High-quality bumping service provided by our independently developed screen printing machine!
The pre-solder service [bumping service] utilizes printing machines and precision bumping machines developed in-house to form fine solder bumps on substrates. We have established an environment that allows for the provision of stable quality products by installing equipment in a clean room managed at Class 10,000. The main processes are as follows: 1. Micro bump formation through solder paste printing (Main achievements) - Formation of 150μm pitch bumps on organic substrates - Formation of 100μm pitch bumps on silicon wafers 2. Flux cleaning using water-based cleaning agents (Main achievements) - Flux cleaning of organic substrates/wafers after micro bump formation - Flux cleaning of automotive/medical substrates after component mounting 3. Flattening of micro bumps using precision press machines 4. Visual inspection of micro bumps 5. Foreign matter inspection using appearance inspection machines *For more details, please download the materials or contact us.
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basic information
−−−Features−−− ● Services utilizing unique know-how with original printing machines ● Efficient production achieved with state-of-the-art implementation equipment ● Production system established to meet customer needs 100%, from prototyping and small-batch production to short-term mass production ● Installation of humidity stabilization devices and air cleaners (Class 10,000)
Price information
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Delivery Time
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Applications/Examples of results
Pre-soldering service examples - Analog IC - Graphic memory - Microcontrollers (automotive-related) - Peripheral solder coating (pitch 70μm) - Wafers (4 to 12 inches), etc. Please feel free to consult us about anything.
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Company information
Our business consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. Our strength lies in providing one-stop services from assembly of printed circuit boards utilizing the features of our in-house developed solder paste printing machines to unit assembly and repair services for touch panels and display products. Additionally, we are capable of producing products certified under ISO9001, ISO14001, as well as ISO13485 for medical devices and UL standards. On the other hand, in the semiconductor related business, we have solved many customer challenges with our advanced printing technology and know-how. We are developing a business model where our main SMT related business and semiconductor related business are supported by the product development business from both software and hardware perspectives.
