List of Electronic Components and Modules products
- classification：Electronic Components and Modules
8101～8145 item / All 59200 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Utilizing mechatronics and optical technology to change future lifestyles and propose new value creation in the market.
- lens
Consistent support available! We can perform high-precision mold making and precise molding.
- lens
- Mold Design
Aluminum extruded heat sink with a width of 37mm and a height of 6mm - available in various lengths.
- Other semiconductors
Calibrate the CO2 sensor on-site! Easy operation with one push.
- Sensors
49.5 inches, high resolution 1920x540, high brightness 1500 nits, open frame, supports wide viewing angles, ultra-wide monitor
- LCD display
![[Noise Countermeasures] Catalog of ...](https://image.mono.ipros.com/public/product/image/aa0/2000545346/IPROS96049939628317437142.jpeg?w=280&h=280){kind=small}
If you are having trouble selecting for filtering, grounding, shielding, or thermal measures, please take a look! Comprehensive catalog now available.
- cable
- Other Connectors
- Wiring materials
The thermal insulation performance contributes to heat management for outdoor equipment.
- cable
- Other Connectors
- Wiring materials
Enhances the heat dissipation characteristics of the substrate, effective for thermal management inside the equipment.
- cable
- Other Connectors
- Wiring materials
Noise countermeasures for GPS bands (1.5GHz band) and EMS countermeasures for in-vehicle devices, as well as noise countermeasure components compatible with in-vehicle harnesses and high-speed communi...
- Other FA equipment
- others
- Ferrite Core
Waterproof connector that prevents the intrusion of oil, water, and dust from the power cord and cable entry points.
- Other Connectors
- Waterproof Connector
Rejitek, Mini LED adoption, supports local dimming, 240 zones, high brightness 1,500 cd/m², HDMI
- LCD display
Simplify cleaning and inspection! Provide exceptional signal integrity for high-performance applications.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
The cable side-exit design eliminates the need to consider the cable bending radius!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
A clock multiplier module that multiplies the input clock by N times and divides it by 1/D using a PLL to output the clock!
- Other electronic parts
Development of high-speed transmission networks is possible! Available with various optical interfaces.
- LAN/Optical cable
- cable
- Other cable related products
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
End-to-end solutions including cages, connectors, optics, and cable assemblies!
- LAN/Optical cable
- cable
- Other cable related products
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Introducing a preamplifier with a high-pass filter at 50kHz, a low-pass filter at 1MHz, a gain of 30dB, and a maximum input of 2Vp-p!
- Amplifier
It supports double crimping, enhancing connection stability and alleviating excessive tension!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Introducing a preamplifier with a BPF of 40kHz, GAIN of 30dB, and an output connector of BNC!
- Amplifier
Low-cost zoom expander with a wide range of lineup.
- Optical Components
- Laser Components
Unlocking the future of EV batteries—Deep dive into dry electrodes and dipole structures!
- Lithium-ion battery
- Technical and Reference Books
5/14 Webinar on Performance Degradation and Lifetime Evaluation of General-purpose Lithium-ion Batteries
■Title: "Performance, Degradation, and Lifetime Evaluation of General-purpose Lithium-ion Batteries – Including Detailed Electrochemical Analysis of Each Electrode and Battery –" ――This practical content is useful for practitioners involved in research, design, quality evaluation, and reuse inspection, covering materials and characteristics of practical batteries, Li deposition evaluation methods, interface control, and safety measures. ■ Date and Time: May 14, 2026 (Thursday) 10:30 AM – 4:30 PM ■ Zoom Distribution (with materials) ■ Required Background Knowledge ・Basic knowledge of general chemistry, introduction to electrical and electronic engineering, thermodynamics, and kinetics ■ Knowledge Gained from the Seminar - Fundamental characteristics of battery reactions - Evaluation of charge and discharge characteristics - Various DC evaluation methods - AC impedance measurement methods - Characteristics of current general-purpose batteries - Performance degradation of batteries and its mechanisms - Evaluation methods for degradation level and lifetime prediction - Ensuring battery performance
Stable supply of high-purity silicon and Si-based materials in small lots.
- Ceramics
- Secondary Cells/Batteries
- Lithium-ion battery
Notice of Participation in the 14th [Osaka] High-Performance Plastics Exhibition
We will be exhibiting at the "14th High-Performance Plastics Exhibition" held at Intec Osaka. We will introduce various samples and properties of our carbon nanofibers (CNF) blended with different resins. We will display extruded rods made of PEEK blended with CNF and their processed products, allowing you to see the actual materials while discussing their properties and applications. Our conductive CNF (high dispersion) ALP-NK1 (550 W/mK) has also been added to our product lineup, and we will propose materials tailored to customer needs, starting with heat dissipation applications. Additionally, we will showcase flexible conductive paints with high stretchability and high conductivity blended with CNF. As a business model for our nanomaterials division, we offer sales of CNF powder and prototype sales of resin blends (pellets and liquid resins) according to customer requests. Furthermore, we will introduce various silicon materials, including silicon monoxide, which is gaining attention as electrode materials for high-capacity lithium-ion secondary batteries, as well as magnesium balls. We welcome various requests regarding compounds, alloys, purity, particle size, and shapes, so please feel free to visit our booth for consultations. We sincerely look forward to your visit.
