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  4. Semiconductor Manufacturing Equipment
  5. Sputtering Equipment
  6. Multivariate Multi-Sputtering Device [MiniLab-S125A]

Multivariate Multi-Sputtering Device [MiniLab-S125A]

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last updated:Oct 12, 2024

テルモセラ・ジャパン 本社
テルモセラ・ジャパン 本社
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High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)

Continuous multilayer film, simultaneous film formation (2-6 elements simultaneous film formation: RF, DC can be freely switched from HMI) High-power RF, DC power supplies, and pulse DC power supplies can be flexibly configured for multi-cathode using our unique 'Plasma Switching Relay' module, allowing for various applications. High-temperature substrate heating stage (double jacket water-cooled) options: -1) Max 600℃ (lamp heating) -2) Max 1000℃ (C/C composite) -3) Max 1000℃ (SIC coating) Reverse sputtering stage inside the load lock: -1) 300W, or -2) Soft-Etching (<30W) System main control: 'IntelliDep' control system Windows PC (or TP HMI) interface All operations are centrally managed from a single HMI screen.

    Sputtering EquipmentEtching EquipmentEvaporation Equipment
ML-S125-iPROS_550-1.jpg

Multivariate Multi-Sputtering Device [MiniLab-S125A]

ML-S125-iPROS_550-1.jpg
ML-S125-iPROS_550-1.jpg ML-S125-iPROS_550-2.jpg ML-S125-iPROS_550-3.jpg ML-S125-iPROS_550-4.jpg ML-S125-iPROS_550-5.jpg
  • Thermosera Japan MiniLab Series Flexible Thin Film Experimental Device
  • Special site - Product/service details - https://pr.mono.ipros.com/thermocera/product/

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【Main Specifications】 - Board Size: Supports up to 12 inches - Chamber: SUS304 UHV compatible, 500 x 500 x 500 mm - Achievable Vacuum Level: 5 x 10^-5 pascal - Sputter Cathodes: Φ2" (maximum 6), Φ3" (maximum 4) - Plasma Power Supply: RF 150W, 300W, DC 850W, HiPIMS 5KW - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Turbo Molecular Pump + Dry Scroll Pump - Main Chamber RIE Etching Stage RF 300W - LL Chamber <30W Low Power Control *Soft Etching *Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Control via Touch Panel or Windows PC: All operations can be performed through the touch panel/PC without dispersing control. - Equipment Installation Dimensions: 1,767(W) x 754(D) x 1,645(H) mm ● Mixed specifications such as resistive heating deposition, organic material deposition, and EB deposition are also possible. ● Multi-chamber systems can also be manufactured.

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Manufacturing factories for electronic devices, fuel cells, displays, universities and research institutions, pharmaceutical and chemical factories, food factories, and many others.

catalog(31)

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Multifunctional Multi-Sputtering Device [MiniLab-S125A] Compatible with Φ8"

Multifunctional Multi-Sputtering Device [MiniLab-S125A] Compatible with Φ8"

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Multi-functional Sputtering Device 【MiniLab-S060】

Multi-functional Sputtering Device 【MiniLab-S060】

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【MiniLab】 Evaporation/Sputtering Dual Chamber System

【MiniLab】 Evaporation/Sputtering Dual Chamber System

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Glove Box Thin Film Experimental Device [MiniLab-026/090-GB]

Glove Box Thin Film Experimental Device [MiniLab-026/090-GB]

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MiniLab Series Flexible Thin Film Experimental Device

MiniLab Series Flexible Thin Film Experimental Device

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MiniLab-026 Flexible Thin Film Experimental Device

MiniLab-026 Flexible Thin Film Experimental Device

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★【MiniLab-060】Flexible Thin Film Experimental Device★

★【MiniLab-060】Flexible Thin Film Experimental Device★

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★【MiniLab-080】Flexible Thin Film Experimental Device★

★【MiniLab-080】Flexible Thin Film Experimental Device★

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★【MiniLab-090】Flexible Thin Film Experimental Device★

★【MiniLab-090】Flexible Thin Film Experimental Device★

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MiniLab-026/090 Glove Box Thin Film Experiment Device

