List of For Techies products

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It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

  • Sensors

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We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

  • Other semiconductors
  • Processing Contract
  • Wafer

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Explanation of the transition to ISO 14001:2026 certification by industry (manufacturing / civil engineering and construction / service industry). Learn the key points for practical implementation!

  • ISO certification body
  • Management Seminar
  • Distance learning/E-learning

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Efficiency improvement with high-frequency dielectric heating and microwave heating.

  • Technical and Reference Books

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Notice of Participation in the 36th West Japan Food Industry Creation Exhibition '26 (May 20, 2026 (Wed) - May 22 (Fri))

Yamamoto Vinita will be exhibiting at the "36th Western Japan Food Industry Creation Exhibition '26" held at Tokyo Big Sight. Booth Number: West 4 Hall, Booth No. W4-39-05 *Exhibited Equipment: High-Frequency Rapid Thawing Device TEMPERTRON-VI Type - Thawing of beef, pork, chicken, vegetables, seafood, etc. - Heating and melting of dairy products such as butter, margarine, and chocolate - Achieves automation and labor-saving through rapid thawing. - This device can effectively heat even thick raw materials to the center. On the day of the event, we will also have a consultation desk for specific inquiries regarding thawing, heating, drying, and sterilization using radio waves (high frequency and microwaves). [Reasons for Improvement with High-Frequency Thawing] - Automation and line integration from raw material thawing to product completion on the day. - Thawing and heating in a short time frame of 20 to 30 minutes. - Reduction of personnel through automation of thawing and continuous thawing processes. - Ensuring thorough thawing of the center (uniform thawing quality) (elimination of surface drip loss). - Thawing without using water (reduction of water usage) (improvement of hygiene) (improvement of labor environment). - Elimination of excessive thawing (eradication of refreezing: reduction of food waste: thawing the necessary amount at the necessary time). Various companies have achieved improvements in their issues.

"From the concept of effectiveness audits to report writing, acquire practical skills through abundant exercises!" Product introduction

  • Technical Seminar

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Systematically learn APQP, PPAP, MSA, and SPC to strengthen quality creation and quality assurance capabilities!

  • ISO certification body
  • Technical Seminar
  • Other Auto Parts

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Take the first step towards transitioning to ISO 9001:2026 with this revision preparation seminar!

  • ISO certification body
  • Management Seminar
  • Distance learning/E-learning

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Take the first step towards transitioning to ISO 14001:2026 at this revision preparation seminar!

  • ISO certification body
  • Management Seminar
  • Distance learning/E-learning

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Understanding the revised requirements for the transition to ISO 9001:2026 is available in this revision standard seminar!

  • ISO certification body
  • Management Seminar
  • Distance learning/E-learning

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Understanding the revised requirements for the transition to ISO 14001:2026 is available in this revision standard seminar!

  • ISO certification body
  • Management Seminar
  • Distance learning/E-learning

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From water-based paint design to pigment dispersion, additive selection, and measures against appearance defects, systematically explaining practical technologies that are useful in the field.

  • paint
  • Lubricants and additives
  • Technical Seminar

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Transforming factory waste heat and environmental heat into new energy. An explanation of the forefront of low-temperature thermal resource utilization through heat absorption power generation and STC...

  • Other environmental measures and recycling
  • Heat exchanger
  • Technical Seminar

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Explaining recycling and biomass technologies that realize resource circulation of plastics and fibers, along with the latest regulations and market trends.

  • Other Energy Saving
  • plastic
  • Technical Seminar

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From the basics of optical semiconductor sensors to LiDAR, medical applications, and IoT applications, we explain the latest technologies and market trends directly related to commercialization.

  • Other semiconductors
  • Sensors
  • Technical Seminar

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Explaining the basic knowledge of photoresist essential for high-density packaging.

  • Printed Circuit Board
  • Other electronic parts
  • Technical and Reference Books

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Fundamental knowledge of photoresist essential for microstructure processing in MEMS.

  • Printed Circuit Board
  • Other electronic parts
  • Technical and Reference Books

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Basic knowledge of photoresists useful for manufacturing small actuators.

  • Printed Circuit Board
  • Other electronic parts
  • Technical and Reference Books

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Fundamental knowledge of photoresist essential for forming wiring patterns on printed circuit boards.

  • Printed Circuit Board
  • Other electronic parts
  • Technical and Reference Books

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An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.

  • Printed Circuit Board
  • Other electronic parts
  • Technical and Reference Books

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Measures against salt damage for ships! An explanation of the basics of electrodeposition coating.

  • Coating Agent
  • Technical and Reference Books

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Enhancing rust prevention for automobiles! Here is an explanation of the basics of electrocoating.

  • Coating Agent
  • Technical and Reference Books

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Basic knowledge of electrodeposition coating that contributes to the longevity of infrastructure facilities.

  • Coating Agent
  • Technical and Reference Books

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Basic knowledge of electrophoretic painting that helps ensure the insulation of OA machines.

  • Coating Agent
  • Technical and Reference Books

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Basic knowledge of electrodeposition coating to enhance the durability and aesthetics of stationery.

  • Coating Agent
  • Technical and Reference Books

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[Available for preview] ~ Chiplets, responding to 2.5D/3D high-density packaging ~

  • IPROS3391385136135994447_220x220.png
  • Technical and Reference Books

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[Book] Reducing CTE in Semiconductor Packaging and Warpage Countermeasures (No. 2367) [Available for preview]

~Chiplets, Responding to 2.5D/3D High-Density Packaging~ ◎ What are the key points for integrating materials with different thermal expansion coefficients and elastic moduli? ◎ A comprehensive overview of thermal stress countermeasures required in high thermal density environments and composite packages. ---------------------------- ■ Table of Contents Chapter 1: Development Trends of Element Technologies for Miniaturization and Integration of Semiconductor Packages Chapter 2: Development Trends of Filler Materials Enabling Improved Thermal Conductivity and Low Thermal Expansion Chapter 3: Development Trends of Negative Thermal Expansion Materials Chapter 4: Surface Treatment, Dispersion, and Filling Techniques for Fillers Chapter 5: Development Trends of Low Thermal Expansion Substrate Materials and Glass Substrates Chapter 6: Development of Semiconductor Encapsulation Materials and Stress Reduction Chapter 7: Development of Bonding Materials Chapter 8: Development Trends of Low CTE Resin Materials Chapter 9: Evaluation and Simulation Techniques in Semiconductor Packaging Materials ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4, 395 pages ● Authors: 33 ● ISBN: 978-4-86798-163-4 ----------------------------

[Available for preview] - High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions.

  • IPROS3391385136135994447_220x220.png
  • Technical and Reference Books

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[Book] Development of Polymer Materials through Materials Informatics (No. 2365) [Available for preview]

- High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions - ★ Explaining the key points for organizing all internal and external data such as molecular structures, images, spectra, and literature/patent information into a usable form for MI! ---------------------------- ■ Table of Contents Chapter 1: Materials Development, Structural Design, and Applications through Materials Informatics Chapter 2: Molecular Design and Reaction Analysis for Materials Development, Descriptorization of Compounds Chapter 3: Optimization of Formulation Conditions, Prediction of Composition Ratios, and Extraction of Reaction Factors Using Machine Learning and Simulation Chapter 4: Collection, Analysis, and Processing of Experimental and Measurement Data for Materials Development and Process Design Chapter 5: Introduction and Operation of Autonomous Experiments and Automation Technologies in Materials Development ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4 size, 425 pages ● Authors: 41 ● ISBN: 978-4-86798-162-7 ----------------------------

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