Crystal defect analysis device (non-contact, non-destructive)
It is possible to measure without breaking the wafer.
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basic information
The crystal defect analysis device SIRM-300 is an optical measurement instrument capable of non-contact, non-destructive measurement of crystal defects. It allows for various bulk property analyses (such as oxygen, metal deposits, depletion layers, stacking faults, slip lines, and dislocations near the surface of bulk/semiconductor wafers).
Price information
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Applications/Examples of results
- Non-destructive, so no samples are wasted - Does not inquire about the condition of the wafer backside - Measurement of highly doped wafers is possible (for epi: 3mΩcm) - Particle detection limit: 20nm - Measurement of wafers up to 300mm is possible - Automatic wafer transport (edge grip handling) - Laser marking option
Company information
Semilab is a comprehensive measurement device manufacturer that supports research and manufacturing of cutting-edge technologies worldwide. We handle non-contact CV measurement devices, lifetime measurement devices, spectroscopic ellipsometers, photoluminescence, DLTS systems, sheet resistance measurement devices, nanoindenters, AFM, and more for the inspection of semiconductor wafers and devices. Please feel free to contact us for specifications and pricing of our devices.
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