Trends in packaging technology and future prospects based on domestic and international examples from 2026.
This seminar will introduce trends in packaging technology and future prospects, focusing on packaging-related news and case studies from 2026, while incorporating the situation after the application of the PPWR and the concepts of the ISO 59000 series. It will cover topics such as paperization, barrier technology, monomaterialization, lightweighting, thin film technology, the use of recycled materials, horizontal recycling, and mechanisms for reuse and collection, explaining the background of case studies, the characteristics of technologies, and challenges during implementation. Instructors who have been involved in development, technology, and planning from both the manufacturing and usage sides of packaging will provide hints that can be utilized in packaging development and proposals. *For more details, please check the related links or the seminar details in the catalog.*
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<Event Information> Format: Live Streaming (Zoom) / Archive Streaming Date and Time: 【LIVE Streaming】January 20, 2027 (Wednesday) 13:30 - 16:30 【Archive Streaming】January 22 - February 5 Tuition Fee: 29,700 yen (tax included) Instructor: Motokazu Uchimura
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<Seminar Program (Tentative)> Chapter 1: Latest Trends in Packaging Domestically and Internationally Chapter 2: How to Apply the Concepts of ISO 59000 to Packaging Design Chapter 3: Changes and Challenges in Packaging Technology from Domestic and International Case Studies Chapter 4: Towards Future Packaging Design
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