4-Yen Multi-Sputtering Device 【MiniLab-S060】

A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.

4 cathodes with Φ2 inch mounted Simultaneous film formation: 3-component simultaneous film formation (RF 500W or DC 850W) + HiPIMS (Pulse DC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed from the HMI screen using the plasma relay switch MFC x 3 systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coat) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Plasma etching can be installed in either the main chamber or the load lock chamber. ● Mixed specifications such as resistance heating deposition, organic material deposition, EB deposition, and PECVD can also be configured.

• CVD Equipment
• Sputtering Equipment
• Evaporation Equipment

High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)

Continuous multilayer film, simultaneous film formation (2-6 elements simultaneous film formation: RF, DC can be freely switched from HMI) High-power RF, DC power supplies, and pulse DC power supplies can be flexibly configured for multi-cathode using our unique 'Plasma Switching Relay' module, allowing for various applications. High-temperature substrate heating stage (double jacket water-cooled) options: -1) Max 600℃ (lamp heating) -2) Max 1000℃ (C/C composite) -3) Max 1000℃ (SIC coating) Reverse sputtering stage inside the load lock: -1) 300W, or -2) Soft-Etching (<30W) System main control: 'IntelliDep' control system Windows PC (or TP HMI) interface All operations are centrally managed from a single HMI screen.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.

Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected with the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.

Introducing various thin film experimental devices and components for research and development fields. 【nano Benchtop Series】 High performance! nano Benchtop series thin film experimental devices Compact size housing high-functionality and high-spec thin film equipment. 【MiniLab Flexible Thin Film Experimental Device】 A "flexible experimental device" that combines various device configurations and necessary components according to required specifications.

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodate various research applications.

**Flexible System** The MiniLab thin film experimental device series allows for easy construction of a compact device configuration without waste, even as a customized product, by incorporating suitable components (such as deposition sources and stages) and control modules according to the required deposition methods and materials from a wide range of options. By configuring the device with a modular control unit in a Plug&Play manner, the application range expands, enabling various thin film process experiments. The MiniLab series is a high cost-performance system that caters to a wide range of applications from research and development to small-scale production. **Small Footprint & Space Saving** - Single Rack Type (MiniLab-026): 590(W) x 590(D)mm - Dual Rack Type (MiniLab-060): 1200(W) x 590(D)mm - Triple Rack Type (MiniLab-125): 1770(W) x 755(D)mm **Excellent Operability & Intuitive Operation Screen** Windows PC or 7” touch panel. Easy operation that does not require advanced skills, while ensuring maximum safety.

• Sputtering Equipment

A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.

Compact/Space-saving, High-spec Thin Film Experiment Equipment Can be combined with the following deposition sources: - Resistance heating deposition source x up to 4 - Organic deposition source x up to 4 - Electron beam deposition - 2-inch magnetron sputtering cathode x 4 - Plasma etching: Can be installed in either the main chamber or the load lock chamber 【Small Footprint & Space-saving】 - Dual rack type (MiniLab-060): 1200(W) x 590(D)mm 【Excellent Operability & Intuitive Operation Screen】 Windows PC or 7” touch panel. Easy operation regardless of skill level, with maximum safety considerations.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)

Continuous multilayer film, simultaneous film formation (2-6 element simultaneous film formation: RF, DC can be freely switched from HMI) High-power RF, DC power supplies, and pulse DC power supplies can be flexibly configured with multi-cathodes using our unique 'Plasma Switching Relay' module, allowing for versatile applications. High-temperature substrate heating stage (double jacket water-cooled) options: -1) Max 600℃ (lamp heating) -2) Max 1000℃ (C/C composite) -3) Max 1000℃ (SIC coating) Reverse sputtering stage in load lock: -1) 300W, or -2) Soft-Etching (<30W) System main control: 'IntelliDep' control system Windows PC (or TP HMI) interface All operations are centrally managed from a single HMI screen.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.

This is a flexible R&D thin film experimental device that achieves minimal waste, compact size, simple operation, and high cost performance by integrating the necessary minimum modules and controllers into a 19" compact rack with a Plug&Play feel. It supports magnetron sputtering (up to 3 sources) or resistance heating evaporation (metal sources up to 4, organic materials x4), and it can also be equipped with a substrate heating stage for annealing and plasma etching. A glove box storage type is also available (*specifications to be discussed). We offer a wide range of optional components that can be flexibly customized. ◉ Maximum substrate size: Φ6 inch ◉ Resistance heating evaporation source filament, crucible, boat type (up to 4 sources) ◉ Organic evaporation source: 1cc or 5cc ◉ Φ2 inch magnetron cathode (up to 3 sources) ◉ Dry etching ◉ Glove box compatible (optional, specifications to be discussed) ◉ Other options: simultaneous deposition from 2 sources, HiPIMS, automatic thin film controller, custom substrate holder, substrate rotation/lifting, substrate heating, and many other options available. *Please first contact us with your required specifications, and we will configure the system to meet your needs.

