HG400 Wire Electrical Discharge Machine for Semiconductor Manufacturing

Improving the efficiency of fine processing with automatic wiring for semiconductor manufacturing.

In the semiconductor manufacturing industry and precision machining, high-precision component processing is required. In particular, when processing fine circuit patterns or components with complex shapes, a stable supply of wire and accurate connections significantly impact processing quality and production efficiency. Conventional molybdenum wire electrical discharge machines required manual labor for connection work in exchange for low operating costs, which sometimes hindered unmanned operation. The new HG series achieves automatic connections with molybdenum wire through a uniquely developed mechanism, reducing the burden on operators. This allows for a reduction in running costs while improving work efficiency, meeting the demands of precision machining in semiconductor manufacturing. 【Usage Scenarios】 - Processing of fine semiconductor components - Prototyping and mass production of precision components with complex shapes - Productivity improvement through automation 【Benefits of Implementation】 - Reduction in running costs - Promotion of unmanned operation by freeing from connection work - Improvement in production efficiency

Electric discharge machine