List of connector products
- classification：connector
751～765 item / All 4558 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Ideal for connector manufacturing! Compatible with thicknesses from t0.1mm to t12mm.
- Non-ferrous metals
- Spring
- Other Connectors
For semiconductor manufacturing tools that require high intensity and high precision. Quick delivery response.
- Other metal materials
- Non-ferrous metals
- Other Connectors
Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!
- Board to Board Connectors
Designed for high-speed transmission data connections for advanced automotive systems such as cameras and telematics!
- Coaxial Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
A high-speed solution that demonstrates SI performance up to 32Gbps and has a roadmap to 56Gbps!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Implementing an optimized direct-to-cable connector system to maximize system performance!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Output through a 0.50mm SMT plug and thin cable assembly without going through the PCB!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Robust machine design consistently achieves stability and reliability through external fitting!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Integrate power circuits, ground circuits, and high-speed data connections into a single connector!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Improve the connection efficiency of various increasing in-vehicle devices such as cameras, radar, turn indicators, and mirror defrosters!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Adopting modular design! It is possible to configure and provide multiple patterns of form factors.
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Ideal for situations where there is interference with small cases or other parts, especially when the area around the connector is narrow!
- Other Connectors
It is possible to achieve effective and low-cost design by combining various cable assembly processes!
- Other Connectors
With our self-managed overseas inspection system, we can flexibly respond to export requirements and international quality demands!
- Other Connectors
High strength and high reliability. An ideal beryllium copper alloy for semiconductor manufacturing fixtures.
- Non-ferrous metals
- Coaxial Connectors
- Other machine elements