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

Flexible configuration available upon request for processes such as evaporation, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during evaporation.

The ML-080, composed of a D-type box chamber with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, features a higher chamber compared to the 060 model, resulting in a longer TS distance adjustment range and improved film uniformity during deposition on large-diameter substrates. It is an optimal model for vacuum deposition and is a higher-end version of the ML-060, which can also accommodate a load lock mechanism. Like the 060, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), EB deposition, RF/DC/Pulse DC compatible magnetron sputtering, RIE plasma etching, and annealing. - Maximum substrate size: Φ10 inch - Resistance heating deposition sources: up to 4 sources - Organic deposition sources: up to 4 sources - Magnetron sputtering cathodes: 4 sources - Electron beam deposition - Substrate heating stage (standard 500℃, max 1000℃) - *Plasma etching / <30W soft etching *Plasma etching can be installed in both the main chamber and the load lock chamber.

• Evaporation Equipment

Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.

MiniLab-080 is a glove box model designed to accommodate an 80ℓ large volume chamber within a glove box bench. It features a slide-open and close chamber that maximizes the use of the workbench, and a rear-opening door designed with maintenance in mind. Samples processed can be consistently handled in a controlled environment inside the glove box without exposure to the atmosphere or moisture. For specifications of the GB model, please refer to the gas purification unit. - Maximum substrate size: Φ10 inch - Resistance heating evaporation source x up to 4 sources - Organic evaporation source x up to 4 sources - Magnetron sputtering cathode x 4 sources - Electron beam evaporation - Substrate heating stage (standard 500℃, Max 1000℃) - Plasma etching / <30W soft etching

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Compact and space-saving! Ideal for organic thin film development, all processes such as deposition, sputtering, and annealing can be seamlessly performed within the glove box.

In the film formation process of 2D materials such as OLED (Organic EL), OPV (Organic Photovoltaic), OTFT (Organic Thin Film Transistor), graphene, and TMD (Transition Metal Dichalcogenides), it is necessary to handle samples in an inert gas atmosphere isolated from oxygen and moisture. The MiniLab-026/090-GB achieves a "oxygen and moisture-free" experimental environment for organic film applications by housing the PVD chamber within the GB, creating a compact and space-saving environment. 【Features】 ◉ A series of processes such as PVD film formation, spin coating, and hot plate baking can be performed seamlessly within the GB without exposing them to the outside air. ◉ Space-saving: The chamber does not protrude from the back, so it does not take up space. 【MiniLab Models】 ◉ MiniLab-026 (26ℓ volume): Metal/insulator/organic material deposition, sputtering, plasma etching, annealing ◉ MiniLab-090 (90ℓ volume): Metal/insulator/organic material deposition, EB deposition, sputtering, plasma etching, annealing * Please first contact us with your required specifications, and we will configure the system according to your needs.

• Evaporation Equipment

High-performance, cost-effective RF/DC magnetron sputtering system for research and development.

High-Performance RF/DC Magnetron Sputtering Equipment ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pa in the fastest 30 minutes!) ● Sputter cathodes x 3: Automatic continuous multilayer film, simultaneous deposition from 2 sources ● Film uniformity ±3% ● Various options: Substrate rotation and elevation, substrate heating (Max 500℃), cathodes for magnetic materials, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 systems (MFC control), expansion of RF/DC PSU (up to 2 power supplies), continuous multilayer film, and simultaneous deposition from 2 sources (RF/DC or DC/DC only). - Insulating films - Conductive films - Compounds, etc. 【Main Features】 ◉ Compatible substrates: Up to Φ4 inch ◉ 2" cathodes x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ APC automatic pressure control ◉ High-precision process control with MFC ◉ 1 Ar gas system (standard) + N2, O2 expandable up to 3 systems ◉ USB port for connection to Windows PC, allowing the creation and storage of recipes for up to 1000 layers and 50 films. Data logging on PC ◉ Other various options available

• Sputtering Equipment
• Evaporation Equipment
• Other semiconductor manufacturing equipment

We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.

