This is a research and development sputtering device suitable for various film deposition applications, featuring high-level specifications and a wide range of options.
Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.
It is possible to operate and monitor voltage and current settings.
It is an ion beam sputtering (IBS) device that uses an RF ion source and is equipped with a single stage or planetary stage.
DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!
We will extend the life of your equipment with bolt-on and coupler-on solutions.
Introducing the ion beam sputtering device equipped with a maximum of 5 targets (220mm diameter) or 4 targets (300mm diameter)!
We have achievements such as 'sputtering equipment with GB for organic EL' and 'IBS equipment for research and development'!
Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.
High-precision alignment (within 1μm of the target) is now possible in all directions of X-Y-Z-θx-θy-θz.
A versatile vacuum deposition device that allows for flexible configuration changes like assembling blocks | Sputtering, resistance heating deposition, electron beam deposition, organic deposition.
Sapphire vacuum viewport welded using patented dissimilar material welding technology.
We specialize in processing sizes from 500 to 1200 mm and can guarantee precision in the 1000s range. Please feel free to consult with us first.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
Experimental device equipped with an ion source, applicable for ultra-thin film multilayer deposition in precision optics.
A book that I want to have on hand!
Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.
Leave the manufacturing of semiconductor sputtering targets to us.
Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.
Information on major suppliers! Sputtering target market and supply chain.
For engineers in the wear-resistant coating industry! Precise control of film stress.
The "FHR.Star.600-EOSS" is a high-performance magnetron sputtering device developed for precise optical filter film deposition.
Remote source ion beam sputtering device manufacturer for remote plasma sources.
Optimal solution for high-rate reactive film deposition production equipment.
A new PVD device proposed by a company that knows Endura inside and out.
Full automatic sputter coater with magnetron cathode to reduce ion damage.
This is a completely oil-free and contamination-free aluminum foil that can be used in clean rooms and vacuum chambers.
Build a reliable system! Leave maintenance and modifications to us.
We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
Achieving a substrate temperature of 900℃! Equipped with a 3-axis mechanism on the substrate stage to realize a uniform film thickness distribution.
Space-saving and large capacity! Custom-made options are also available to meet various requests!
We will introduce energy semiconductor device research and development systems compatible with φ4-inch substrates!
Currently responding to sample tests, developing films and metal foils for flexible devices and advanced functional materials, and supporting mass production. Process support with demo equipment.
There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.
DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.
A small sputtering device for research and development that allows for the exchange of substrates and targets in an inert gas atmosphere.
We also support contract film formation and on-site experiments based on customer-requested samples!
From surface modification to catalyst utilization! Introducing high-adhesion powder sputtering technology with examples of film formation!
High-precision and reliable metal seal model
Organic deposition source for the multipurpose vacuum deposition device HEX system.
This device can clean adhesive rolls during maintenance more quickly and efficiently, addressing a challenge that has troubled customers across various industries!
Supports work widths of 255, 350, 450, 550, 600, and 750 mm!
The ULT roll-to-roll web cleaner device stably removes dust even at a converting production line speed of 300m/min.
Vacuum components compatible with high vacuum and ultra-high vacuum.
Product Variety Vacuum Components - Adapter Series
Development of new thin films using simultaneous three-source sputtering! Customizable according to experimental content and budget.
Small film deposition device for experiments. It deposits films on materials such as PET.
Polycrystalline silicon is used as a raw material for the semiconductor industry and the solar cell industry (PV). Material: Nickel alloy Process: Filter
■Advantages ・Custom-made to meet your requirements ・Uniform gas diffusion ・Standard connector elements
You are using SiC/Si composite materials as the target material.
Shortest half-day estimate / We have accepted the production of equipment parts made of aluminum material.
Shortest half-day estimate / From metal parts to resin products, we introduce components related to semiconductor manufacturing equipment based on our track record!
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environment.
This processing requires a significant amount of positioning. We maintain a guarantee of ±0.05.
Using high-performance fabrics to prevent spatter, fire, and heat, also suitable for anti-splash applications!
Film thickness distribution: Achieved ±1.2% within the tray and ±1.5% between trays.
Metal films and protective films can be deposited automatically on resin substrates!
A must-see for engineers considering new film formation methods! Fully automated film formation of metal films and protective films on resin substrates.
We provide vacuum deposition equipment and related maintenance services.
Coating equipment for manufacturing functional films for Flexible Displays.
The electron backscatter diffraction method (EBSD) is useful for evaluating the performance of aluminum sputter films and selecting substrate materials.
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodate various research applications.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodate various research applications.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
A film formation technology with excellent reproducibility that utilizes high energy to forge the material itself!
We will give you a free copy of "Thin Film Q&A," which summarizes the differences and characteristics of various coating methods, coating examples, and frequently asked questions!
Compact design yet maintains performance! A sputtering device capable of substrate heating at high temperatures.
Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.
Various antibacterial/antiviral treatments, anti-mold, etc.! Sputtering processing on fibers and films.
Rich experience in processing various materials and substrates! Effective sputtering technology for mold prevention as well.
Suppress the growth of bacteria/viruses with metals/alloys! Sputtering processing on fibers is possible.
Substrate × Film = Optical adjustment, conductivity, antibacterial/antiviral! Exhibits heat insulation and thermal retention effects.
Rich experience in processing various materials and substrates! Electromagnetic wave shielding, static electricity prevention, surface heating elements, etc.
Reduce initial implementation costs and enable high performance through expansion! Upgrade according to the research stage.
Easy discharge operation! Compact design with automatic matching for RF power supply.
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!