List of Embedded Systems products
- classification：Embedded Systems
4186～4230 item / All 12806 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
USB Type-C equipped, the smallest and lightest in the series, a box computer the size of two business cards.
- Industrial PCs
- Embedded Board Computers
- controller
New release of the BX-U310 box computer, a compact PC the size of two business cards.
Contec has developed an ultra-compact, fanless embedded computer (the "BX-U310 series" with 8 models) equipped with the Intel Atom(R) Processor x6413E (Elkhart Lake), and will begin accepting orders on June 18, 2024. The new product is a fanless embedded computer featuring the Intel Atom(R) Processor x6413E. Despite its ultra-small design (110mm wide × 80mm deep × 45mm thick), it is equipped with expansion interfaces that can accommodate various applications. It includes HDMI ×1, USB 3.2 Gen 2 ×2, and LAN ×2, and there are also models with built-in wireless LAN, making it ideal for IoT gateway devices and edge computers that connect IT networks and field networks. Additionally, it incorporates many features aimed at industrial usability, such as a fanless wide temperature range design*1 and "Power Cut Protection(R)"*2 that supports operation without the need for shutdown during power interruptions. *1 -10 to +60℃ Airflow 0.7m/s *2 Only for models equipped with M.2 SSD
Requirements management and test verification management to ensure traceability and optimize the entire development process.
- Development support tools (ICE, emulators, debuggers, etc.)
- project management
Rapid and reliable large-scale optimization with the solver developed by Stanford Business Software.
- Software (middle, driver, security, etc.)
Next-generation LTE Cat 1 bis communication module SIM7672X series
- Communications
pronoDR has evolved further! Achieving high precision and intuitive VR reviews.
- Software (middle, driver, security, etc.)
Leave your 3D data utilization for manufacturing to Pronoharts.
- Software (middle, driver, security, etc.)
AAEON Industrial COM Express Module equipped with Intel Core Ultra series.
- Embedded Board Computers
AAEON Industrial COM Express Module with Intel Core Ultra Series【COM-MTHC6】
Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM×2 (up to 96GB) (sold separately) ● VGA switch DDI×1, LVDS colay eDP×1, DDI×2 ● USB 2.0×8, USB 3.2 Gen 2×4 ● PCIe [x1]×4, PCIe [x4]×1, PEG [x8] + [x4] + [x4] ● 2.5GbE×1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches × 3.75 inches (95mm × 95mm)
Flexible and open, safe, and ready to use! Dynamic content delivery that enhances the value of documents.
- Document and Data Management
- Software (middle, driver, security, etc.)
COM-HPC server type size D module equipped with Intel Xeon D-2700 processor (codename: Ice Lake-D)
- Embedded Board Computers
ADLINK releases edge server class COM-HPC server type and COM Express Type 7 module equipped with the latest Intel Xeon D processor.
- Two new modules for embedded and rugged applications equipped with Intel Xeon D processors (development codename: Ice Lake-D), featuring industrial-grade reliability and extended temperature ratings. - COM-HPC-sIDH server-type module - Express-ID7 Type 7 module - Integrates up to 8 x 10G or other configurations of high-speed Ethernet, combined with up to 32 PCIe Gen4 lanes, achieving instantaneous responsiveness and performance. - Equipped with Intel TCC, Deep Learning Boost (VNNI), and AVX-512, optimizing and accelerating AI performance, supporting TSN (Time Sensitive Networking) for precise control of hard real-time workloads across all devices on the network.
COM-HPC Client Size C module equipped with 13th generation Intel Core desktop processor.
- Embedded Board Computers
ADLINK's COM-HPC module equipped with the 13th generation Intel Core processor offers up to i9, 24 cores, and 36MB cache with a TDP of 65W - enabling innovation across industries with exceptional scalability, I/O bandwidth, and performance per watt.
●Here are the specifications for ADLINK's COM-HPC-cRLS client-type Size C module equipped with the 13th generation Intel Core processor: o Up to 13th generation Intel Core i9 processor, 16 Performance-Cores, 8 Efficient-Cores, and 32 threads o Up to 128GB DDR5 SODIMM at 4000MT/s, and 36MB cache (an increase of 6MB compared to previous models) o PCIe Gen5 x16, 2.5GbE LAN x 2 ●COM-HPC-cRLS supports Intel TCC and Time Sensitive Networking (TSN), making it suitable for hard real-time computing workloads required in applications such as industrial automation, semiconductor equipment testing, and AI robotics.
COM-HPC Server Size E module equipped with Ampere Altra SoC
- Embedded Board Computers
ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!
On November 7, 2024 (Thursday), the "Arm Tech Symposia Tokyo" will be held at the Tokyo Conference Center, Shinagawa. This event will feature keynote speeches, panel sessions, and breakout sessions by Arm executives and guest speakers, and ADLINK plans to showcase a variety of Arm-based products. 【Exhibited Products】 OSM Module【OSM-IMX93】 COM-HPC Module【COM-HPC-ALT】 SMARC Module【LEC-IMX95】 Development Kit【I-Pi SMARC IMX8MP】 Development Kit【I-Pi SMARC RB5】 Development Kit【I-Pi SMARC 1200】 IoT Gateway【MXA-200】 Ampere Altra Developer Platform【AADP】
Ampere Altra SoC-based COM-HPC Server Size E reference development platform
- Embedded Board Computers
ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!
On November 7, 2024 (Thursday), the "Arm Tech Symposia Tokyo" will be held at the Tokyo Conference Center, Shinagawa. This event will feature keynote speeches, panel sessions, and breakout sessions by Arm executives and guest speakers, and ADLINK plans to showcase a variety of Arm-based products. 【Exhibited Products】 OSM Module【OSM-IMX93】 COM-HPC Module【COM-HPC-ALT】 SMARC Module【LEC-IMX95】 Development Kit【I-Pi SMARC IMX8MP】 Development Kit【I-Pi SMARC RB5】 Development Kit【I-Pi SMARC 1200】 IoT Gateway【MXA-200】 Ampere Altra Developer Platform【AADP】
AAEON Mini-ITX standard industrial motherboard equipped with Intel Core Ultra5 125H, DC12V input.
- Embedded Board Computers
AAEON Mini-ITX Standard Industrial Motherboard with Intel Core Ultra5 125H, DC12V Input [MIX-MTLD1]
Features ● Equipped with Intel Core Ultra 5 125H ● Dual Channel DDR5 5600MHz × 2 slots (up to 96GB) (sold separately) ● HDMI 2.0 × 4 ● M.2 3042/3052 B-Key × 1, 2230 E-Key × 1, 2280 M-Key × 1 (PCIe Gen4 [x4], NVMe) (sold separately) ● USB 2.0 × 5, USB 3.2 × 3, USB 3.2 Gen 1 (Type-C) × 1 ● LAN × 2 ● 12V DC input power ● OOB (Out-of-Band Management) module compatible: MOD-RMB (via i210-AT) * This model does not include memory, storage, or OS.
AAEON EPIC standard industrial CPU board compatible with 12th/13th/14th generation Intel Core processors, supporting DC power supply.
- Embedded Board Computers
It is suitable for applications that require short delivery times because it has low development costs and can shorten the development period!
- Embedded Board Computers