M.2 PCIe BGA
The PCIe BGA, which supports HMB and features a maximum of 4-lane operation mode, achieves both high performance and low latency for the latest applications. The firmware is optimized for industrial systems with a wide operating temperature range, high durability, and data retention capabilities. The E2000 and E7000 series utilize 3D NAND TLC flash to achieve large capacities. The E2600 and E7600 series operate in pSLC mode, providing the best data retention and reliability.
Inquire About This Product
basic information
E2000 Industrial 3D-TLC PCIe Gen 3.1 x4 M.2 1620 BGA 291-ball BGA, pitch 0.8mm, 16 x 20mm 3D NAND TLC Operating temperature range: -40°C to 85°C Power loss protection, AES 256 encryption E2600 Industrial 3D-pSLC PCIe Gen 3.1 x4 M.2 1620 BGA 291-ball BGA, pitch 0.8mm, 16 x 20mm 3D NAND pSLC Operating temperature range: -40°C to 85°C Power loss protection, AES 256 encryption
Price range
Delivery Time
Applications/Examples of results
Automotive and transportation equipment industry / Electronics and electrical equipment industry
Company information
"To that system" "To that design." All products are manufactured at the Swissbit Germany, AG factory in Berlin, Germany. Swissbit products, equipped with safety environmental performance and high technical standards specialized for industrial applications, promise to enhance the reliability of the systems they are integrated into. Swissbit, which became independent from Siemens in Switzerland in 2001, has established itself as a global innovation leader in storage and security products, based on over 25 years of experience in the development and manufacturing of high-density, high-integration products, as well as solid engineering, circuit design, and process technology. Swissbit's flash storage products flexibly respond to the demands of high performance and multifunctionality in embedded and industrial systems for IIoT and M2M platforms. The concept of "Industry 4.0," aimed at realizing the advancement of industries centered on manufacturing, is rooted in the Japanese manufacturing spirit of "solving specific challenges/problems" and the perseverance to continuously build upon design technology. It thoroughly addresses the analysis of defects and failures, aiming for further improvements in quality standards and reliability with a global perspective and specialized technology.














![[HPC Implementation Case] Major Domestic Automobile Parts Manufacturer](https://image.mono.ipros.com/public/product/image/2071717/IPROS16850975807821752261.png?w=280&h=280)