High-performance organic source LTE (up to 4 sources) with excellent temperature responsiveness/stability for organic materials such as OLED, OPV, and OTFT, and a metal deposition source TE (up to 2 sources) that allows for easy exchange and maintenance. It can operate in manual mode, as well as in automatic mode for continuous multilayer film deposition and simultaneous film formation. Despite its compact size, it achieves performance comparable to that of large standalone machines without sacrificing basic performance, film quality, uniformity, or operability. Additionally, it features fully automatic control via a simple touch panel with PLC. The user-friendly HMI allows anyone to operate it intuitively without requiring complicated operating procedures. It comes with remote software "IntelliLink," which connects to a Windows PC via USB cable, enabling monitoring of the device's operating status, log saving, online/offline recipe creation and storage, and fault analysis. This compact vacuum deposition system is designed to maximize the effective use of limited development and lab space while also excelling in maintenance.

• Evaporation Equipment

◉ Short time: Easily conduct graphene synthesis experiments in just 30 minutes per batch. ◉ High-precision temperature and pressure control. ◉ Sophisticated software.

◉ High efficiency and high precision process control using cold wall method ◉ Rapid heating: 1100℃ in approximately 3 minutes ◉ High precision temperature control: ±1℃ ◉ High precision APC automatic pressure control system: 3 gas lines (Ar, H2, CH4) ◉ Standard recipe included for graphene production ◉ Compact size: 405(W) x 415(D) x 280(H)mm

• CVD Equipment

Max 1000℃, maximum 3 systems for MFC, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)

High-temperature processing up to 1000°C is possible with a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of three systems, allowing for firing operations at precisely adjusted process gas pressures (with the APC automatic process control system option). Additionally, there are many options available, including a front viewport, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature. - Halogen lamp heater: Max 500°C - C/C composite heater: Max 1000°C (only in vacuum or inert gas) - SiC coating heater: Max 1000°C (in vacuum, inert gas, O2)

• Annealing furnace

Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.

◉ Graphene, carbon nanotubes ◉ ZnO nanowires ◉ Insulating films such as SiO2 Others, compatible with a wide range of applications as a hot-wall thermal CVD system.

• CVD Equipment
• Annealing furnace
• Heating device

High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.

【Features】 - Compatible with high vacuum - Available in sizes Φ2 inch, Φ3 inch, Φ4 inch - Adopts a clamp ring type, no bonding required - Excellent maintainability, easy target replacement - Rich options including shutters, chimney ports, gas injection, high-strength magnets for magnetic materials, etc. - Compatible with various flange sizes for connection

• Sputtering Equipment

Tabletop small-sized experimental furnace - space-saving, with a maximum operating temperature of 2000°C! We also manufacture metal furnaces for reducing atmospheres.

◉ Tabletop size, space-saving: 328(W) x 220(D) x 250(H)mm (*Reference value for 2-inch chamber) ◉ Customizable heater structure: - Cylindrical heater: For sample sintering in crucibles (for solid, powder, granule, and pellet-shaped samples) - Flat heater: For sintering Φ1" to Φ6" wafers and small chips ◉ Fast heating time of approximately 15 minutes (to 1500℃), cooling from 1500℃ to 100℃ in about 40 minutes (in vacuum and gas replacement atmosphere) ◉ High specifications & high cost performance ◉ Simple structure, excellent operability Various high-temperature heating experiments for small samples in laboratories, as well as research and development of new materials, can be easily conducted with simple operations. The main unit is compact yet suitable for research and development in a wide range of fields.

• Heating device
• Other heaters
• Electric furnace

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

◉ Maximum operating temperature Max2000℃ ◉ Customizable heater structure: - Cylindrical heater: for sintering samples in a crucible (for solid, powder, granular, and pellet-shaped samples) - Flat heater: for sintering Φ1" to Φ6" wafers and small chip samples ◉ PLC semi-auto control All operations except for temperature adjustment are performed via a touch panel screen. No need for cumbersome valve opening/closing or pump activation; the "vacuum/purge" cycle before sintering and "vent" after sintering are performed automatically with one button. ◉ Up to 3 MFCs for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensuring safety during operation Monitoring for cooling water abnormalities, chamber temperature abnormalities, and overpressure abnormalities. Constructed from robust SUS material, the water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Dimensions: Width 603 x Depth 603 x Height 1,160mm (*installed within the rotary pump housing) Various heating experiments for small samples in laboratories, such as ultra-high temperature heating experiments and new material research and development, can be easily conducted. The main unit is compact yet suitable for research and development in a wide range of fields.

• Heating device

Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.

