[Analysis Case] Chemical Bonding State Analysis of Cu in the FPC Laminated Interface Region
By using SAICAS, it becomes possible to analyze heterogeneous material interfaces even in XPS analysis, where the probe diameter is large and cross-sectional measurements are typically difficult.
Flexible printed circuits (FPC) used in electronic devices such as smartphones have a structure composed of layers of resin and metal. To maintain sufficient performance, the adhesion between each layer is crucial; however, at the interface between polyimide (PI) resin and copper (Cu), it is known that copper oxide is generated over time, leading to delamination. In this case study, we targeted the FPC from a deteriorated commercial product, created cross-sections using a slant cutting device (SAICAS), and analyzed the chemical bonding state at the interface using X-ray photoelectron spectroscopy (XPS).
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Kaneka Techno Research Co., Ltd. was established in 1988 with the corporate philosophy of becoming a trusted partner for our customers in the fields of "analytical services" and "technical information services." As a group of professionals with foresight and advanced analytical and research techniques, we aim to propose solutions to the challenges faced by our customers and to provide high-quality technical services quickly, thereby becoming a trusted problem-solving technical service company. We will continue to strive for improvement every day. We sincerely request your continued guidance and support.
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