High-viscosity dedicated spin coater for thick film coating! Automatic polyimide coating device.
This is a high-viscosity dedicated spin coater that uniformly applies high-viscosity polyimide with a viscosity of around 10,000 cP. It also achieves material savings with a rotating cup-type chuck!
【Features】 - Control of the discharge amount of expensive liquid using a high-precision pump - Cup structure for uniform application (sealed type, rotating cup type) - Expertise in the process of spreading with a small amount - Optionally equipped with a cylinder-compatible dispenser for small-scale production - EBR (Edge Rinse) function, which is challenging with high-viscosity materials This is a device for spin coating high-viscosity polyimide. It is equipped with a pump suitable for high viscosity and a liquid temperature control system, ensuring uniform application of high-viscosity polyimide. To accommodate the usage and storage temperatures of polyimide, we also have a proven track record of dispenser-type spin coaters compatible with cylinders. The rotating cup-type spin coater, which enables reduction of application amount and uniform thick films, is recommended for expensive high-viscosity polyimide. *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■Cassette Stage: 2 sets ■Spin Coating Unit: 2 sets ■Wafer Size: Φ2" to Φ12" ■Resist Droplet Nozzle: 2 sets ■Bake Unit: 2 sets (Max 200℃) ■Cooling Unit: 1 set ■Centering Unit: 1 set ■Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! There are also lineups of manual and semi-automatic machines! *For more details, please refer to the PDF document or feel free to contact us.
Price information
We will provide you with the price according to the specifications.
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
It is used in the high-viscosity polyimide coating process essential for semiconductor processes (capable of handling high viscosities up to 10,000 cP). By using a sealed rotary cup, it is also possible to achieve a high uniformity of coating on irregular substrates such as V-grooved substrates, substrates with uneven surfaces, or angular substrates.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.