The nanoPVD-ST15A is a composite thin film experimental device that can simultaneously install a resistance heating deposition source, an organic deposition source, and a Φ2 inch magnetron sputtering cathode. It is bench-top sized and space-saving, making effective use of limited lab space. It is not a coater for microscope sample preparation; it can create high-quality thin films required for research and development applications such as electronic circuit boards, batteries, MEMS, and new material development. It is equipped with a maximum of three gas systems (process pressure APC automatic control), continuous automatic film formation (up to 20 layers), and simultaneous deposition from two sources, along with a variety of other features. Additionally, it offers options such as a substrate heating heater (up to 500°C) and a dry scroll pump. Vacuum pumping, film formation control, venting, recipe creation, as well as failure analysis and logging can all be operated via a 7" touch panel on the front, allowing for centralized management of operations. The IntelliLink software is included: it connects to a Windows PC via USB cable for remote monitoring, offline recipe creation, downloading and uploading, and log saving. It supports various applications in the development of new materials and new material development, as well as in advanced fundamental technology development sectors such as semiconductors, electronic components, fuel cells, and solar cells.

• Sputtering Equipment
• Evaporation Equipment

6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely accommodates various purposes from research and development to small-scale production.

◾️ Max 2000℃ ◾️ Effective heating range: Φ6 to Φ8 inch single leaf type, or batch type (multi-stage 5-sheet cassette) ◾️ Heater control: 1 zone or 2 zones (cascade control) ◾️ Heater materials: ・C/C composite: Φ6 to Φ8 inch ・PG coating high-purity graphite: Φ6 to Φ8 inch ◾️ Operating atmosphere: ・Vacuum (1x10-2Pa), inert gas (Ar, N2) ◾️ PLC semi-automatic operation ・Automatic sequence control for vacuum/purge cycle and venting ・Full automatic operation (optional) ・Touch panel operation, allowing centralized management without dispersed control. ◾️ Process pressure control ・APC control (MFC flow, or automatic opening adjustment valve PID loop control) ・Maximum 3 systems of MFC flow automatic control, or manual adjustment of float meter/needle valve ◾️ PLOT screen graph display, CSV data output

• Annealing furnace

Compact, space-saving, energy-efficient! High-performance ultra-high temperature experimental furnace for R&D.

Max 2900℃ (carbon furnace), Max 2400℃ (metal furnace) - Effective heating area 70 x 70 x 100 mm Supports various applications in new material development and advanced basic technology development sectors such as semiconductors, electronic components, fuel cells, and solar cells.

• Annealing furnace

Low-cost minimum necessary configuration (manual control) applicable as tubular furnace, diffusion furnace, and thermal CVD.

Manual lift vertical experimental furnace for small substrates from small samples to 3-inch wafers. A low-cost version of a vertical furnace ideal for basic experiments in university and corporate research labs. 【Applications】 ◉ Heat treatment for semiconductors, solar cells, fuel cells, electronic substrates, etc. ◉ Basic experiments: simple heat treatment experiments such as vertical tubular furnaces, oxidation diffusion furnaces, LPCVD, etc.

• Oxidation/Diffusion Device

Introducing the Thermocera Japan research and development experimental furnace. It can be utilized for material development such as fuel cells and ceramics, as well as ultra-high temperature experiments involving graphite and more.

We introduce various experimental devices for research and development fields. ◉ Mini-BENCH Ultra-High Temperature Tabletop Furnace Max 2000℃ ◉ Mini-BENCH-prism Semi-Automatic Ultra-High Temperature Furnace Max 2000℃ ◉ MiniLab-WCF Ultra-High Temperature Wafer Firing Furnace Max 2000℃ In addition, we design and manufacture custom high-temperature furnaces for research and development. Others.

• Electric furnace

This is a heater for thin film experiments such as PVD and CVD, featuring excellent uniformity, heating characteristics, and controllability. RF/DC bias specifications are also available.

High vacuum compatible with a variety of heater material options. Applicable for various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. Custom-made solutions are available to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requirements. ● Easy replacement of spare heater wires. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating protection. ● Base flange, vacuum feedthrough.

• Heating device

CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.

This is a film deposition device and high vacuum compatible hot plate for vacuum thin film experiments, featuring a heater plate made of Inconel or BN plate, with excellent thermal radiation efficiency and superior uniformity. 【Product Lineup】 ◎ SH-IN (Inconel Plate): φ1.0 to φ6.1 inch for vacuum, O2, and active gases ◎ SH-BN (BN Plate, Mo Cover): φ2.1 to φ6.1 inch for vacuum and inert gases 【Features】 ◎ Maximum temperature 1100℃ (SH-BN), 850℃ (SH-IN) ◎ Rapid heating ◎ In-plane temperature distribution within ±2% ◎ Control accuracy and reproducibility ±1℃ ◎ Low cost ◎ Short delivery time (standard about 2 weeks *excluding flanges, rotation and vertical mechanisms, mounting brackets, etc.)

• CVD Equipment
• Annealing furnace
• Other semiconductor manufacturing equipment

An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.

