Plasma cleaner with a parallel plate method, optimal for cleaning bonding pads (improving bondability) and surface modification/hydrophilization (molding pretreatment).
G1000 / G500 is a system that utilizes the etching effect of gas plasma to clean the surface of objects under low-pressure conditions. By selecting the appropriate gas for your application (such as argon, oxygen, hydrogen + argon, etc.), it effectively removes not only organic but also inorganic contaminants. This system is ideal for improving bonding strength through the cleaning of bonding surfaces on HIC substrates and lead frames, as well as enhancing wettability through surface modification (hydrophilization).
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basic information
- Plasma irradiation on the surface of the cleaning target without unevenness using a parallel plate chamber. - Depending on the cleaning target, you can choose from five different plasma modes with varying intensities, such as electron-free plasma and active plasma. - Up to 12 different cleaning conditions can be stored in memory. - Easy recipe setting and operation can be performed via the touch panel on the front of the device. - Low-frequency plasma at 40 kHz efficiently irradiates compared to high frequency (13.56 MHz), resulting in less thermal stress on the workpiece. - You can select from three types of gases (argon, oxygen, hydrogen + argon, etc.), and with the optional mass flow controller, gas mixing and flow control can be managed by the CPU. - You can utilize five different plasma modes according to the target. ● For more details, please contact us.
Price information
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Applications/Examples of results
- Contamination and flux removal - Cleaning of the wire bonding surface - improvement of bonding strength - Improvement of surface hydrophilicity - die attach and mold pre-treatment - Surface tension control, etc.
Company information
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