Reliability design technology for automotive power modules and high durability using SiC devices.
S00821
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【Lecturer】 Masakuni Yamagiwa, Ph.D. EV System Development Department, EV Technology Development Division, Nissan Motor Co., Ltd. 【Venue】Kawasaki City Educational and Cultural Center, Room 1 【Date and Time】August 30, 2010 (Monday) 12:30 PM - 4:30 PM 【Capacity】30 people *Registration will close once full. Please apply early.
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[Lecture Summary] This presentation will explain the implementation structure and recent trends of power modules (PM), which are core components of EVs and HEVs, and will discuss future challenges in the reliability design of these modules. In the latter half, results of thermal fatigue reliability evaluations of high-temperature resistant implementation structures aimed at achieving ultra-compact PMs using SiC devices will be introduced. Throughout the presentation, the goal is to deepen understanding of the concepts of reliability design for automotive electronic components and reliability evaluation techniques aimed at high-temperature resistance, to aid in future product development.
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**Program** 1. Reliability Design Technology for Onboard Power Modules 1-1. Global Environmental Issues and Automobiles 1-2. Implementation Structure and Evolution of Onboard Power Modules (PM) 1-3. Reliability Design Methods for Onboard PMs and Future Challenges 2. Thermal Fatigue Reliability Evaluation Technology for SiC High-Temperature Structures 2-1. New Structures and Challenges of High-Temperature PMs 2-2. Challenge (1) - Evaluation Related to Stress Relaxation 2-3. Challenge (2) - Evaluation Related to the Lifespan of Joints 2-4. Challenge (3) - Material Strength Evaluation of Bonding Layers **Q&A and Business Card Exchange**
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