List of Electronic Components and Modules products
- classification：Electronic Components and Modules
8446～8460 item / All 59425 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Add two-column products and expand multi-pole variations! Contribute to the improvement of signal integrity.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Enhance security and improve connection reliability! Compliant with industry standards for harsh environments.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieving secure fit retention, ensuring precise fitting! Strengthening the lock to enhance connection reliability.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
400G OpenZR+ QSFP-DD pluggable optical module! Supports transmission distance or reach.
- LAN/Optical cable
- cable
- Other cable related products
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Supports industry standards such as Ethernet, SONET/SDH, OTN/OTU3/OTU4!
- LAN/Optical cable
- cable
- Other cable related products
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Supports ergonomics and user-friendly interfaces!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieve up to 40% reduction in fitting force, minimizing operator fatigue and enhancing productivity!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Ensure that the connected connector does not accidentally come off! Improve the board's holding power.
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
The polarized mating shape ensures that the header and receptacle cannot be mismatched!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Reduce operator fatigue and improve assembly compliance in high-circuit applications!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieving space efficiency, appropriate current paths, enhanced robustness, and reliability!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Easy to set up! This is a compact temperature controller with a clear digital display! The sensor can be switched between thermistor, platinum resistance, and K-type thermocouple!
- Temperature and Humidity Control
- Circuit board design and manufacturing
- EMS
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.
Measure and control humidity with high precision! Digital humidity controller with easy-to-read display and compact design. You can choose between a wet and dry bulb sensor or a polymer sensor!
- Temperature and Humidity Control
- Circuit board design and manufacturing
- EMS
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.
![[Column] What are the differences b...](https://image.mono.ipros.com/public/product/image/6b8/2001535678/IPROS1430206403468514082.jpg?w=280&h=280){kind=small}
What is the difference between circuit design and mechanical design? Introducing CAD software and features! Proven results in multiple fields. Leave electrical and electronic circuit and PCB design to...
- Circuit board design and manufacturing
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.
![[Column] What is Ethernet? Basic El...](https://image.mono.ipros.com/public/product/image/e20/2001535093/IPROS14170666787154618105.jpg?w=280&h=280){kind=small}
What is Ethernet? Introducing its basic elements, advantages, and challenges! Numerous achievements in various fields! Leave board and cloud system development to Nippo!
- LAN/Optical cable
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.