Semiconductors, electronic substrates, vacuum thin film process equipment and research and development【Ultra-high temperature substrate heating mechanism】 Compatible substrate sizes: Φ2 to 6 inches Can be used in vacuum (UHV compatible), inert gas, O2, and various process reactive gas atmospheres, etc. (Details to be discussed separately)

• Sputtering Equipment

Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800°C (Graphite, C/C Composite)

We will manufacture according to your requested specifications each time. This is a cylindrical heating unit that can be applied to various purposes in a high vacuum environment. We can custom-make it according to your needs, such as heating crucibles containing samples or heating metal, ceramic, and wire-shaped samples within the cylindrical heating range.

• Ceramic Heater

USB connection type, parameter settings and data management with the included dedicated software. A wide range of wavelength options is available. Three models can be selected based on your purpose.

【Overview】 Connect to a Windows PC using the standard accessory "CalexConfig" and the included USB cable (1.8m), allowing for the configuration of sensor measurement parameters, analysis of measurement results, and CSV output on the PC. 1) 4-20mA output 2) USB output (operates on USB bus power) 3) Simultaneous use of 4-20mA/USB output These three usage methods are possible. 【Features】 ◎ Simultaneous use of USB data logging and 4-20mA analog output ◎ Excellent basic performance: accuracy ±1%, reproducibility ±0.5%, 200msec fast response ◉ PUA2: Covers short wavelengths from 2.0 to 2.4μm, capable of measuring metal surfaces ◉ PUA5: Suitable for measuring glass surfaces at a wavelength of 5μm ◉ PUA8: General-purpose, applicable to a wide range of materials such as paper, wood, plastic, and textiles at a wavelength of 8-14μm

• Temperature and humidity measuring instruments

USB-connected compact infrared temperature sensor, no power supply needed, powered by USB bus power from PC, parameter settings and data management with included dedicated software.

【Overview】 Install the standard accessory "Calexsoft," and then simply connect it to a Windows PC via USB cable. You can easily set measurement parameters, conduct measurements, and analyze/export results in CSV format on your PC with a Plug & Play feel. USB output operates solely on USB bus power when connected to a PC, requiring no external power supply. The application range expands in various industrial fields and research institution laboratories. 【Features】 ◎ USB data logging ◎ Wide range: -20℃ to +1000℃ ◎ Excellent basic performance: accuracy ±1%, reproducibility ±0.5%, 125msec fast response ◎ Emissivity adjustment range: 0.2 to 1.0 ◎ Measurement wavelength range: 8 to 14μm ◎ Compact size Φ18mm x 45mm

• Temperature and humidity measuring instruments

Easy setup with a high-performance touch panel converter, data logging, and data storage on a microSD card. PM2.2 can also measure glossy metal surfaces.

**Overview** With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*There is also an option for a converter without a display.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurements in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving devices such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting measurements of high temperatures (Max 2000℃) and glossy metallic surfaces. **Features** ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, Repeatability ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm

• Temperature and humidity measuring instruments

TIIS (Technical Institution of Industrial Safety) certification obtained for intrinsically safe explosion-proof radiation temperature sensors, suitable for use in hazardous locations (Zone 0, 1, & 2).

ExTemp is an intrinsically safe explosion-proof radiation temperature sensor that can be used in hazardous material handling equipment and factories such as petrochemical plants, pharmaceutical factories, and chemical plants. (TIIS type certification number: 21097)

• Temperature and humidity measuring instruments
• Radiation thermometer
• Temperature and Humidity Control

Parameters such as temperature range, emissivity, and alarms can be set using a smartphone or tablet, allowing for easy configuration without the need for a display instrument or power supply for the instrument.

● You can use a smartphone or tablet to perform the settings. ● Download the dedicated app for free from Google Play (Android 4.1 to 5.1). ● Using Android's NFC communication, simply touch the sensor part to read and write data. ● Ultra-compact sensor (Φ31mm x t29mm) allows temperature measurement in narrow spaces. ● Fast response time of 125 msec, high accuracy of ±1.5%. ● Voltage output (0-5V or 0-10V), or K thermocouple output.

• Temperature and humidity measuring instruments

Compact measurement, robust body, high precision ±1%, 240msec fast response. It can be applied for industrial machine control, temperature monitoring in production sites, and various other purposes.

**Overview** The "PyroCouple" from Calex Electronics in the UK is a compact, lightweight, low-cost, and high-performance infrared temperature sensor that is unlike any other. It can measure the surface of objects that are "moving," "rotating," or "cannot be touched" non-contactly, allowing for fast and highly reproducible temperature control. **Features** ◎ Integrated amplifier and sensor ◎ 4-20mA output (standard), 0-50mV, thermocouple K, J, T output (optional) ◎ Accuracy: ±1% or ±1℃ (whichever is greater) ◎ Reproducibility: ±0.5% or ±0.5℃ (whichever is greater) ◎ Response time: 240 msec ◎ Protection rating: IP65

• Thermometer

Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.

