List of connector products
- classification：connector
811～855 item / All 4618 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Ideal for connector manufacturing! Compatible with thicknesses from t0.1mm to t12mm.
- Non-ferrous metals
- Spring
- Other Connectors
For semiconductor manufacturing tools that require high intensity and high precision. Quick delivery response.
- Other metal materials
- Non-ferrous metals
- Other Connectors
Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!
- Board to Board Connectors
Designed for high-speed transmission data connections for advanced automotive systems such as cameras and telematics!
- Coaxial Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
A high-speed solution that demonstrates SI performance up to 32Gbps and has a roadmap to 56Gbps!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Implementing an optimized direct-to-cable connector system to maximize system performance!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Output through a 0.50mm SMT plug and thin cable assembly without going through the PCB!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Robust machine design consistently achieves stability and reliability through external fitting!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Integrate power circuits, ground circuits, and high-speed data connections into a single connector!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Improve the connection efficiency of various increasing in-vehicle devices such as cameras, radar, turn indicators, and mirror defrosters!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Adopting modular design! It is possible to configure and provide multiple patterns of form factors.
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Ideal for situations where there is interference with small cases or other parts, especially when the area around the connector is narrow!
- Other Connectors
It is possible to achieve effective and low-cost design by combining various cable assembly processes!
- Other Connectors
With our self-managed overseas inspection system, we can flexibly respond to export requirements and international quality demands!
- Other Connectors
High strength and high reliability. An ideal beryllium copper alloy for semiconductor manufacturing fixtures.
- Non-ferrous metals
- Coaxial Connectors
- Other machine elements
Perfect for aerospace applications! High strength and excellent wear resistance beryllium copper alloy.
- Non-ferrous metals
- Coaxial Connectors
- Other machine elements
Beryllium copper alloy is ideal for automotive connectors. It enhances reliability with high strength and high conductivity.
- Non-ferrous metals
- Coaxial Connectors
- Other machine elements
Ideal for mold inserts! High strength and high durability beryllium copper alloy.
- Non-ferrous metals
- Coaxial Connectors
- Other machine elements
Protects HDMI connectors and D-sub connectors from dust and water!
- Wiring materials
- cable
- Rectangular Connector
Contributing to implementation flexibility through diversification of design and miniaturization of products!
- Other Connectors
- connector
- connector
To fully realize the true value of beryllium copper, aging heat treatment is necessary. The products purchased from us will undergo heat treatment.
- Coaxial Connectors
- Non-ferrous metals
- socket
Contributing to your products with wash-resistant, multi-pole, and high connection reliability! Introducing connectors for smart clothing.
- Other Connectors
Using UL94 V-0 material with excellent flame retardancy! Connectors for automotive applications that meet high safety and reliability requirements.
- Automotive Connectors
Simultaneous transmission of power and data is possible! A new standard interface that is gaining popularity from industrial equipment to mobile devices.
- Other Connectors
- connector
Ensures high reliability with a 2-point contact structure! Increases the maximum operating temperature to 125°C, suitable for automotive applications.
- Board to Board Connectors
![[Data] USB Type-C/Power Delivery](https://image.mono.ipros.com/public/product/image/2108751/IPROS16270602871590416504.png?w=280&h=280){kind=small}
We also introduce related products such as USB PD adapters, USB Type-C cables, and USB Type-C connectors!
- Other Connectors
Assembled M12 connector for cable implementation
- Circular Connectors
- Waterproof Connector
- connector
Same Sky releases Cable Mount M12 Connector / CPM Series.
A new assembly-type M12 connector for cable implementation has been added to the lineup of Same Sky's round connectors. We offer a total of 14 series with variations such as male/female and solder terminal type/screw fastening type, accommodating 2 to 8 pins or 2 to 17 pins. All of our round connectors are IP67 waterproof, making them suitable for use in various industrial settings. Pin count: 2, 3, 4, 5, 8 pins (screw terminal type) / 2, 3, 4, 5, 8, 12, 17 pins (solder terminal type) Coding: A code / B code (5 pins) Rated voltage: 30 Vac to 250 Vac Rated current: 1.5 A to 4 A Shielding: Yes / No Mounting terminals: Screw terminal / Solder terminal Compatible cable diameter: Ø4~8 mm Round connector introduction page >> https://samesky.co.jp/SS-Products-connector-CircularConnector.html
Nick Bond NIC BOND 3000 series is the ideal adhesive for optical devices. NB 3000 Series for Opto.
- Optical Connector
- lens
- prism
![[Noise Countermeasures] Catalog of ...](https://image.mono.ipros.com/public/product/image/aa0/2000545346/IPROS96049939628317437142.jpeg?w=280&h=280){kind=small}
If you are having trouble selecting for filtering, grounding, shielding, or thermal measures, please take a look! Comprehensive catalog now available.
- cable
- Other Connectors
- Wiring materials
The thermal insulation performance contributes to heat management for outdoor equipment.
- cable
- Other Connectors
- Wiring materials
Enhances the heat dissipation characteristics of the substrate, effective for thermal management inside the equipment.
- cable
- Other Connectors
- Wiring materials
Simplify cleaning and inspection! Provide exceptional signal integrity for high-performance applications.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
The cable side-exit design eliminates the need to consider the cable bending radius!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
It supports double crimping, enhancing connection stability and alleviating excessive tension!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieving FFC/FPC cable connections with high retention force! Meeting a wide range of application needs.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Protecting the contact and latch areas even in harsh environments!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Add two-column products and expand multi-pole variations! Contribute to the improvement of signal integrity.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Enhance security and improve connection reliability! Compliant with industry standards for harsh environments.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieving secure fit retention, ensuring precise fitting! Strengthening the lock to enhance connection reliability.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Supports ergonomics and user-friendly interfaces!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Achieve up to 40% reduction in fitting force, minimizing operator fatigue and enhancing productivity!
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Ensure that the connected connector does not accidentally come off! Improve the board's holding power.
- Board to Cable Connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.