High-precision alignment (within 1μm of the target) is now possible in all directions of X-Y-Z-θx-θy-θz.
We achieve film formation by freely controlling reactive sputtering and alloy sputtering.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
Reduce initial implementation costs and enable high performance through expansion! Upgrade according to the research stage.
Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.
Full automatic sputter coater with magnetron cathode to reduce ion damage.
Space-saving and large capacity! Custom-made options are also available to meet various requests!
Development of new thin films using simultaneous three-source sputtering! Customizable according to experimental content and budget.
Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environment.
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodate various research applications.
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodate various research applications.
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
From site surveys to design and construction, experienced engineers will handle it!
Rich experience in processing various materials and substrates! Electromagnetic wave shielding, static electricity prevention, surface heating elements, etc.
Equipped with three sources of cathodes in a compact tabletop size. It is also possible to produce insulating thin films, oxide, and nitride thin films.
This is a research and development sputtering device suitable for various film deposition applications, featuring high-level specifications and a wide range of options.
Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond conventional levels!
Various high-precision pressure sensors necessary for flow control in semiconductor manufacturing equipment. Customization of modules is also possible.
Would you like to introduce the pressure controller PACE for measurement testing/line inspection of semiconductor manufacturing equipment and MEMS pressure sensors?
Build a reliable system! Leave maintenance and modifications to us.
We have achievements such as 'sputtering equipment with GB for organic EL' and 'IBS equipment for research and development'!
We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
Achieving a substrate temperature of 900℃! Equipped with a 3-axis mechanism on the substrate stage to realize a uniform film thickness distribution.
Achieve high coverage in three-dimensional object film formation! Equipped with up to three sputter cathodes, it enables the layered deposition of metal films, oxide films, and more!
For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!
For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!
Powder agglomeration measures are possible! Custom-made solutions tailored to various requests can also be produced!
The substrate dimensions can accommodate up to 3 pieces with a maximum size of 3 inches! It is equipped with a heating mechanism and a reverse sputtering mechanism!
From discrete components to advanced devices, from R&D to mass production. A compact, high-quality, multi-purpose CtoC type sputtering system.
Multi-layer film deposition using a maximum of 5 yuan cathodes. Wear resistance, heat resistance, and smooth thin films. High throughput even for high-temperature deposition with a load lock type.
Expansion to advanced packages: Processing is possible on a 510×515mm substrate.
We also support contract film formation and on-site experiments based on customer-requested samples!
From surface modification to catalyst utilization! Introducing high-adhesion powder sputtering technology with examples of film formation!
We are widely introducing vacuum device support and vacuum process products.
Vacuum components compatible with high vacuum and ultra-high vacuum.
Sapphire vacuum viewport welded using patented dissimilar material welding technology.
Small film deposition device for experiments. It deposits films on materials such as PET.
This device can clean adhesive rolls during maintenance more quickly and efficiently, addressing a challenge that has troubled customers across various industries!
Supports work widths of 255, 350, 450, 550, 600, and 750 mm!
The ULT roll-to-roll web cleaner device stably removes dust even at a converting production line speed of 300m/min.
This processing requires a significant amount of positioning. We maintain a guarantee of ±0.05.
Using high-performance fabrics to prevent spatter, fire, and heat, also suitable for anti-splash applications!
Metal films and protective films can be deposited automatically on resin substrates!
A must-see for engineers considering new film formation methods! Fully automated film formation of metal films and protective films on resin substrates.
Coating equipment for manufacturing functional films for Flexible Displays.
A method of production that mounts a substrate in a single chamber.
Shortest half-day estimate / We have accepted the production of equipment parts made of aluminum material.
Polycrystalline silicon is used as a raw material for the semiconductor industry and the solar cell industry (PV). Material: Nickel alloy Process: Filter
■Advantages ・Custom-made to meet your requirements ・Uniform gas diffusion ・Standard connector elements
You are using SiC/Si composite materials as the target material.
We specialize in processing sizes from 500 to 1200 mm and can guarantee precision in the 1000s range. Please feel free to consult with us first.
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
A film formation technology with excellent reproducibility that utilizes high energy to forge the material itself!
We will give you a free copy of "Thin Film Q&A," which summarizes the differences and characteristics of various coating methods, coating examples, and frequently asked questions!
Compact design yet maintains performance! A sputtering device capable of substrate heating at high temperatures.
Experimental device equipped with an ion source, applicable for ultra-thin film multilayer deposition in precision optics.
It is an ion beam sputtering (IBS) device that uses an RF ion source and is equipped with a single stage or planetary stage.
We offer assembly services mainly related to the installation, assembly, modification, and maintenance of semiconductor manufacturing equipment.
Easy discharge operation! Compact design with automatic matching for RF power supply.
Leave the manufacturing of semiconductor sputtering targets to us.
Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.
Providing mass production solutions for high-speed and flexible substrate film deposition applications!
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.
Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.
Various antibacterial/antiviral treatments, anti-mold, etc.! Sputtering processing on fibers and films.
Rich experience in processing various materials and substrates! Effective sputtering technology for mold prevention as well.
Suppress the growth of bacteria/viruses with metals/alloys! Sputtering processing on fibers is possible.
Substrate × Film = Optical adjustment, conductivity, antibacterial/antiviral! Exhibits heat insulation and thermal retention effects.
Difficult materials, various substrate shapes, and applications! Capable of accommodating a very wide range of substrate sizes.
DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!
Ion beam sputtering equipment for research and development as well as small-scale production!
For engineers in the wear-resistant coating industry! Precise control of film stress.