A primary analysis solution with CAD and solver interface. Model creation and evaluation can be achieved with this one solution, and customization via API is also possible!
At Daiko Techno, we offer a variety of services related to analysis, including contract analysis and the dispatch of analysis engineers, as part of our CAE (Computer-Aided Engineering) services.
Accurate fatigue strength evaluation under actual load conditions.
Low Cycle Thermal Fatigue (TMF) Analysis Due to Temperature Cycle Load
You can perform structural analysis, heat transfer analysis, and lighting studies and analyses.
Detailed explanations with diagrams and tables! Includes shaft displacement diagrams related to gear loads.
Calculate the fatigue life and fatigue limit safety factor for repeated loads and alternating loads.
Practical element division (shell elements) & evaluation method of SolidWELD
Using the script function of VOXELCON! Here is an example of evaluating its physical properties through homogenization analysis.
Detailed explanations of examples of shape optimization that aligns the natural frequency with experimental measurement results, and examples of topology optimization that consider manufacturing requirements, using diagrams and tables!
Full of hints for solving problems such as weight reduction, strength enhancement, and cost reduction. Valuable user case presentations utilizing CAE software for structural optimization.
It has been demonstrated that it is possible to examine the acceleration occurring in buildings and the damage to the buildings!
Integration of implicit and explicit methods. For elucidating a wide range of phenomena such as heat, electricity, magnetic fields, and fluids.
High-performance computing for 'AlphaFold3' to accurately predict the structure and interactions of complex molecules.
From heat conduction analysis due to mass concrete placement to temperature stress analysis. We will introduce examples of the use of the structural analysis software 'ISCEF', which is suitable for large-scale structures.
[Energy-saving, space-saving, yield improvement] Proposing a heating device that improves the manufacturing process of electronic components such as semiconductors and sensors with our unique uniform heating technology. *Thermal analysis materials available upon request.




































































































