Amazing peeling ability with high-pressure jets! Our unique special nozzle enables high-speed processing, high peeling power, and lift-off with low chemical consumption using sheet materials!
Physical and chemical W (double) effect lift-off! What is W effect lift-off? - Delamination using high-pressure jets (MAX 20MPa) with our unique special nozzle for physical force - Delamination using organic solvents such as NMP and DMSO for chemical force Additionally, it achieves high-speed processing, high delamination power, and high stability with sheet processing, while also reducing the amount of chemical solution used. It can also be used as a cleaning device for resist, polymers, and masks, capable of delaminating stubborn resist after thermal treatment or dry etching. Moreover, there is no re-adhesion of burrs or metals, which is a problem in DIP processing. This high-pressure jet lift-off device is suitable for patterning thick films that are difficult to etch, such as thick metal and oxide films. 【Features】 ■ Amazing delamination capability with W (double) effect lift-off! ■ Process stability with sheet-type processing ■ Removal of burrs during lift-off ■ No re-adhesion ■ Temperature-controlled chemical recycling system (optional) *For more details, please refer to the catalog or feel free to contact us.
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basic information
【Main Specifications】 ■ Wafer Size: Compatible with φ2" to φ8" ■ Expansion Function: Pipe heater or temperature control liquid via recycling ■ Chemicals Used: Various stripping liquids such as DMSO, NMP ■ Equipment Size: 1500×1100×1900 (when using 3 cups, main unit) ■ Transport Method: Double-arm clean robot (CLASS 1 compatible) ■ Fire Extinguisher System Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price information
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Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
VCSELs, LEDs, LDs, SAW filters, and MEMS are being adopted by various manufacturers.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
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