List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
991～1005 item / All 5126 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
100% focus on BATCHSPRAY technology! Significant reduction of water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
Remove resin residue after dry etching without using organic solvents!
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
It falls smoothly even with a slight slope! Measures against clogging, bridging, residue, and foreign matter contamination.
- Wafer processing/polishing equipment
- Other surface treatment equipment
- Surface treatment contract service
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Make effective use of the interior of the device while saving space.
- Other machine elements
- Food Packaging Machinery
- Other semiconductor manufacturing equipment
March 6, 2025 (Thursday) 16:00 - WEB Seminar [Safety Measures / Improving Work Efficiency] Case Studies on Solving Issues Around Doors and Covers
【Event Date and Time】 March 6, 2025 (Thursday) 16:00 - 16:45 *Participation is free. The capacity is 250 people (first come, first served). 【Highlights】 - We will introduce examples of how we solved customer challenges using our technology for lightly opening doors and lids or securely holding them in place, known as "Motion Design Tech." - Many mechanical components that contribute to safety measures and improved work efficiency will be showcased. Participants who respond to the survey after the seminar will receive a torque hinge!! *The torque hinge offered as a participation benefit is for illustration purposes. The actual product may differ in design and specifications. You can also check the details of the seminar on the registration page. We sincerely look forward to your participation.
There is a track record of adoption in semiconductor manufacturing equipment components. Contributes to weight reduction and strength improvement of products.
- Other semiconductor manufacturing equipment
Vertical diffusion furnace compatible with Φ300mm.
- Oxidation/Diffusion Device
Processing of GaN substrates is also possible! Introduction of contact annealing lamp annealing (RTP) equipment.
- Other semiconductor manufacturing equipment
Usable from R&D to mass production! Vertical furnace with automatic transport compatible with 3 to 6-inch wafers.
- Annealing furnace
Industry high-level high-resolution or high-throughput maskless laser direct writing equipment
- Electron beam lithography equipment
- Other surface treatment equipment
We flexibly respond to everything from software and hardware design to implementation and product assembly. "Yoho's adaptability" to the challenges of various manufacturers.
- EMS
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Capable of accommodating large circuit board assembly in 850×500mm size.
Supports large PCB assembly with a size of 850×500mm. [Precision] Chip size: 03015 Lead pitch: 0.3mm Adjacent pitch: 0.1mm [Supported Chips] BGA, CSP, QFN, SOP, QFP, LED, etc. [Supported Sizes] Minimum size: 50mm×50mm Maximum size: 500mm×850mm Board thickness: 0.5mm to 3.0mm
If you are troubled by contamination from waste and foreign substances after cleaning, NCC will provide solutions!
- Other machine tools
- Other production management systems
- Other semiconductor manufacturing equipment
For polishing various substrates and for fine burr removal in punched areas.
- Other machine tools
- Wafer processing/polishing equipment
- Special Processing Machinery
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Exhibiting at JIMTOF! Demonstrating tape grinding of ball screws and worms for electric vehicles! Also unveiling a newly developed outer diameter grinding machine and new technology for clogging preve...
- Wafer processing/polishing equipment