Cleaning and modification of fine patterns and the inner surfaces of tube shapes are possible! Cleaning and modification can be done without using solutions, achieving good environmental performance and low running costs.
Introducing a plasma cleaner that can be used under atmospheric pressure to remove fine dirt from the work surface!
Easily download, search, list, and output files of atomic spectrum data published by NIST.
The compound semiconductor wafers (GaAs, InP, GaP) are transported to a designated position non-contactly through manual operation.
Compatible with high aspect ratio TGV/TSV. The world's largest chamber size for ALD (1000mm□).
To the 'water-resistant resin,' the power to get wet. With the 'hydrophilization' of plastic, both decoration and adhesion change.
We will solve your concerns and questions regarding the plasma indicator!
Standardization of industrial PET and PI films, which are only available in fixed lengths, into small rolls and cut pieces! Ideal for prototyping and development purposes!
We sell various plasma devices, including low-pressure types that can accommodate a wide range of materials and atmospheric pressure types that can be installed inline.
Supports etching of fine patterns of metal films such as Al and Cr! Demo machines available! Facility tours and sample testing are currently being conducted.
The future of silicone rubber bonding that overturns common sense is here now. Achieving the strongest bond without adhesives.
Atmospheric pressure plasma device that achieves high processing capability at a low cost.
The precision wobble stick was developed for delicate operations within ultra-high vacuum chambers, minimizing the risk of damage to the equipment!
Cleaning the sample surface with + ions generated by plasma discharge.
Quality control of surface modification using atmospheric pressure plasma devices with various options.
By guiding plasma through numerous flexible ultra-thin tubes, plasma treatment of the bottom surfaces of uneven objects is possible.
Standardizing and normalizing industrial PET and PI films, which are only available in fixed lengths, into small rolls and cut products! Ideal for prototyping and development purposes!
It is now possible to continuously process metal foil composite materials, etc., in a roll-to-roll manner! Processing can be done with free design and shapes based on CAD data.
Solving adhesion issues in applications such as bonding, printing, and coating of olefin-based resins and elastomers!
Development, manufacturing, and sales of atmospheric pressure plasma devices with a cumulative record of over 1,200 units (2021)! Atmospheric pressure plasma devices capable of generating high-density plasma.
Tabletop plasma etching device capable of localized processing with unique spot plasma technology.
A plasma treatment device that allows surface treatment under atmospheric pressure. It activates various surfaces such as resin, metal, and glass, enhancing adhesion and coating adhesion!
Low-temperature film formation. High insulation, high barrier, uniformity!
The integrated power supply improves mobility. Due to its handheld design, it is also capable of partial treatment of large objects and plasma irradiation on three-dimensional items.
A curved trajectory that moves the plasma head along the curved surface of the substrate! Effective for improving wettability.
Many achievements with major Asian electronics manufacturers! We propose surface treatment in various fields!
High functionality and low price! Equipped with a touch panel full-auto coating feature, all performance has been powered up!
This is a foil with a hairline pattern on the surface created by using a hairline processed foil-based PET film.
Wide processing of flat materials and pre-treatment before painting! Introducing the applications of 'AP-4000R and AP-4000R Multi'.
Processable substrate size 550×650 mm. Achieves zero waste liquid and low running costs.
Widely used in fine anisotropic processing such as semiconductor, liquid crystal fine patterning, and DNA chip manufacturing.
Compatible with the processing of roll-type film substrates. Through vacuum plasma treatment, in addition to ashing and etching, surface modification treatment (functional group addition) is possible.
Introducing in a ranking format. Contributing to cost reduction and ECO, solving problems.
Industry's smallest size! Compact and low-cost tabletop plasma treatment device.
Plasma-assisted reactive film deposition is possible! It also supports options for integration.
Nitrogen nitrate aqueous solution as plant fertilizer! Technology to generate corona discharge in the liquid.
50% performance increase compared to conventional systems! Atmospheric pressure plasma device with low N2 consumption (approximately 45% reduction).
Eliminate surface damage and other issues by using atmospheric pressure and downstream plasma! By changing the type of added gas, surface functionalization molecules can be easily applied!
We will introduce energy semiconductor device research and development systems compatible with φ4-inch substrates!
Currently responding to sample tests, developing films and metal foils for flexible devices and advanced functional materials, and supporting mass production. Process support with demo equipment.
Supports automated mass production lines. Inline type, sheet type, and various types with flexible hardware configurations, all with a proven track record of high effectiveness of vacuum plasma in mass production lines.
A DLC film with high infrared transmittance is formed on both sides of the substrate at a high rate. Achieving next-generation IR coating with stable hard and advanced soft materials.
A plasma cleaning device with extensive experience in removing DLC films from aspherical lenses. An essential dry film removal device for the repair of high-value-added molds.
Dry formation of side electrodes for small electronic components (surface mount type). End face electrode deposition compatible with small components made possible by PVD (ion plating equipment).
Achieving high-density plasma with a simple mechanism. Compatible with substrates from wafers to 1 m². Damage-free etching of Si-based materials, metals, organic films, and various thin films.
H2 (Surface cleaning of various substrates using the reducing power of hydrogen plasma. Improved hydrophilicity and wettability due to the removal of surface oxide layers. A new surface cleaning technology using dry, room temperature treatment.)