4 units of Φ2 inch cathodes installed Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen with the plasma relay switch 3 systems of MFC (Ar, O2, N2) for reactive sputtering Plasma etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coat) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● It is also possible to configure a mixed specification for resistance heating deposition, organic material deposition, EB deposition, etc.

• CVD Equipment
• Sputtering Equipment
• Evaporation Equipment

A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.

Compact/Space-saving, High-spec Thin Film Experiment Device Combination possible from the following deposition sources: - Resistance heating deposition source x up to 4 - Organic deposition source x up to 4 - Electron beam deposition - 2-inch sputtering cathode x 4 (or 3-inch x 3, 4-inch x 2) - Plasma etching: Can be installed in either the main chamber or the load lock chamber 【Small Footprint/Space-saving】 - Dual rack type (MiniLab-060): 1200(W) x 590(D)mm 【Excellent Operability/Intuitive Operation Screen】 Windows PC or 7” touch panel. Easy operation regardless of skill level, with maximum safety considerations.

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.

**Flexible System** The MiniLab thin film experimental device series allows for easy construction of a compact system without waste, even as a customized product, by incorporating suitable components (such as deposition sources and stages) and control modules according to the required deposition methods and materials from a wide range of options. By configuring the device with a modular control unit in a Plug&Play manner, the application range expands, enabling various thin film process experiments. The MiniLab series is a high-cost performance system that caters to a wide range of applications from research and development to small-scale production. **Small Footprint & Space-Saving** - Single Rack Type (MiniLab-026): 590(W) x 590(D)mm - Dual Rack Type (MiniLab-060): 1200(W) x 590(D)mm - Triple Rack Type (MiniLab-125): 1770(W) x 755(D)mm **Excellent Operability & Intuitive Operation Screen** Windows PC or 7” touch panel. Easy operation that does not require advanced skills, while ensuring maximum safety.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

High-performance, cost-effective RF/DC magnetron sputtering device for research and development.

High-performance RF/DC magnetron sputtering system ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pa in as fast as 30 minutes!) ● Sputter sources x 3: Continuous multilayer film control, simultaneous film deposition ● Film uniformity ±3% ● Various options: Up/down rotation, heater, cathode for magnetic materials, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 systems (MFC control), expansion of RF/DC PSU (up to 2 power supplies), continuous multilayer film, and simultaneous deposition from 2 sources (RF/DC or DC/DC only). - Insulating films - Conductive films - Compounds, and more 【Main Features】 ◉ Compatible substrates: 2" (1 to 3 sources) or 4" (1 source) ◉ 2" cathode x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ High-precision process control with MFC ◉ 1 Ar gas system (standard) + up to 3 additional systems for N2, O2 ◉ Connect to a Windows PC via USB port to create and save recipes for up to 1000 layers and 50 films. Data logging on PC. ◉ Other various options available.

• Sputtering Equipment
• Other semiconductor manufacturing equipment

Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.

This is a flexible thin film experimental device for R&D that achieves minimal waste, compact size, simple operation, and high cost performance by integrating the necessary minimum modules and controllers into a 19" compact rack with a Plug&Play feel. It supports magnetron sputtering (up to 3 sources) or resistance heating evaporation (metal sources up to 4, organic materials x4), and can also be equipped with a substrate heating stage, allowing for the production of annealing devices and plasma etching. A glove box storage type is also available (*specifications to be discussed). We offer a wide range of optional components that can be flexibly customized. ◉ Maximum substrate size: Φ6inch ◉ Resistance heating evaporation source filament, crucible, boat type (up to 4 sources) ◉ Organic evaporation source: 1cc or 5cc ◉ Φ2inch magnetron cathode (up to 3 sources) ◉ Dry etching ◉ Glove box compatible (optional, specifications to be discussed) ◉ Other options: simultaneous deposition from 2 sources, HiPIMS, automatic thin film controller, custom substrate holders, substrate rotation/lifting, substrate heating, and more options available. *Please first contact us with your required specifications, and we will configure the system according to your needs.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.

