Equipped with three sources of cathodes in a compact tabletop size. It is also possible to produce insulating thin films, oxide, and nitride thin films.
From surface modification to catalyst utilization! Introducing high-adhesion powder sputtering technology with examples of film formation!
Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.
A film formation technology with excellent reproducibility that utilizes high energy to forge the material itself!
Compact design yet maintains performance! A sputtering device capable of substrate heating at high temperatures.
Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.
This is a research and development sputtering device suitable for various film deposition applications, featuring high-level specifications and a wide range of options.
Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!
There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
1-inch UHV-compatible sputter cathode with 2 sources! The load lock chamber can be expanded!
The substrate dimensions can accommodate up to 3 pieces with a maximum size of 3 inches! It is equipped with a heating mechanism and a reverse sputtering mechanism!
Electrode formation processes and mounting processes for various devices such as LEDs, LDs, and FETs are possible.
Developed for the purpose of achieving high uniformity and excellent reproducibility in the deposition of optical multilayer films!
The "FHR.Star.600-EOSS" is a high-performance magnetron sputtering device developed for precise optical filter film deposition.
Remote source ion beam sputtering device manufacturer for remote plasma sources.
Effective area of a 25mm side triangle! It forms a composition distribution of hundreds of conditions on a single substrate.
Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.
Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
From site surveys to design and construction, experienced engineers will handle it!
Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond conventional levels!
It is an optimal post-oxidation sputtering device for multilayer optical thin films.
Surface treatment device for sputtering ion gun
Development of new thin films using simultaneous three-source sputtering! Customizable according to experimental content and budget.
This device can clean adhesive rolls during maintenance more quickly and efficiently, addressing a challenge that has troubled customers across various industries!
The ULT roll-to-roll web cleaner device stably removes dust even at a converting production line speed of 300m/min.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodate various research applications.
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
Polycrystalline silicon is used as a raw material for the semiconductor industry and the solar cell industry (PV). Material: Nickel alloy Process: Filter
We propose value-added products with antibacterial and deodorizing properties through vacuum sputtering processing on fibers and films.
A high ion current helicon plasma ion source PVD module that achieves directional film formation and enables reactive sputtering.
High-throughput roll-to-roll sputtering equipment for the manufacture of FCCL (Flexible Copper Clad Laminate).
We will extend the life of your equipment with bolt-on and coupler-on solutions.
A composition distribution with several hundred conditions is formed on a single substrate. The effective film formation area is an equilateral triangle with a side length of 25 mm.
Equipped with a heater stage (1000°C)! Usable for various applications from the development process to mass production.
A new PVD device proposed by a company that knows Endura inside and out.
Rich experience in processing various materials and substrates! Electromagnetic wave shielding, static electricity prevention, surface heating elements, etc.
For engineers in the wear-resistant coating industry! Precise control of film stress.
Multilayer film formation of sputtered films and evaporated films.
Providing mass production solutions for high-speed and flexible substrate film deposition applications!
Fully automatic ion coater suitable for sample preparation for SEM.
This is an ion coater ideal for full coating of large samples. Models are available for sizes ranging from 4 to 8 inches.
This is a sheet-type sputtering device that achieves high-quality radio wave transmission films.
This is a completely oil-free and contamination-free aluminum foil that can be used in clean rooms and vacuum chambers.
Equipped with a simple yet φ3-inch target magnetron cathode and a wide-range turbo molecular pump with a capacity of 200 L/s.
Two models: manual batch type and simple load lock type. The simple load lock type enables the mass production process of compound semiconductors. Currently accommodating sample tests and equipment tours.
A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.
We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
Powder agglomeration measures are possible! Custom-made solutions tailored to various requests can also be produced!
From design to after-service of the equipment! We can offer various equipment proposals.
Support for the entire lifecycle from device design to after-sales service!
The compatible substrate can be processed up to a maximum of φ1 inch! Equipment equipped with a dual gas nozzle.
Components for single crystal growth and CVD that can handle SiC processes above 2000℃. Electrostatic chucks compatible with sputtering and ion implantation at high temperatures.
High-precision alignment (within 1μm of the target) is now possible in all directions of X-Y-Z-θx-θy-θz.
No need for pre-sputtering aimed at preventing oxidation films, allowing for a reduction in labor! This is a sputtering target that also minimizes cracking due to thermal expansion.
Resistance heating evaporation source for the multi-purpose vacuum deposition device HEX system.
Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling
Metal films and protective films can be deposited automatically on resin substrates!
Supports work widths of 255, 350, 450, 550, 600, and 750 mm!
Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.
Sapphire vacuum viewport welded using patented dissimilar material welding technology.
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environment.
Shortest half-day estimate / From metal parts to resin products, we introduce components related to semiconductor manufacturing equipment based on our track record!
We provide vacuum deposition equipment and related maintenance services.
Coating equipment for manufacturing functional films for Flexible Displays.
A method of production that mounts a substrate in a single chamber.
You are using SiC/Si composite materials as the target material.
The installation direction can be freely set! Achieving maintenance-free operation with a long lifespan of 30 million rotations!
We will introduce energy semiconductor device research and development systems compatible with φ4-inch substrates!
A book that I want to have on hand!
FHR Star.100-Tetra Co is a very compact sputtering device designed for MEMS and high-performance optical products.
High-performance, high-quality magnetron sputtering cathodes! Sales, repair, and maintenance services are also available.
Production ion beam milling equipment that achieves high rate and high reliability.
We achieve film formation by freely controlling reactive sputtering and alloy sputtering.
Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.
Suppress the growth of bacteria/viruses with metals/alloys! Sputtering processing on fibers is possible.
Solving the film quality control of ITO films.
Leave the manufacturing of semiconductor sputtering targets to us.
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
We offer assembly services mainly related to the installation, assembly, modification, and maintenance of semiconductor manufacturing equipment.
Inverted sputtering is also possible! Equipped with a 500W high-frequency power supply, it can deposit metals, oxides, insulators, and more.
High-performance materials (tungsten and molybdenum) products from Plansee are available for purchase online. Sheets, rods, wires, vapor-deposited parts, heat sinks, and more.