List of Design and production support products
- classification：Design and production support
1651～1665 item / All 12579 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Streamline mold design and manufacturing on a single platform!
- 3D CAD
- Production Management System
- Software (middle, driver, security, etc.)
Streamline parts management and accelerate innovation!
- 3D CAD
- Production Management System
- Software (middle, driver, security, etc.)
Accelerate the design verification of home appliances and promote innovation.
- 3D CAD
- Production Management System
- Software (middle, driver, security, etc.)
Shortening the trial period and supporting the development of high-quality medical devices.
- 3D CAD
- Production Management System
- Software (middle, driver, security, etc.)
Integrate BIM data to streamline construction projects!
- 3D CAD
- Production Management System
- Software (middle, driver, security, etc.)
Streamline shipbuilding project process management on a single platform!
- 3D CAD
- Production Management System
- Software (middle, driver, security, etc.)
A single platform that promotes quality improvement and innovation.
- 3D CAD
- Production Management System
- Software (middle, driver, security, etc.)
Improve design efficiency and accelerate innovation!
- 3D CAD
- Production Management System
- Software (middle, driver, security, etc.)
Constructed a B-EMS model for PV and batteries in MATLAB/Simulink. Visualized the power reduction effects.
- Secondary Cells/Batteries
- Other energy equipment
- Contract Analysis
Digital proofreading has no "oversights." It demonstrates its power in proofreading product packaging and manuals!
- Calibration and repair
- Document and Data Management
【Significant reduction in drawing labor】Automatically output 2D dimensions from 3D models and DXF files. We will develop a dedicated add-in that reflects your company's unique drawing rules.
- Other CAD related software
- Other CAD
Anyone can easily create 3D models! A modeling software that makes drafting even easier.
- others
- Modeler
![[Mechanical Design] Free 3D CAD Sem...](https://image.mono.ipros.com/public/product/image/af4/2001111270/IPROS9827962835130226206.jpg?w=280&h=280){kind=small}
<Free Participation> Experience the 3D CAD specialized in mechanical design, iCAD SX, online.
- 3D CAD
[Mechanical Design] Truly Usable 3D CAD! Online Experience Seminar
This is an experience seminar for iCAD SX, a 3D CAD specialized in mechanical design. To help you experience "truly usable 3D CAD" in practice, you will be able to operate through the entire flow from concept to detailing. Capacity: 3 people (a reassuring small group) Participation fee: Free Method of participation: Online (Cisco Webex Events) Invitation PDF: https://www.icad.jp/portal/dl/trysx-seminar.pdf For more details, please download the related catalog or click the black button "Details & Application" to check.
Because I design with CAD, the ideal style is maintained until the end.
- 3D CAD
Ultrasonic microscope observation of transistors! It is possible to check the peeling conditions at various locations even with the same focus.
- Contract Analysis
- Analysis Services
- Contract Analysis
Ultrasonic microscope observation of semiconductor packages
This is an introduction to the ultrasonic microscope observation of semiconductor packages conducted by our company. Due to storage conditions and mounting conditions, delamination may occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be detected through visual inspection. By using an ultrasonic microscope, we can clearly capture the internal structure of the package, contributing to reliability evaluation.