Crystal Defect Measurement Device (Light Scattering Tomography)
Crystal defects in silicon wafers can be measured quickly.
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basic information
LST uses a CCD camera to measure the crystal defects in the cross-section of the cut wafer samples.
Price information
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Applications/Examples of results
- DZ evaluation from a single image - Measurement of concentration distribution along a high-speed wafer cross-section - Depth resolution: 0.5μm - Detection of particles within 0.5μm from the surface is possible - Fully automated operation (including wafer transport) - Maximum measurable wafer size: 12 inches - Full wafer cross-section diameter scan - Image size: 400μm x 2mm (measurement time: 40 seconds) - Measurement surface (cross-section) auto-focus
Company information
Semilab is a comprehensive measurement device manufacturer that supports research and manufacturing of cutting-edge technologies worldwide. We handle non-contact CV measurement devices, lifetime measurement devices, spectroscopic ellipsometers, photoluminescence, DLTS systems, sheet resistance measurement devices, nanoindenters, AFM, and more for the inspection of semiconductor wafers and devices. Please feel free to contact us for specifications and pricing of our devices.
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