Subsidies available for the introduction of dicing equipment | Labor-saving investment subsidies
You can use a subsidy with a maximum limit of 100 million yen and a subsidy rate of 1/2 to 2/3 for the introduction of dicing equipment.
The introduction of dicing equipment can utilize the Small and Medium Enterprise Labor-Saving Investment Subsidy (General Type). Equipment that combines peripheral devices and automation tailored to the site is eligible. 【Examples of configurations targeting dicing machines】 ■ Delegate the cutting of wafers to fully automated equipment Reduce the time spent by personnel setting wafers one by one into the machine ■ Integrate cleaning and drying after cutting Reduce the time spent waiting for cleaning and the transportation before and after cutting ■ Automatically monitor blade wear and chipping Reduce the effort required for blade inspection and replacement decisions 【Support from Taigen】 Over 158 adoptions and a total subsidy amount of over 2.8 billion yen. Consultations are free. We will assist you from creating a business plan to application, and from adoption to grant application and performance reporting. *You can easily reserve a 60-minute free consultation by selecting a date from the QR code in the catalog.
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basic information
【Subsidy Upper Limit (by Number of Employees)】 - 5 or fewer: 7,500,000 yen (10,000,000 yen for significant wage increases) - 6 to 20: 15,000,000 yen (20,000,000 yen for significant wage increases) - 21 to 50: 30,000,000 yen (40,000,000 yen for significant wage increases) - 51 to 100: 50,000,000 yen (65,000,000 yen for significant wage increases) - More than 101: 80,000,000 yen (100,000,000 yen for significant wage increases) 【Subsidy Rate】 Small and medium-sized enterprises: 1/2 (2/3 if working to raise the minimum wage), small businesses: 2/3 【Eligible Expenses for Subsidy】 Costs for machinery and equipment/system construction (mandatory), transportation costs, technology introduction costs, related expenses for intellectual property rights, outsourcing costs, expert fees, cloud service usage fees It is a condition to include at least one piece of machinery or equipment with a unit price of 500,000 yen (excluding tax) or more.
Price information
The upfront fee is 100,000 yen, and the success fee is only received when accepted. Consultations are free.
Delivery Time
※Available nationwide online. You can proceed to application in as little as 2 weeks.
Applications/Examples of results
【Example of Calculation】 In the case of a semiconductor component manufacturing company (with 60 employees) introducing a fully automatic dicing machine + cleaning and drying unit + wafer transport device: - Equipment cost (excluding tax): 50,000,000 yen - Subsidy (subsidy rate 1/2): 25,000,000 yen - Actual burden: 25,000,000 yen * The subsidy limit for 60 employees is 50,000,000 yen. The actual subsidy amount will be determined based on the content of the plan and the review. 【Frequently Asked Questions】 Q. Can this be used for replacing dicing equipment? A. Yes, if combined with cleaning and transport to reduce manual labor, it qualifies. Q. Can it be used for cutting glass or ceramics? A. Yes, it can be used. Plans can be made in workplaces where manual labor is involved in cutting, regardless of the material.
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Company information
Taigen Co., Ltd. is a management consulting company established in 2021. Based on the "tips" and "solutions" gained from practice, we provide support for building strong organizations, financial assistance, and new business development. Additionally, we offer a wide range of services, including the formulation of organizational visions, the establishment of evaluation systems, financial training, support for subsidy applications, as well as the planning of business strategies and support for new businesses. We provide one-stop support from building a robust organization and business strategy to fundraising. Please feel free to contact us when needed.
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