■Coupled Analysis (Electromagnetic Waves + Heat Conduction) WAVEjω & THERMO
PHOTO-WAVEjω & THERMO
We will perform frequency response analysis using a 3D high-frequency electromagnetic field analysis software (high-frequency electromagnetic field simulator) based on the finite element method.
The software for 3D high-frequency electromagnetic field analysis using the finite element method (high-frequency electromagnetic field simulator) performs frequency response analysis. It can handle three-dimensional problems. 【Features】 - Since it is an integrated pre- and post-processor dedicated to the PHOTO series, data creation, analysis, and result processing can be performed as a continuous operation. - A revolutionary speedup has been achieved through the combined use of edge element method and ICCG method (dozens of times faster than conventional finite element methods). - The use of the finite element method ensures stable solutions, making it safe for beginners to use. - It can be coupled with the thermal conduction analysis module PHOTO-THERMO to calculate the temperature distribution of heat generation due to dielectric loss. - Since WAVEjω and THERMO are integrated, the transfer of heat generation density is automatically conducted without the need for files. - It is also possible to use WAVEjω and THERMO separately.
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basic information
- It can handle anisotropic materials (relative permittivity/relative permeability). - Nonlinear analysis can be performed with temperature-dependent thermal conductivity and specific heat. - There is an automatic current input function and a voltage input function. - An impedance boundary is provided, making the setup of a non-reflective boundary easy. - Conditions for constant temperature boundaries, adiabatic boundaries, and heat transfer boundaries can be set. - The amount of heat generated by the attenuation of electromagnetic waves (high frequency) in a dielectric can be calculated. - By specifying ports, quantities such as impedance can be easily obtained. - As analysis results, electric field distribution, magnetic field distribution, and Poynting vector, among others, can be obtained. - The slide interface allows for the handling of objects that move relative to each other. - Analysis considering displacement currents generated in time-varying dielectrics can be performed. - It is equipped with a restart function. - Multiple files can be loaded for continuous execution. - The external field function allows for easy movement of magnets and coils.
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Applications/Examples of results
【Applicable Fields】 Fields where thermal conduction simulation involving high-frequency electromagnetic fields (electromagnetic waves) is necessary. - Microwave 【Analysis Examples】 - Analysis of microwaves For the above analysis examples, please refer to the catalog from the 'Download' section below or contact us directly through 'Request for Materials'.
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Company information
At Photon, we are developing "electromagnetic field analysis software" that models and simulates products and components utilizing electromagnetic phenomena on a computer. In traditional design and development environments, the process has primarily revolved around trial and error through prototyping based on the experience of engineers and experiments with prototypes. However, conducting experiments using actual prototypes and analyzing the results requires significant time and cost. Moving forward, transitioning from an experimental and prototyping-based approach to an analysis-based design approach will be a crucial challenge for improving productivity, and establishing simulation technology as the core of analysis-based design techniques will be essential. In this context, Photon is developing and providing "analysis software" focusing on electromagnetic fields, as well as heat, vibration, and sound fields. By utilizing Photon's software, efficient development and design of various industrial products can be achieved. In this way, Photon aims to support users in reducing the number of prototypes, lowering development costs, and shortening development periods in their manufacturing environments, ultimately enhancing their competitiveness.
