List of Embedded Systems products
- classification：Embedded Systems
196～210 item / All 12924 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Mini ITX embedded board equipped with Intel Atom E3900 series, Pentium, and Celeron SoC.
- Embedded Board Computers
Value Family 9th Generation Intel Core i7/i5/i3, 8th Generation Celeron Processor Equipped Embedded Fanless Computer
- Industrial PCs
- Embedded Board Computers
ADLINK accelerates the adoption of edge AI and computing with next-generation Matrix embedded computers.
ADLINK Technology today announced the release of the next-generation Matrix embedded computer, designed to enhance the responsiveness and durability of edge AI and computing applications. The next-generation Matrix series, engineered to boost performance, offers innovation and robustness to enable data-driven decision-making at the edge, achieving improvements in efficiency, productivity, and security across the industry. The next-generation Matrix series elevates system responsiveness to the next level with its heterogeneous computing architecture. The new Matrix series combines CPU computing based on the 9th generation Intel Xeon and Core processors with GPU computing from the NVIDIA Quadro Embedded GPU, accelerating compute-intensive high-resolution medical imaging and enabling faster and more accurate diagnoses.
Value Family 9th Generation Intel Xeon/Core i7/i5/i3 and 8th Generation Celeron Equipped Expandable Computer
- Industrial PCs
- Embedded Board Computers
ADLINK accelerates the adoption of edge AI and computing with next-generation Matrix embedded computers.
ADLINK Technology today announced the release of the next-generation Matrix embedded computer, designed to enhance the responsiveness and durability of edge AI and computing applications. The next-generation Matrix series, engineered to boost performance, offers innovation and robustness to enable data-driven decision-making at the edge, achieving improvements in efficiency, productivity, and security across the industry. The next-generation Matrix series elevates system responsiveness to the next level with its heterogeneous computing architecture. The new Matrix series combines CPU computing based on the 9th generation Intel Xeon and Core processors with GPU computing from the NVIDIA Quadro Embedded GPU, accelerating compute-intensive high-resolution medical imaging and enabling faster and more accurate diagnoses.
![CPU module "SMARC" [LEC-IMX8MP]](https://image.mono.ipros.com/public/product/image/79b/2000598940/IPROS31315477312969060387.jpeg?w=280&h=280){kind=small}
NXP i.MX 8MPlus equipped SMARC short-size module
- Embedded Board Computers
Accelerating secure IoT design with ADLINK's SoM and Atmark Techno Linux.
ADLINK Technology, a global leader in edge computing, has announced support for the Linux-based "Armadillo Base OS" (ABOS), developed by Atmark Techno and optimized for ADLINK's system-on-module (SoM). By combining ADLINK's high-density SoM with ABOS's embedded security features and long-term maintenance capabilities, IoT manufacturers can reduce development costs and shorten the time to market for secure IoT devices. Advancements in semiconductor technology have improved the performance of system-on-chip (SoC) devices, while also increasing the complexity of circuit board design. ADLINK's SoM integrates the processor, memory (including high-speed LPDDR4X/LPDDR5), and peripheral interfaces into a single module, simplifying carrier board design and reducing development effort.
Rugged 3U VPX processor blade equipped with 11th generation Intel Core i7, compliant with SOSA.
- Embedded Board Computers
ADLINK has formed a strategic partnership with Pixus Technologies to develop a highly integrated SOSA-compliant OpenVPX system solution for aerospace and defense applications.
●This strategic partnership leverages ADLINK's over 20 years of experience in robust embedded computing for mission-critical applications and Pixus's deep expertise in military-standard compliant designs for system backplanes and chassis platforms. ●Both companies will jointly develop a Proof of Concept (PoC) demo of OpenVPX compliant with SOSA and collaborate with global system integrators to develop advanced C4ISR applications. ●ADLINK's SOSA-compliant OpenVPX building blocks include the industry's first 3U VPX blade "VPX3-TL" equipped with an Intel Tiger Lake processor.
NVIDIA RTX A2000 built-in mobile PCI Express module
- Embedded Board Computers
ADLINK releases the first embedded MXM graphics module featuring the NVIDIA Ampere architecture for edge computing and AI.
● ADLINK's EGX-MXM-A1000, EGX-MXM-A2000, and EGX-MXM-A4500 are the first modules to adopt NVIDIA's embedded GPU based on the NVIDIA Ampere architecture. ● ADLINK's MXM graphics modules provide high-performance GPU acceleration in a compact and power-efficient MXM form factor, bringing edge computing and embedded AI to many vertical markets such as healthcare, manufacturing, and transportation. ● Robust design that withstands harsh temperature environments, shock, vibration, and corrosion under severe conditions.
NVIDIA RTX A4500 built-in mobile PCI Express module
- Embedded Board Computers
ADLINK releases the first embedded MXM graphics module featuring the NVIDIA Ampere architecture for edge computing and AI.
● ADLINK's EGX-MXM-A1000, EGX-MXM-A2000, and EGX-MXM-A4500 are the first modules to adopt NVIDIA's embedded GPU based on the NVIDIA Ampere architecture. ● ADLINK's MXM graphics modules provide high-performance GPU acceleration in a compact and power-efficient MXM form factor, bringing edge computing and embedded AI to many vertical markets such as healthcare, manufacturing, and transportation. ● Robust design that withstands harsh temperature environments, shock, vibration, and corrosion under severe conditions.
Value Family 12th Generation Intel Processor Equipped Embedded Expandable Computer
- Industrial PCs
- Embedded Board Computers
ADLINK's next-generation IPC will revolutionize industrial use cases at the edge with its scalable design and custom function modules.
●Unmatched Performance: Equipped with 12th/13th generation Intel Core i9/i7/i5/i3 processors, achieving class-leading performance. ●Ultimate Flexibility: Modular and scalable design that is easy to expand, with optional FM modules to meet domain-specific requirements. ●AI-Ready Edge Platform: With built-in GPU power and machine vision capabilities, the ADLINK MVP-5200/6200 can instantly deploy AI-enabled applications.
Mini-ITX embedded board equipped with 12th/13th/14th generation Intel Core desktop processors.
- Embedded Board Computers
3.5-inch single-board computer equipped with Intel N97 processor
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
![CPU module "SMARC" [LEC-IMX95]](https://image.mono.ipros.com/public/product/image/0c2/2001482197/IPROS41015035827848460144.png?w=280&h=280){kind=small}
NXP i.MX95 equipped SMARC 2.1 short-size module
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
ADLINK releases Intel Core Ultra COM-HPC Mini with powerful computing performance in a 95mm x 70mm form factor.
- Equipped with the Intel Core Ultra architecture featuring up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, offering both ultra power and energy efficiency. - 64GB of LPDDR5x memory is directly soldered onto the board, supporting maximum performance in a 95 x 70mm form factor, with an operating temperature range of -40°C to 85°C. - Integrated with up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, and multiple DDI/USB4 and USB 3.0/2.0 interfaces for abundant I/O options.
12th/13th/14th generation Intel Core i3/i5/i7/i9 equipped integrated embedded computer
- Industrial PCs
- Embedded Board Computers
Expandable embedded computer equipped with 12th/13th/14th generation Intel Core i3/i5/i7/i9.
- Industrial PCs
- Embedded Board Computers