List of Electronic Components and Modules products

  • classification:Electronic Components and Modules

256~270 item / All 944 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

  • small-mistcollector.png
  • air conditioning

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Reduce fire risk! Portable power supply usable in cold regions down to -30°C.

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  • power supply
  • power supply
  • Cells and batteries

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[Available for Rent] A variety of charging ports that can accommodate various situations! Normal charging and discharging is possible even in cold environments at -30°C.

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  • power supply
  • power supply
  • Cells and batteries

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HID Corporation manufactures a wide variety of RFID tags ranging from UHF to LF bands and supports over 100 countries.

  • RFID/IC tags

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Ideal for medical devices such as medical equipment! We introduce a power supply that meets strict international standards.

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  • power supply
  • power supply
  • power supply

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For the development of devices that require clock functions! High precision, low power consumption, compact RTC (Real Time Clock) module.

  • Semiconductors and ICs

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Contributing to implementation flexibility through diversification of design and miniaturization of products!

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  • Other Connectors
  • connector
  • connector

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Enhance functionality and texture! It is possible to add design elements through customization.

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  • LCD display
  • FPD/Touch Panel

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Safe even in hazardous areas. TIIS explosion-proof RFID reader/writer.

  • RFID/IC tags
  • RFID related products and IC tag services
  • Other electric meters

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Ultra-high brightness and high luminous flux LED lighting! It emits strong light uniformly without any unevenness.

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  • LED lighting
  • LED fluorescent lamp
  • LED

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Introducing the mechanism of "silent degradation" that leads to the destruction of electronic devices without being noticed!

  • Other semiconductors
  • Other semiconductor manufacturing equipment
  • Semiconductors and ICs

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半導体の樹脂封止、その前に。絶縁性と接合強度を高める表面設計とは.png

Before the resin encapsulation of semiconductors." "A page has been added on 'Why did the 'Quiet Evolution' occur?'

"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.

A detailed explanation of specific approaches to surface treatment that are key to maximizing the quality of semiconductor resin encapsulation!

  • Other semiconductors
  • Other semiconductor manufacturing equipment
  • Semiconductors and ICs

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半導体の樹脂封止、その前に。絶縁性と接合強度を高める表面設計とは.png

Before the resin encapsulation of semiconductors." "A page has been added on 'Why did the 'Quiet Evolution' occur?'

"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.

Equipped with a palm rejection feature to prevent erroneous input! Available with or without a stand.

  • Touch Panel
  • FPD/Touch Panel

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December 17 (Wednesday) to 19 (Friday), 2025, held at Tokyo Big Sight!

  • Semiconductors and ICs

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The design that does not use busbars reduces the amount of silver paste used! This contributes to resource conservation and also addresses the risk of rising silver prices.

  • Cells and batteries

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