List of Electronic Components and Modules products
- classification：Electronic Components and Modules
9226～9240 item / All 60815 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
This is a narrow linewidth CW laser using an in-house developed fiber DFB module.
- Laser Components
- Amplifier
- others
It is a narrow linewidth CW laser using our in-house developed fiber DFB module.
- Laser Components
- Amplifier
- others
This is a narrow linewidth CW laser using an in-house developed fiber DFB module.
- Laser Components
- Amplifier
- others
This is a narrow linewidth CW laser using an in-house developed fiber DFB module.
- Laser Components
- Amplifier
- others
Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
- Wafer
Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.
- Wafer
- Taping Machine
Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We offer contract processing for hot melt molding sealing.
- Other polymer materials
- Coating Agent
- Other electronic parts
We will exhibit at the Monozukuri World Tokyo 2026.
Matsumoto Processing will exhibit at the Manufacturing World Tokyo 2026. On that day, we will showcase products that have adopted hot melt molding sealing both domestically and internationally. We sincerely look forward to your visit.
A substrate for data centers that achieves high insulation properties and miniaturization.
- Printed Circuit Board
- Circuit board design and manufacturing
Waterproof sealing of the implementation substrate. We achieve process improvement and cost reduction by switching from potting.
- Processing Contract
- Other electronic parts
- Coating Agent
Hot melt molding for waterproofing, dustproofing, and miniaturization of M2M/IOT sensors.
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received a significant number of inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing even delicate sensors. - Extensive waterproofing and dustproofing experience cultivated through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - The raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-batch sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.
- Other polymer materials
- Other electronic parts
- Coating Agent
【Sample Giveaway】We are offering free samples of products that apply hot melt molding, a waterproof sealing method for electrical components that replaces potting, to LED substrates.
"Free Sample Presentation Campaign" This time, we are offering free samples of our LED-equipped boards that have been completely sealed using hot melt molding to customers who request them. Please feel free to take a look at the actual product. "What is Hot Melt Molding?" It is a groundbreaking sealing method that provides excellent waterproofing, dustproofing, and insulation by injecting thermoplastic adhesive around electronic components. Since it solidifies within seconds in the mold, sealing is completed in a shorter time compared to traditional two-component potting and BMC molding. Additionally, the hot melt we handle is primarily made from natural fatty acids derived from grains, making it highly sustainable. Customers who wish to receive a sample, please do not hesitate to contact us.
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Examples of narrow-pitch MEMS mounting on flexible substrates and flexible circuit board implementations.
- Other electronic parts
Ideal for GDP-compliant data loggers and more! Supports quality control in food storage.
- Other temperature and humidity measuring instruments
- Sensors
Pocket-sized transceiver with a slim and lightweight body weighing 83g.
- Other network tools
- AC adapter
Supports a variety of circuit configurations and a wide range of current ratings.
- diode
Supports a variety of circuit configurations and a wide range of current ratings.
- diode