Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.
The "MODEL860Eagle" is a universal die bonder that allows for bonding suitable for various purposes, including flip chip, eutectic, ultrasonic, thermal compression, and epoxy bonding, all achievable simply by exchanging the head. It features high placement accuracy and excellent operability, made possible by the use of a half-mirror viewing system. 【Product Overview (Excerpt)】 ■ Half-mirror viewing system ■ High-precision servo motor used (Z drive) ■ Automatic temperature control (stage / collet temperature) ■ Bond weight selection (15 g to 700 g or 50 g to 10 kg) ■ Ultra-high precision linear scrub bond head (start position reproducibility within ± 1 micron) *For more details, please refer to the external link or feel free to contact us.
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basic information
【Product Overview】 ■ Single or dual hot gas heating system ■ Die pickup stage with 4-inch tray, 2-inch tray, custom specifications available ■ Bond weight, temperature profile, process time, and machine cycle are automatically controlled ■ Rapid heating stage (Max 400 ℃), normal heating stage (Max 450 ℃), and various cooling stages ■ Heated die tools (collet) Max 350 ℃ ■ Preform tool ■ Direct viewing microscope (optional) *For more details, please refer to the external link or feel free to contact us.
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For more details, please refer to the external link or feel free to contact us.
Company information
Hugle started in 1969 as the Far East branch of the American company Hugle Industries, a world leader in semiconductor manufacturing equipment during the early days of the semiconductor industry. Taking advantage of this first-mover advantage, it established a foundation as an independent manufacturer in 1971. Since then, in the ever-evolving world of semiconductors and flat panels such as LCDs, we have consistently developed and provided numerous innovative products ahead of the times. What we particularly want to highlight is our unwavering commitment to originality, focusing on equipment and devices related to a "pure and clean production environment," which are not commonly addressed by others and significantly impact quality. As you know, semiconductor technological innovation aims for limitless miniaturization, which inevitably requires "ultra" levels of cleanliness and purity in production and inspection environments. Therefore, we have prominently embraced the philosophy of "Clean & Quality," striving to refine our available technologies to realize a more advanced production environment.