Introducing Yamax's light diffusion printing for various purposes, such as wanting to blur the light source or to showcase it in a flashy and dazzling way!
- Nameplate
- Special labels, etc.
- Other optical parts
World's smallest class micro Raman spectroscopy sensor
- Sensors
Achieving FFC/FPC cable connections with high retention force! Meeting a wide range of application needs.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieves excellent visibility with touch functionality and clarity! Suitable for creating a sophisticated modern interface.
- switch
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Protecting the contact and latch areas even in harsh environments!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Add two-column products and expand multi-pole variations! Contribute to the improvement of signal integrity.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Enhance security and improve connection reliability! Compliant with industry standards for harsh environments.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieving secure fit retention, ensuring precise fitting! Strengthening the lock to enhance connection reliability.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
400G OpenZR+ QSFP-DD pluggable optical module! Supports transmission distance or reach.
- LAN/Optical cable
- cable
- Other cable related products
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Supports industry standards such as Ethernet, SONET/SDH, OTN/OTU3/OTU4!
- LAN/Optical cable
- cable
- Other cable related products
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Supports ergonomics and user-friendly interfaces!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieve up to 40% reduction in fitting force, minimizing operator fatigue and enhancing productivity!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Ensure that the connected connector does not accidentally come off! Improve the board's holding power.
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
The polarized mating shape ensures that the header and receptacle cannot be mismatched!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Reduce operator fatigue and improve assembly compliance in high-circuit applications!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieving space efficiency, appropriate current paths, enhanced robustness, and reliability!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Easy to set up! This is a compact temperature controller with a clear digital display! The sensor can be switched between thermistor, platinum resistance, and K-type thermocouple!
- Temperature and Humidity Control
- Circuit board design and manufacturing
- EMS
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.
Measure and control humidity with high precision! Digital humidity controller with easy-to-read display and compact design. You can choose between a wet and dry bulb sensor or a polymer sensor!
- Temperature and Humidity Control
- Circuit board design and manufacturing
- EMS
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.
![[Column] What are the differences b...](https://image.mono.ipros.com/public/product/image/6b8/2001535678/IPROS1430206403468514082.jpg?w=280&h=280){kind=small}
What is the difference between circuit design and mechanical design? Introducing CAD software and features! Proven results in multiple fields. Leave electrical and electronic circuit and PCB design to...
- Circuit board design and manufacturing
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.
![[Column] What is Ethernet? Basic El...](https://image.mono.ipros.com/public/product/image/e20/2001535093/IPROS14170666787154618105.jpg?w=280&h=280){kind=small}
What is Ethernet? Introducing its basic elements, advantages, and challenges! Numerous achievements in various fields! Leave board and cloud system development to Nippo!
- LAN/Optical cable
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.
![[Column] What is EMS? About its adv...](https://image.mono.ipros.com/public/product/image/189/2001530459/IPROS18203834724129885709.jpg?w=280&h=280){kind=small}
What is EMS? Introducing the advantages and disadvantages! Proven results in various fields! Leave electronic device production outsourcing to Nippo!
- EMS
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.
![[Column] What is Etching? Explanati...](https://image.mono.ipros.com/public/product/image/948/2001529832/IPROS16998071210162207079.jpg?w=280&h=280){kind=small}
What is etching? We will explain two types of methods along with their advantages and disadvantages! / Leave the design of electrical and electronic circuits, as well as printed circuit boards, to Nip...
- Other semiconductors
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.
![[Column] What is EMC Countermeasure...](https://image.mono.ipros.com/public/product/image/52c/2001528700/IPROS3227903740962236247.jpg?w=280&h=280){kind=small}
What is EMC (Noise Countermeasures)? Introducing necessary components and basic knowledge! Proven results in various fields!＼For hardware development that is resistant to noise and static electricity,...
- EMC countermeasure products
We will be exhibiting at the 40th Nepcon Japan <Electronics Development and Implementation Exhibition>!
East Hall: 6 Booth Number [E26-40] Our company provides comprehensive support from circuit board design and development to implementation. We are also capable of designing enclosures and building IoT cloud systems. Additionally, we apply moisture-proof treatment to all circuit boards, ensuring quality that can be safely used even in demanding environments such as agricultural sites. At the venue, we will introduce our technologies and strengths while you view actual circuit boards and cloud screens. We sincerely look forward to your visit.