[Application Example] Photonics Alignment and Packaging

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basic information

The waveguides on silicon wafers are extremely fine, measuring about 150 to 200 nm, which is approximately 50 times smaller than the core diameter of about 9 µm in optical fibers. Therefore, handling, positioning, and alignment require extremely high precision. On the other hand, high production throughput is also required in mass production processes, making the coexistence of high precision and speed crucial. PI provides high-speed, high-precision multi-channel optical alignment from wafer-level testing of SiPh products to the packaging process. The optical alignment products we offer integrate high-speed piezo nano-positioning technology with proprietary alignment algorithms. PI's Fast Multi-Channel Photonics Alignment (FMPA) is a firmware-based alignment function embedded in the controllers of piezo nano-positioning systems and hexapods.

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FMPA automatically performs high-speed alignment by incorporating light intensity into the controller and simultaneously controlling multiple inputs, outputs, and operation axes. Thanks to PI's proprietary algorithm, it can detect the optimal position in just a few hundred milliseconds. Additionally, by processing multiple channels in parallel, it eliminates the need for the traditional step of repeatedly adjusting the position of each channel, significantly reducing the time required for testing and packaging. Furthermore, the modular architecture allows for flexible adaptation to the different testing and packaging requirements of various devices and production processes.

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