List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
361～390 item / All 5053 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Introducing a tool grinder for end mills with a diameter of φ4 to 20mm, specifically for sharpening cutting edges!
- drill
- Wafer processing/polishing equipment
Bottom blade 2, 3, 4 blade sharpening! The grinding wheel is a diamond #230 end mill sharpener specifically for carbide.
- drill
- Wafer processing/polishing equipment
A tabletop grinder that allows for easy re-sharpening of end mills without the need to send them out!
- drill
- Wafer processing/polishing equipment
Automatic polishing makes it easy for women, achieving uniform finishing precision! Increases production efficiency, reduces costs, and improves the work environment!
- Other surface treatment equipment
- Wafer processing/polishing equipment
Contributes to reducing tool costs! Easy to polish for anyone, including women and beginners!
- Wafer processing/polishing equipment
- Tap
Thin plate candle for steel frame, compatible with round swing type! Steel frame drill sharpener with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
Grinding range φ3 to 21mm! An automatic drill grinder that can automatically create conical shapes.
- Other surface treatment equipment
- Wafer processing/polishing equipment
Good hole processing is possible! You can regrind the brooch and reduce purchase costs.
- Wafer processing/polishing equipment
Thin plates, candles, and steel frames only! Steel frame drill sharpening machine with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
The grinding stone is CBN #150! A precision end mill grinder capable of sharpening the tip and side edges.
- drill
- Wafer processing/polishing equipment
It is possible to regrind brooches and reduce purchase costs! We offer a lineup of tools such as uneven end mill grinders, cutting machines, and tap grinders!
- Wafer processing/polishing equipment
- Other processing machines
Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.
- Other surface treatment equipment
- Wafer processing/polishing equipment
A super high-resolution camera capable of wide-angle and ultra-high-definition imaging, suitable for various MV applications.
- Monochrome camera
- Color camera
- Semiconductor inspection/test equipment
A collection of case studies on the implementation of process analyzers / online analyzers actually introduced around the world!
- Analytical Equipment and Devices
- Moisture Measuring Device
- Semiconductor inspection/test equipment
Minimize the footprint within the device! But with excellent high pressure and flow capacity! Fluororesin valve.
- valve
- Other semiconductor manufacturing equipment
Fluororesin diaphragm valve ideal for abrasive fluids such as slurries.
- CMP Equipment
[Online Exhibition 3/8-3/10] Invitation to Exhibit at the Future of Japanese Manufacturing Exhibition
From March 8 to 10, 2021, we will be exhibiting at the "Future of Japanese Manufacturing" exhibition. Once called a "manufacturing powerhouse," the Japanese manufacturing industry is now facing a crisis due to delays in digital transformation (DX) and other factors, bringing together technologies that will have a significant impact. Mr. Akira Ikegami and Mr. Wang, the chairman of HUAWEI, will also be speakers at the event. This is an opportunity to think together about the "future" of Japanese manufacturing! We look forward to your visit.
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
- Heating device
- Electric furnace
- Annealing furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
We will extend the life of your equipment with bolt-on and coupler-on solutions.
- Sputtering Equipment
- Solenoid Actuators
- Transport and handling robots
TKC Corporation Nagaoka Service Center Opening: We will achieve one-stop device regeneration and prolongation.
In recent years, we have received numerous requests for extending the lifespan of operational equipment. With the advancement of high functionality in both equipment and components, the specialization of repair services has progressed. Along with this specialization, it has become increasingly difficult to provide comprehensive "repairs" through integrated diagnostics and verification. With the establishment of this service center, we will offer one-stop regeneration and lifespan extension through "comprehensive diagnostics of equipment" by our skilled engineers and the "integration of specialized techniques" from partner engineers located nationwide.
Fluororesin coating F-200SI, effective as a corrosion prevention measure against hydrogen sulfide generated in hot spring areas, water treatment plants, livestock farming, and recycled paper factories...
- Other semiconductor manufacturing equipment
This is a formed bellows for vacuum piping, equipped with JIS standard vacuum flanges.
- Other semiconductor manufacturing equipment
- Vacuum Equipment
It is a polishing method that finishes the wrapped processed pear ground into a flat mirror surface.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
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From ceramics to metals, glass, and single crystals, we accommodate a wide range of materials! Introducing our processing technology.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
Achievements in the semiconductor industry worldwide, including the United States and Japan. A range of PFA products that contribute with outstanding reliability and purity.
- Other semiconductor manufacturing equipment
Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.
- Wafer processing/polishing equipment
- Other abrasives
We respond to our customers' needs with a consistent production system that encompasses everything from design to assembly, with meticulous attention and a sense of speed.
- Wafer processing/polishing equipment
Presentation of Materials: Comprehensive Catalog of Grinding Machines for Integrated Production from Design to Assembly / IMT Corporation
IMT Corporation is a precision grinding equipment manufacturer headquartered in Wakayama. We previously had sales offices in Tokyo, Osaka, and Nagoya, but we have now decided to finally expand into Kyushu. Our company has been providing production equipment for the semiconductor and liquid crystal panel industries, as well as equipment for preparing materials for microscopic observation, for many years. Through our "domestic sample grinding machines" and "consumables for microscope sample preparation and grinding materials," we will consult on our customers' quality assurance operations. 【Features】 - Consistent support: A comprehensive production system from design to assembly in-house - Speedy response: Detailed and prompt service *For more details, please download the materials or contact us directly.