Heat dissipation approach from both circuit and mechanism aspects
This seminar will provide practical explanations on thermal management, which is crucial for electronic devices equipped with ICT/IoT devices and high-performance semiconductors, from both the substrate/circuit design and mechanical/structural design perspectives. It will cover the three principles of heat, heat generation and reliability in electronic circuits, heat reduction technologies, heat dissipation design for semiconductors, case studies of failures, temperature verification with actual devices, TIM and heat dissipation materials, case studies of failures due to thermal structural design, and thermal simulation. *For more details, please check the related links or the seminar details in the catalog.*
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<Event Information> Format: In-person attendance / Live streaming (Zoom) / Archive streaming Location: Japan IR Headquarters Seminar Room (3-minute walk from Akihabara Station, among others) Date and Time: [In-person attendance][Live streaming] July 13, 2026 (Monday) 10:00 AM - 4:00 PM [Archive streaming] July 15 - July 29 (available for viewing multiple times during the period) Participation Fee: 49,500 yen per person (tax included) Instructors: Takashi Suzuki, Takashi Tago
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<Seminar Program (Tentative)> Chapter 1: The Three Principles of Heat and Trends in Thermal Design for Electronic Devices Chapter 2: Thermal Design and Countermeasures through Circuits/Boards Chapter 3: Circuit Failure Case Studies Chapter 4: Verification of Heat Generation (Temperature) Chapter 5: Key Points in Structural Thermal Design Chapter 6: Failure Case Studies Due to Thermal Structural Design Chapter 7: Thermal Simulation (CAE) Chapter 8: Summary and Q&A
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