It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
◆Bonding accuracy XY: ±40µm, Θ: ±3° 3σ ◆Inspection and detection of solder joint quality using DBI ◆Powerful setup wizard ◆Option to choose heater rail unit or adapter rail replacement
Inquire About This Product
basic information
This is a die bonder that performs chip bonding by supplying solder while pitch-feeding a short strip lead frame supplied from the loader on a heater rail maintained in a reducing atmosphere, and then storing it in the unloader. It is capable of supporting gold eutectic and epoxy bonding based on solder joining.
Price information
-
Price range
P7
Delivery Time
Applications/Examples of results
Dpak, compatible with high-quality high-power devices from To220 to To3p.
catalog（1）
Download All Catalogs
Company information
Since its founding in 1972, our company has upheld the management philosophy of "creativity, sincerity, and challenge." We have been committed to sincerely creating solutions for our customers' needs from their perspective, and at times, we have embraced challenges without fear of failure. With this policy, we have dedicated ourselves to the development of advanced production systems through company-wide efforts to refine our technology. As a result, we have grown into a reliable company with outstanding mechatronics technology and have contributed to the development of the industrial sector. Now, aiming to be a "company that continues to shine in the 21st century," all of our employees are challenging themselves to create and provide further advanced intellectual production systems from the customer's viewpoint and to contribute to society.