List of Electronic Components and Modules products

  • classification:Electronic Components and Modules

7711~7725 item / All 59483 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

  • small-mistcollector.png
  • air conditioning

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Designed for high-speed transmission data connections for advanced automotive systems such as cameras and telematics!

  • High speed FAKRA-Mini(HFM)高速通信2.png
  • High speed FAKRA-Mini(HFM)高速通信3.png
  • High speed FAKRA-Mini(HFM)高速通信4.png
  • High speed FAKRA-Mini(HFM)高速通信5.png
  • High speed FAKRA-Mini(HFM)高速通信6.png
  • Coaxial Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Supports high-precision noise cancellation that adapts in real-time and dynamically to driving conditions!

  • Sensors
  • Sensors
  • Other Sensors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

A high-speed solution that demonstrates SI performance up to 32Gbps and has a roadmap to 56Gbps!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Implementing an optimized direct-to-cable connector system to maximize system performance!

  • Board to Board Connectors
  • connector
  • connector

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Molex WEBセミナー.png

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Output through a 0.50mm SMT plug and thin cable assembly without going through the PCB!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Robust machine design consistently achieves stability and reliability through external fitting!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Integrate power circuits, ground circuits, and high-speed data connections into a single connector!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Improve the connection efficiency of various increasing in-vehicle devices such as cameras, radar, turn indicators, and mirror defrosters!

  • Board to Board Connectors
  • connector
  • connector

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Molex WEBセミナー.png

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Adopting modular design! It is possible to configure and provide multiple patterns of form factors.

  • Board to Board Connectors
  • connector
  • connector

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Molex WEBセミナー.png

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

From resin molding to finished electronic products, we select the optimal factory for OEM/EMS support.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Other contract services

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Repeating accuracy of ±0.1μm. Contributes to attitude control for aerospace applications.

  • switch
  • magnet

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Cable length is 8cm! Effectively utilize power supplies without EPS12V 8-pin connectors.

  • cable

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Introducing an extension cable that is entirely black and unobtrusive, perfect for illuminated PCs!

  • 19-2.jpg
  • cable

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