We will perform internal wiring modifications of semiconductors aimed at circuit changes with accuracy, speed, and short delivery times.
With FIB, we can implement wiring modifications for circuit corrections of ICs and LSIs. Specifically, we assist our customers in the development of ICs and LSIs through: - Cutting of wiring - Connecting of wiring - Creation of test pads for characteristic evaluation It has been about 30 years since we started this service, and we continuously improve our technology to achieve high yield with accuracy, speed, and short delivery times, receiving high praise from our customers. Additionally, FIB not only allows for cross-sectional observation but also offers TEM sample preparation using dicing and lift-out methods, boasting a strong track record. Please make use of Seiko Future Creation's FIB technology.
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basic information
【Features】 ○ We perform cutting, connecting, and the creation of test pads for evaluation of LSI and IC wiring using FIB. ○ We carry out processing of micro components, creation of test patterns for SPM evaluation, and preparation of samples for TEM observation. ● For more details, please contact us or download the catalog.
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Company information
Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.