Combination of CVD chamber, deposition chamber, plasma cleaning chamber, etc. is also available! Many custom manufacturing achievements!
This is a completely oil-free and contamination-free aluminum foil that can be used in clean rooms and vacuum chambers.
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodate various research applications.
High-precision alignment (within 1μm of the target) is now possible in all directions of X-Y-Z-θx-θy-θz.
Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.
DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!
A research membrane environment that aims to eliminate oxygen and moisture! Supports multilayer membranes, compound membranes, and reactive membranes!
Substrate × Film = Optical adjustment, conductivity, antibacterial/antiviral! Exhibits heat insulation and thermal retention effects.
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
Surface treatment device - Scanning ion gun
Two models: manual batch type and simple load lock type. The simple load lock type enables the mass production process of compound semiconductors. Currently accommodating sample tests and equipment tours.
No need for pre-sputtering aimed at preventing oxidation films, allowing for a reduction in labor! This is a sputtering target that also minimizes cracking due to thermal expansion.
Supports work widths of 255, 350, 450, 550, 600, and 750 mm!
Film thickness distribution: Achieved ±1.2% within the tray and ±1.5% between trays.
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.
It is an ion beam sputtering (IBS) device that uses an RF ion source and is equipped with a single stage or planetary stage.
A book that I want to have on hand!
The substrate dimensions can accommodate up to 3 pieces with a maximum size of 3 inches! It is equipped with a heating mechanism and a reverse sputtering mechanism!
We will introduce energy semiconductor device research and development systems compatible with φ4-inch substrates!
Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.
Difficult materials, various substrate shapes, and applications! Capable of accommodating a very wide range of substrate sizes.
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.
We propose value-added products with antibacterial and deodorizing properties through vacuum sputtering processing on fibers and films.
Inverted sputtering is also possible! Equipped with a 500W high-frequency power supply, it can deposit metals, oxides, insulators, and more.
Equipped with three sources of cathodes in a compact tabletop size. It is also possible to produce insulating thin films, oxide, and nitride thin films.
Equipped with a simple yet φ3-inch target magnetron cathode and a wide-range turbo molecular pump with a capacity of 200 L/s.
Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.
A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.
Forming hydrogen-free DLC films (hydrogen content below 1%) with unique technology, exhibiting excellent tribological properties in oil, and compatible with conductive carbon thin films.
A multipurpose sputtering device specialized for surface treatment of three-dimensional shaped parts, the entire outer surface, both sides of flat substrates, and film formation on three-dimensional shapes. It is also suitable for film formation on the inner surface of tumblers.
We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
Achieving a substrate temperature of 900℃! Equipped with a 3-axis mechanism on the substrate stage to realize a uniform film thickness distribution.
Film formation completed without exposure to the atmosphere in full auto! ~Sample measurement in progress!~
DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.
We also support contract film formation and on-site experiments based on customer-requested samples!
Control of sputter pressure is possible with gas introduction and pressure control valves!
Multi-purpose vacuum deposition device HEX system RF & DC sputtering source
Vacuum components compatible with high vacuum and ultra-high vacuum.
Product Variety Vacuum Components - Adapter Series
Sapphire vacuum viewport welded using patented dissimilar material welding technology.
This device can clean adhesive rolls during maintenance more quickly and efficiently, addressing a challenge that has troubled customers across various industries!
The ULT roll-to-roll web cleaner device stably removes dust even at a converting production line speed of 300m/min.
Small film deposition device for experiments. It deposits films on materials such as PET.
Development of new thin films using simultaneous three-source sputtering! Customizable according to experimental content and budget.
This processing requires a significant amount of positioning. We maintain a guarantee of ±0.05.
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environment.
Coating equipment for manufacturing functional films for Flexible Displays.
A method of production that mounts a substrate in a single chamber.
Using high-performance fabrics to prevent spatter, fire, and heat, also suitable for anti-splash applications!
Shortest half-day estimate / We have accepted the production of equipment parts made of aluminum material.
Shortest half-day estimate / From metal parts to resin products, we introduce components related to semiconductor manufacturing equipment based on our track record!
Metal films and protective films can be deposited automatically on resin substrates!
A must-see for engineers considering new film formation methods! Fully automated film formation of metal films and protective films on resin substrates.
Polycrystalline silicon is used as a raw material for the semiconductor industry and the solar cell industry (PV). Material: Nickel alloy Process: Filter
■Advantages ・Custom-made to meet your requirements ・Uniform gas diffusion ・Standard connector elements
You are using SiC/Si composite materials as the target material.
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodate various research applications.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
A film formation technology with excellent reproducibility that utilizes high energy to forge the material itself!
We will give you a free copy of "Thin Film Q&A," which summarizes the differences and characteristics of various coating methods, coating examples, and frequently asked questions!
Compact design yet maintains performance! A sputtering device capable of substrate heating at high temperatures.
It is possible to operate and monitor voltage and current settings.
Experimental device equipped with an ion source, applicable for ultra-thin film multilayer deposition in precision optics.
It is an introduction device that transmits linear motion from the atmospheric side to samples and equipment in a vacuum.
Custom production is possible according to application from single item prototypes! Lineup includes "EB Gun" and "K Cell"!
A new PVD device proposed by a company that knows Endura inside and out.
Electrode formation processes and mounting processes for various devices such as LEDs, LDs, and FETs are possible.
Developed for the purpose of achieving high uniformity and excellent reproducibility in the deposition of optical multilayer films!
The "FHR.Star.600-EOSS" is a high-performance magnetron sputtering device developed for precise optical filter film deposition.