains in the core enhance processing efficiency through the action of free abrasive grains. Additionally, load distribution can be controlled through diamond patterning. 【Features】 ■ Ideal cutting performance and grinding wheel lifespan through the size and thickness of the honeycomb ■ Abrasive grains in the core enhance processing efficiency through the action of free abrasive grains ■ Maximizes non-dress and dress intervals ■ Load distribution can be controlled through diamond patterning ■ Achieves high-efficiency processing and reduces total costs *For more details, please refer to the PDF document or feel free to contact us.

The "UNIVA-X SPECIAL" is a grinding wheel that promises high-efficiency processing and a reduction in total costs. Diamond abrasive grains are arranged in SPIKE & SPIRAL shapes. The abrasive grains in the core are selected to efficiently utilize the action of free abrasive grains. Since it allows for free shape design according to the type of material being ground, it enables grinding and polishing of various materials as desired. 【Features】 ■ Diamond abrasive grains arranged in SPIKE & SPIRAL shapes ■ Free shape design possible according to the type of material being ground ■ Promises high-efficiency processing and reduction in total costs ■ Reduces waste of the grinding wheel during dressing ■ Load distribution can be controlled through diamond patterning *For more details, please download the PDF or feel free to contact us.

In the semiconductor manufacturing industry, wafer polishing requires high-precision processing and efficient material handling. Particularly in the polishing of hard-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel 'UNIVA-X SPECIAL' addresses these challenges, achieving high-efficiency processing and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of hard-to-cut materials 【Benefits of Introduction】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Decreased dressing frequency

In the wafer polishing of the logic semiconductor industry, high-precision processing and efficient material handling are required. Particularly in the polishing of hard-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The improper use of grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency processing and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of hard-to-cut materials 【Benefits of Implementation】 - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction of dressing frequency

In the power semiconductor industry, high-precision processing and efficient handling of materials are required. In particular, when polishing difficult-to-cut materials such as SiC, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency processing and total cost reduction. 【Application Scenarios】 - Polishing SiC wafers - Polishing wafers of other difficult-to-cut materials 【Benefits of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction in dressing frequency

In the polishing of SiC wafers, it is essential to perform high-precision processing while maintaining flatness. Particularly in the polishing of difficult-to-machine materials like SiC, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, damage to the wafers, and even stoppages in the production line. The special diamond grinding wheel 'UNIVA-X SPECIAL' addresses these challenges, achieving the maintenance of flatness and high-efficiency processing for SiC wafers. 【Application Scene】 - Polishing of SiC wafers 【Effects of Introduction】 - Maintenance of flatness through high-precision polishing - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Decreased dressing frequency

In the GaN wafer manufacturing industry, achieving high-precision surface quality and efficient material processing is essential. Particularly in the polishing of difficult-to-machine materials like GaN, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The improper use of grinding wheels can lead to decreased surface quality, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, enabling high-efficiency processing and total cost reduction. 【Application Scenarios】 - Polishing of GaN wafers - Polishing of other difficult-to-machine material wafers 【Benefits of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Decreased dressing frequency

In precision polishing of substrate materials, high-precision processing and efficient handling of materials are required. Particularly in the polishing of difficult-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency processing and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of difficult-to-cut materials 【Effects of Implementation】 - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction of dressing frequency

In the wafer polishing of the memory semiconductor industry, high-precision processing and efficient material handling are required to improve yield. Particularly in the polishing of difficult-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to enhancing productivity, reducing costs, and ultimately improving yield. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges and achieves high-efficiency processing and total cost reduction. 【Usage Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of difficult-to-cut materials 【Effects of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction in dressing frequency

In the image sensor industry, precision machining and efficient processing of materials are required. Particularly in the polishing of hard-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The improper use of grinding wheels can lead to decreased machining accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency machining and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of hard-to-cut materials 【Benefits of Implementation】 - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Decreased dressing frequency