[Technical Seminar] Basics of LTspice Thermal Design and Thermal Circuit Networks and Circuit Design
You will take the course using approximately 80 pages of text and about 20 LTspice circuit files, which are designed with consideration for practical application after the course.
This seminar aims to help participants understand the principles of heat generation and heat transfer in electronic devices, enabling quantitative thermal design through mathematical formulation, and acquiring knowledge for thermal transient analysis using SPICE. It will cover the three elements of heat conduction, thermal calculations, the current-voltage characteristics of MOSFETs, thermal circuit networks and SPICE simulations, self-heating of MOSFETs, and the creation of self-heating MOSFET models and thermal simulations. *For more details, please check the related links or the seminar details in the catalog.*
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<Event Information> Format: In-person attendance / Live streaming (Zoom) Location: Japan IR Co., Ltd. Head Office Seminar Room Date and Time: November 19, 2026 (Thursday) 10:00 AM - 5:00 PM Participation Fee: 49,500 yen (tax included) Instructor: Masashi Aoki
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<Seminar Program (Tentative)> Chapter 1: Seminar Overview Chapter 2: Why Thermal Design is Necessary Chapter 3: Three Elements of Thermal Conduction Chapter 4: Thermal Calculations Chapter 5: Current-Voltage Characteristics of MOSFETs Chapter 6: Thermal Circuit Networks and SPICE Simulation Chapter 7: Self-Heating of MOSFETs Chapter 8: Creation of Self-Heating MOSFET Model and Thermal Simulation
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