High-precision alignment (within 1μm of the target) is now possible in all directions of X-Y-Z-θx-θy-θz.
Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.
A research membrane environment that aims to eliminate oxygen and moisture! Supports multilayer membranes, compound membranes, and reactive membranes!
Production ion beam milling equipment that achieves high rate and high reliability.
A composition distribution with several hundred conditions is formed on a single substrate. The effective film formation area is an equilateral triangle with a side length of 25 mm.
Equipped with two connection ports for sputtering devices and PLD devices! Samples can be transferred to each sample holder.
From discrete components to advanced devices, from R&D to mass production. A compact, high-quality, multi-purpose CtoC type sputtering system.
Expansion to advanced packages: Processing is possible on a 510×515mm substrate.
Introducing a case study of a sputtering device capable of automatically creating multilayer films!
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodate various research applications.
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodate various research applications.
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environment.
A book that I want to have on hand!
Providing mass production solutions for high-speed and flexible substrate film deposition applications!
Electrode formation processes and mounting processes for various devices such as LEDs, LDs, and FETs are possible.
Customizable to fit experimental purposes. Small RF sputtering device.
Equipped with three sources of cathodes in a compact tabletop size. It is also possible to produce insulating thin films, oxide, and nitride thin films.
Equipped with a simple yet φ3-inch target magnetron cathode and a wide-range turbo molecular pump with a capacity of 200 L/s.
Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.
Currently responding to sample tests, developing films and metal foils for flexible devices and advanced functional materials, and supporting mass production. Process support with demo equipment.
Conductive carbon thin films are formed by sputtering. Stable film formation is achieved through a simple process with inert gas and carbon target at low temperatures (below 400°C).
Achieving space-saving! A sputtering device optimal for the formation of alloy films and stacked films through simultaneous discharge.
The ULT roll-to-roll web cleaner device stably removes dust even at a converting production line speed of 300m/min.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.
Polycrystalline silicon is used as a raw material for the semiconductor industry and the solar cell industry (PV). Material: Nickel alloy Process: Filter
The electron backscatter diffraction method (EBSD) is useful for evaluating the performance of aluminum sputter films and selecting substrate materials.
We will give you a free copy of "Thin Film Q&A," which summarizes the differences and characteristics of various coating methods, coating examples, and frequently asked questions!
Custom production is possible according to application from single item prototypes! Lineup includes "EB Gun" and "K Cell"!
Easy discharge operation! Compact design with automatic matching for RF power supply.
Rich experience in processing various materials and substrates! Effective sputtering technology for mold prevention as well.
Suppress the growth of bacteria/viruses with metals/alloys! Sputtering processing on fibers is possible.
Substrate × Film = Optical adjustment, conductivity, antibacterial/antiviral! Exhibits heat insulation and thermal retention effects.
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
From site surveys to design and construction, experienced engineers will handle it!
Developed for the purpose of achieving high uniformity and excellent reproducibility in the deposition of optical multilayer films!
FHR Star.100-Tetra Co is a very compact sputtering device designed for MEMS and high-performance optical products.
Remote source ion beam sputtering device manufacturer for remote plasma sources.
We will extend the life of your equipment with bolt-on and coupler-on solutions.
Effective area of a 25mm side triangle! It forms a composition distribution of hundreds of conditions on a single substrate.
There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.
DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.
Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond conventional levels!
No damage to the substrate! A vacuum deposition device capable of ultra-low temperature sputtering.
Multi-functional, compact, flexible support, a standard lineup with proven results and trust.
A batch-type sputtering device equipped with four substrate holders for φ410 substrates, achieving excellent film thickness uniformity within ±5% in the same substrate holder.
Coating Sakurajima lava with the latest plasma technology. Naturally derived functional surface treatment. Achieving new functions such as various vegetation and hydrophilicity for all types of equipment.
A multipurpose sputtering device specialized for surface treatment of three-dimensional shaped parts, the entire outer surface, both sides of flat substrates, and film formation on three-dimensional shapes. It is also suitable for film formation on the inner surface of tumblers.
We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!
Space-saving and large capacity! Custom-made options are also available to meet various requests!
A high-precision sputtering device that contributes to wiring formation.
This is a completely oil-free and contamination-free aluminum foil that can be used in clean rooms and vacuum chambers.
【 Campaign for surpassing 4,000 units sold is underway 】 Our transfer rods use a magnetic system and are suitable for use in ultra-high vacuum environments.
It is a backing plate used in a film-forming device.
Aluminum processing, anodizing treatment, Osaka [Leave cost reduction to Philir Co., Ltd.]
Aluminum cutting / A5052 / Lathe processing / Osaka [Leave cost reduction to Firiru Co., Ltd.]
CNC lathe processing, aluminum precision cutting, semiconductor manufacturing equipment parts [Leave cost reduction to Philir Co., Ltd.]
We are widely introducing vacuum device support and vacuum process products.
A versatile vacuum deposition device that allows for flexible configuration changes like assembling blocks | Sputtering, resistance heating deposition, electron beam deposition, organic deposition.
Multi-purpose vacuum deposition device for HEX system with 1-source and 4-source electron beam deposition sources.
Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling
This device can clean adhesive rolls during maintenance more quickly and efficiently, addressing a challenge that has troubled customers across various industries!
Supports work widths of 255, 350, 450, 550, 600, and 750 mm!
Vacuum components compatible with high vacuum and ultra-high vacuum.
Product Variety Vacuum Components - Adapter Series
Sapphire vacuum viewport welded using patented dissimilar material welding technology.
The installation direction can be freely set! Achieving maintenance-free operation with a long lifespan of 30 million rotations!
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
This processing requires a significant amount of positioning. We maintain a guarantee of ±0.05.
Development of new thin films using simultaneous three-source sputtering! Customizable according to experimental content and budget.
Shortest half-day estimate / We have accepted the production of equipment parts made of aluminum material.
Shortest half-day estimate / From metal parts to resin products, we introduce components related to semiconductor manufacturing equipment based on our track record!
We provide vacuum deposition equipment and related maintenance services.
Coating equipment for manufacturing functional films for Flexible Displays.
