Ideal for handling all types of LED packages.
◆Minimize the space between the mount and preform, prevent changes over time, and reduce unnecessary movements. ◆Direct transport of substrates, support for workpiece thickness, support for large substrates (optional), and carrier compatibility. ◆Support for larger and modular lighting substrates, offering a variety of bonding patterns and recognition patterns. ◆Facilitate work data input to reduce changeover time. ~Changeover time: 60 minutes (hardware 15 minutes, setup 45 minutes)~
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basic information
It is a high-speed, high-precision die bonder compatible with the handling of all types of LED packages.
Price information
-
Price range
P7
Delivery Time
Applications/Examples of results
Support for LED package implementation.
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Company information
Since its founding in 1972, our company has upheld the management philosophy of "creativity, sincerity, and challenge." We have been committed to sincerely creating solutions for our customers' needs from their perspective, and at times, we have embraced challenges without fear of failure. With this policy, we have dedicated ourselves to the development of advanced production systems through company-wide efforts to refine our technology. As a result, we have grown into a reliable company with outstanding mechatronics technology and have contributed to the development of the industrial sector. Now, aiming to be a "company that continues to shine in the 21st century," all of our employees are challenging themselves to create and provide further advanced intellectual production systems from the customer's viewpoint and to contribute to society.
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