High-precision porous ceramic vacuum chuck for semiconductor manufacturing

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Aerofix

last updated：Jul 13, 2026

ナノテム

Solving the challenges of wafer transport! Uniform adhesion with unique ceramics sintering technology.

In the semiconductor manufacturing industry, wafer transport requires stable adhesion without damaging the fine circuits. Particularly in handling delicate wafers, uniform adhesion is essential, as even slight variations in adhesion can lead to reduced product yield. Additionally, the use in clean room environments and the ability to respond to temperature changes are also important challenges. Our high-precision porous ceramic vacuum chuck, "Aerofix," addresses these challenges with uniform adhesion and excellent durability. 【Usage Scenarios】 - Wafer adhesion and transport - Use in clean room environments - Use in environments with temperature changes 【Benefits of Implementation】 - Stable adhesion and safe transport of wafers - Improved product yield - Compatibility with clean room environments - Adaptation to various transport environments

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【Features】 - Solves contamination issues of workpieces such as ultra-thin substrates using static electricity prevention materials - High-performance, high-precision uniform adhesion force - Partial adhesion capability - Space-saving suction roll - Achieves non-contact floating transport to reduce contamination risks for workpieces - Simple and cost-effective installation by just placing it on existing equipment 【Our Strengths】 We manufacture and sell special grinding wheels, vacuum suction plates, and surface grinding machines, and we also engage in contract processing for precision grinding, polishing, and dicing. We provide products based on many years of experience and technology. Our high-precision porous ceramic vacuum chuck, "Aerofix," has been developed to meet the diverse needs of our customers. Please feel free to contact us with your inquiries.