High-performance organic source LTE (up to 4 sources) with excellent temperature responsiveness/stability for organic materials such as OLED, OPV, and OTFT, and a metal deposition source TE (up to 2 sources) that allows for easy exchange and maintenance. It can operate in manual mode, as well as in automatic modes for continuous multilayer film deposition and simultaneous film deposition. Despite its compact size, it achieves performance similar to that of standalone large machines without sacrificing basic performance, film quality, uniformity, or operability. Additionally, it features fully automated control via a simple touch panel with PLC. The user-friendly HMI allows anyone to operate it intuitively without requiring complicated operating procedures. It comes with remote software "IntelliLink," which connects to a Windows PC via USB cable, enabling monitoring of the device's operating status, log saving, online/offline recipe creation and saving, and fault analysis. This compact vacuum deposition system is designed to maximize the effective use of limited development and lab space while also excelling in maintenance.

• Evaporation Equipment

Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodate various research applications.

**Flexible System** The MiniLab thin film experimental device series allows for easy construction of a compact system without waste, even as a customized product, by incorporating components (such as deposition sources and stages) and control modules tailored to the required deposition methods and materials from a wide range of options. By configuring the system with a modular control unit in a Plug&Play manner, the application range expands, enabling various thin film process experiments. The MiniLab series is a high cost-performance system that caters to a wide range of applications from research and development to small-scale production. **Small Footprint & Space-Saving** - Single Rack Type (MiniLab-026): 590(W) x 590(D)mm - Dual Rack Type (MiniLab-060): 1200(W) x 590(D)mm - Triple Rack Type (MiniLab-125): 1770(W) x 755(D)mm **Excellent Operability & Intuitive Operation Screen** Windows PC or 7” touch panel. Easy operation that does not require expertise, with maximum safety considerations.

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.

MiniLab-080 glove box model with an 80ℓ large capacity chamber designed to be stored within a glove box bench. It features a slide-open and close chamber that maximizes the use of the workbench, and a rear-opening door designed with maintenance in mind. Samples processed can be consistently handled within a controlled environment inside the glove box without exposure to the atmosphere or moisture. For specifications of the GB gas purification unit, please refer to the GB model. ◉ Resistance heating evaporation source x up to 4 ◉ Organic evaporation source x up to 4 ◉ Magnetron sputtering cathode x 4 ◉ Electron beam evaporation ◉ Dry etching ◉ Annealing

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.

The ML-080, with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, is composed of a D-type box chamber. It has the same configuration as the 060 model but features a taller chamber, which extends the TS distance adjustment range and improves film uniformity during deposition on large-diameter substrates, making it an optimal model for vacuum deposition. It is a higher-end model than the ML-060, which can also accommodate a load lock mechanism. Like the 060, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), EB deposition, RF/DC/PulseDC compatible magnetron sputtering, RIE plasma etching, CVD, and annealing. - Maximum substrate size: Φ10 inches - Resistance heating deposition sources x up to 4 sources - Organic deposition sources x up to 4 sources - Magnetron sputtering cathodes x 4 sources - Electron beam deposition - Substrate heating stage (standard 500°C, max 1000°C) - *Plasma etching / <30W soft etching - CVD (thermal CVD, PECVD) *Plasma etching can be installed in both the main chamber and the load lock chamber.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.

This is a flexible thin film experimental device for R&D that achieves minimal waste, compact size, simple operation, and high cost performance by integrating the necessary minimum modules and controllers into a 19" compact rack with a Plug&Play feel. It supports magnetron sputtering (up to 3 sources) or resistance heating evaporation (metal sources up to 4, organic materials x4), and can be equipped with a substrate heating stage, allowing for the production of annealing devices and plasma etching. There is also a glove box storage type available (specifications to be discussed). A wide range of optional components that can be flexibly customized is available. ◉ Maximum substrate size: Φ6 inch ◉ Resistance heating evaporation source filament, crucible, boat type (up to 4 sources) ◉ Organic evaporation source: 1cc or 5cc ◉ Φ2 inch magnetron cathode (up to 3 sources) ◉ Dry etching ◉ Glove box compatible (optional, specifications to be discussed) ◉ Other options: simultaneous deposition from 2 sources, HiPIMS, automatic thin film controller, custom substrate holders, substrate rotation/lifting, substrate heating, and many more options available. * Please first contact us with your required specifications, and we will configure the system according to your needs.

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

◉ Maximum operating temperature Max2000℃ ◉ Customizable heater structure: - Cylindrical heater: for sintering samples inside a crucible (for solid, powder, granule, and pellet-shaped samples) - Flat heater: for sintering Φ1" to Φ6" wafers and small chip samples ◉ PLC semi-auto control All operations except temperature adjustment are performed via a touch panel screen. No need for cumbersome valve opening/closing or pump activation; the "vacuum/purge" cycle before sintering and "vent" after sintering are automatically sequenced with one button. ◉ Up to 3 MFCs for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensuring safety during operation Monitoring for cooling water abnormalities, chamber temperature abnormalities, and overpressure abnormalities. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160mm (*installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples in laboratories and new material research and development, can be easily conducted. The main unit is compact yet can be used for research and development in various fields.