"Advanced Visible Plasma" is recommended for processing three-dimensional objects and thick workpieces, such as 3D glass and PCBs.
Plasma-activated nitrogen-oxygen mixed gas is sprayed onto the substrate, instantly removing surface contaminants!
High-speed continuous processing of films, substrates, etc. is possible under atmospheric pressure! [Sample tests are currently being accepted!]
Introducing case studies of solutions using Openair-Plasma® in the automotive manufacturing industry.
It is now possible to achieve low-temperature DLC (Diamond-like carbon) thin film hard coatings with improved adhesion compared to conventional ta-C!
It is said to be difficult in ALD, but it is possible to form a powder film at low temperature (room temperature) and atmospheric pressure!
Multi-layer film formation enables the improvement of load-bearing capacity for low-temperature DLC (Diamond-like carbon) thin film hard coatings!
It can be safely applied to mirror-finished products and textured surfaces with minimal skin irritation from processing.
Converting and extruding to improve the surface energy of the film.
Powerful flame treatment with advanced control.
Vacuum plasma and corona treatment generator! Most important parameters can be controlled and adjusted!
Even in a small space overflowing with various items in a laboratory, it is possible to conduct genuine atmospheric pressure plasma tests! (For educational and research settings)
Directly acts on the surface of the target object, allowing for powerful treatment in a short time!
Surface modification, cleaning, hydrophilic treatment, and adhesion enhancement with excellent low-temperature charge damage-free! Pen-type atmospheric pressure plasma device!
No low temperature or charge damage! Simple atmospheric pressure plasma device with high processing performance for cleaning, surface modification, hydrophilization, and adhesion enhancement! Suitable for small batch laboratory applications.
[Nationwide Service Available] We can perform thermal spraying on a wide variety of parts! We provide careful support from proposal to thermal spraying, delivery, and aftercare in a consistent system.
It is optimal for the processes of CVD, etching, and surface modification.
Has numerous achievements in leading Asian companies.
Has numerous achievements in leading companies in Asia.
Has numerous achievements in leading Asian companies.
Compatible with 6-inch and 8-inch wafers! Plasma processing equipment using a parallel plate method.
Leveraging our manufacturing achievements in plasma devices, we offer plasma treatment tailored to your company's needs! We accommodate small lots and short delivery times!
CX coating possesses properties such as waterproofing, moisture resistance, insulation, and biocompatibility. It forms a thin, transparent film through room temperature processing. Let's protect medical and electronic components.
Atmospheric pressure plasma device that balances high processing capability and safety.
Low-temperature, electrically damage-free atmospheric pressure plasma device.
It is a sticker that easily visualizes plasma abilities through color changes.
Significant cost reduction, environmentally friendly Air model.
An atmospheric pressure plasma treatment device that enables stable plasma treatment at atmospheric pressure! The miniaturization of the device makes it easy to integrate into production lines!
A dense and efficient thermal spray coating can be obtained! The newly designed nozzle electrode achieves longer lifespan.
It is a coating device for tungsten thin films for electron microscopes.
A high-performance device that can accommodate all applications. Just one button press after adjustment, and you're good to go!
Complete integration of hydrophilic treatment, deposition equipment, and ion sputtering functions.
The metal-free type eliminates metals to the utmost extent, achieving a higher level of purity! Recommended for clean processes such as silicon semiconductor manufacturing!
It includes various factors such as the variation of the color difference meter and the variation of the equipment (processing) itself!
Color measurement was conducted using the Konica Minolta automatic scanning spectrophotometer FD-9, and color difference mapping was performed!
The color difference ΔE*ab increases! Even weak plasma treatment effects can be detected by the indicator.
It is possible to visualize whether the processing status is as intended with a simple change in tone!
The color difference ΔE*ab tends to increase under high-temperature conditions! We will introduce the color differences before and after processing for card-type and label-type products.
Production of thermal spray powders adjusted to the desired granularity! Achieving high adhesion efficiency while avoiding issues such as spitting. *Free explanatory materials on thermal spray powders.
We provide JIS standard non-compliant O-rings made of fluororubber for semiconductor, organic EL manufacturing equipment, vacuum chambers, and large tanks with a short delivery time. Large-diameter O-rings.
Nitriding of cutting tools is possible! We recommend composite hardening treatment using Atom nitriding and PVD coating!
Increased lifespan + enhanced functionality! Suitable for harsh applications such as pressing and cold forging!
Simultaneous processing of two wafers for high throughput. Contributes to reducing wafer transfer costs.
Freely operate with robots! Surface modification of hollow bottles and molded products with uneven surfaces is possible.
"Plami-α" is a compact and user-friendly atmospheric pressure plasma generation device. It can be easily used for surface modification and activation anytime, anywhere!
A set of 5 technical documents on surface treatment as a gift!
Contributes to reducing engineering costs and improving substrate quality! Enables high coating adhesion.
Formation of passivation films such as a-SiC:H (hard films) is possible! Surface decontamination using high-density plasma.
Damage-free with low-temperature treatment and electric field shielding structure! It is adopted in many production processes, including LCD factories.
Ideal for the optical film field! Achieves high uniformity and damage-free film (no particle generation)!