[Technical Seminar] Thermal Management Clinic for Electronic Devices

Heat dissipation approach from both circuit and mechanism perspectives

This seminar is a course that explains practical thermal countermeasures for electronic devices from both substrate/circuit design and mechanical/structural design perspectives. First, participants will learn the three principles of heat and the latest trends in thermal design, including the mechanisms of heat generation in electronic circuits, derating, techniques for reducing heat generation through lower resistance, lower voltage, and lower speed, as well as heat dissipation design for semiconductors. Additionally, examples of issues caused by heat generation and cooling in circuits, as well as precautions for temperature measurement in actual devices, will be introduced. Furthermore, the characteristics and differentiation of TIM (thermal interface materials) such as thermal conductive sheets and grease will be discussed, along with the selection of heat dissipation materials and considerations for insulation, heat resistance, and heat shielding. Case studies of issues arising from thermal structural design, methods for utilizing thermal simulation (CAE), and ways to analyze results will also be explained. *For more details, please check the related links or the seminar details in the catalog.*

Technical Seminar