• Annealing furnace
• Heating device
• Electric furnace

Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.

◉ Tabletop size, space-saving: 328(W) x 220(D) x 250(H) mm (*Reference value for 2-inch chamber) ◉ Customizable heater structure: - Cylindrical heater: For sample sintering in crucibles (for solid, powder, granular, and pellet-shaped samples) - Flat heater: For sintering Φ1" to Φ6" wafers and small chips ◉ Fast heating time of approximately 15 minutes (up to 1500℃), cooling from 1500℃ to 100℃ takes about 40 minutes (in vacuum and gas replacement atmosphere) ◉ High specification & high cost performance ◉ Simple configuration, excellent operability Various sample heating experiments, such as ultra-high temperature heating experiments for small samples in laboratories and new material research and development, can be easily conducted with simple operations. The main unit is compact yet suitable for research and development in various fields.

• Annealing furnace
• Heating device
• Electric furnace

Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)

High-temperature processing up to 1000°C is possible with the heating stage installed in the high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of three systems, allowing for firing operations at precisely adjusted process gas pressures (with the APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500°C - C/C composite heater: Max 1000°C (only in vacuum or inert gas) - SiC coating heater: Max 1000°C (in vacuum, inert gas, O2)

• Annealing furnace
• Heating device
• Electric furnace

6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.

◾️ Max 2000℃ ◾️ Effective heating range: Φ6 to Φ8 inch single leaf type, or batch type (multi-stage 5-sheet cassette) ◾️ Heater control: 1 zone or 2 zones (cascade control) ◾️ Heater material: ・C/C composite: Φ6 to Φ8 inch ・PG coated high purity graphite: Φ6 to Φ8 inch ◾️ Operating atmosphere: ・Vacuum (1x10-2 Pa), inert gas (Ar, N2) ◾️ PLC semi-automatic operation ・Automatic sequence control for vacuum/purge cycle and venting ・Fully automatic operation (optional) ・Touch panel operation, allowing centralized management without dispersed operations. ◾️ Process pressure control ・APC control (MFC flow, or automatic opening adjustment valve PID loop control) ・Maximum 3 systems of MFC flow automatic control, or manual adjustment of float meter/needle valve ◾️ PLOT screen graph display, CSV data output

• Annealing furnace
• Heating device
• Electric furnace

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

◉ Maximum operating temperature Max2000℃ ◉ Customizable heater structure: - Cylindrical heater: for sintering samples inside a crucible (for solid, powder, granule, and pellet-shaped samples) - Flat heater: for sintering Φ1" to Φ6" wafers and small chip samples ◉ PLC semi-auto control All operations except for temperature adjustment are performed on a touch panel screen. No need for cumbersome valve opening/closing or pump activation; the "vacuum/purge" cycle before sintering and "vent" after sintering are automatically sequenced with one button. ◉ Up to 3 MFCs for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensuring safety during operation Monitoring for cooling water abnormalities, chamber temperature abnormalities, and overpressure abnormalities. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160mm (*installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples in laboratories and new material research and development, can be easily conducted. The main unit is compact yet suitable for research and development in a wide range of fields.

• Annealing furnace
• Heating device
• Electric furnace

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is kept to a minimum. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without any thermal impact on the base material. Repairs can be conducted in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is required, please contact us.

We will be exhibiting jointly with Ando Corporation at the "22nd Pipe and Equipment Comprehensive Exhibition 2025 OSAKA," which will be held for three days from September 11 (Thursday) to September 13 (Saturday), 2025, at Intex Osaka, Hall 6A. Please be sure to stop by when you visit. 【Exhibition Schedule】 ● Environmentally friendly heat exchanger "Heat Recovery Heat Exchanger" ● Cut model of "Stainless Steel High Efficiency Heat Exchanger" ● Skeleton model of heating and cooling heat exchanger "SK Water Coil" ● Cooling heat exchanger "SK Water Coil Cartridge Type" ● Radiant heating pipe for space heating "SK Aerofin Tube" ◆ Event Dates: September 11 (Thursday) to September 13 (Saturday), 2025 10:00 AM to 5:00 PM (until 3:00 PM on the last day) ◆ Venue: Intex Osaka, Hall 6A Address: 1-5-102 Nanko-Kita, Suminoe-ku, Osaka City, Osaka Prefecture, 559-0034 Access: https://www.intex-osaka.com/jp/access/ ◆ Booth Number: 112 ◆ Admission Method: Pre-registration required (free) *Please check the official website for details.