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◆HTE Heater/OLED Organic Vapor Deposition・High-Temperature Metal Vapor Deposition Cell◆ Max 1500℃

◆HTE Heater/OLED Organic Vapor Deposition・High-Temperature Metal Vapor Deposition Cell◆ Max 1500℃

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Magnetron Sputtering Cathode

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[nanoPVD-S10A] RF/DC Magnetron Sputtering Device

[nanoPVD-S10A] RF/DC Magnetron Sputtering Device

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◆nanoPVD-T15A◆ High-performance organic and metal film deposition device

◆nanoPVD-T15A◆ High-performance organic and metal film deposition device

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Thin Film Experiment Device - "PRODUCTS GUIDE 2024"

Thin Film Experiment Device - "PRODUCTS GUIDE 2024"

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◆ANNEAL◆ Wafer Annealing Equipment

◆ANNEAL◆ Wafer Annealing Equipment

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[nanoCVD-8G/8N] Graphene/CNT synthesis device

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【Nanofurnace】Model. BWS-NANO Thermal CVD Device

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【Mini-BENCH】Ultra-high temperature tabletop experimental furnace Max 2000℃

【Mini-BENCH】Ultra-high temperature tabletop experimental furnace Max 2000℃

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Mini-BENCH-prism Semi-Automatic Ultra-High Temperature Experimental Furnace Max 2000℃

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MiniLab-WCF Ultra High Temperature Wafer Annealing Furnace Max 2000℃

MiniLab-WCF Ultra High Temperature Wafer Annealing Furnace Max 2000℃

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【TCF-C500】Ultra-high temperature small experimental furnace Max 2900℃

【TCF-C500】Ultra-high temperature small experimental furnace Max 2900℃

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BH Series [High-Temperature Thin Film Experiment Substrate Heating Heater] Max 1800℃

BH Series [High-Temperature Thin Film Experiment Substrate Heating Heater] Max 1800℃

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[SH High-Temperature Substrate Heating Heater] (Inc/BN Plate Max 1100℃) High-Temperature Plate Heater for PVD CVD Vacuum Thin Film

[SH High-Temperature Substrate Heating Heater] (Inc/BN Plate Max 1100℃) High-Temperature Plate Heater for PVD CVD Vacuum Thin Film

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Hot Stage [Substrate Heating Mechanism] Ultra-High Temperature Substrate Heating Heater

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Wafer Scale Graphene Synthesis Device [nanoCVD-WGP]

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Soft Etching Device [nanoETCH] < Damage-free etching with 30W low power control

Soft Etching Device [nanoETCH] < Damage-free etching with 30W low power control

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Sputtering and deposition source mixed composite film formation device [nanoPVD-ST15A]

Sputtering and deposition source mixed composite film formation device [nanoPVD-ST15A]

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【PyroNFC】Smartphone-configured infrared radiation temperature sensor

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ExTemp intrinsic safety explosion-proof infrared radiation temperature sensor

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【PyroUSB】USB-connected high-precision infrared temperature sensor

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News about this product(12)

Product image of ANNEAL wafer annealing equipment.

Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates

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Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations with precisely adjusted process gas pressure (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)

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Product image of Mini-BENCH small experimental furnace (Φ2 inch specification)

□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■

  • Product news

Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others

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MAG series magnetron sputtering cathode

★【Magnetron Sputtering Cathode】★ Thermosera Japan

  • Product news

High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC, capable of depositing metals, insulators, and other materials without impurities. It also excels in maintainability. 【Features】 - Compatible with high vacuum - Available in sizes Φ2 inch, Φ3 inch, Φ4 inch - Adopts a clamp ring type, eliminating the need for bonding - Excellent maintainability, allowing for easy target replacement - A wide range of options including shutters, chimney ports, gas injection, and high-strength magnets for magnetic materials - Compatible with various flange sizes 【Main Specifications】 ■ Compatible with RF, DC, and pulse DC ■ Target thickness: 1/16" to 1/4" ■ N-type coaxial connector ■ Water-cooled: 4ℓ/min, 0.35Mpa Φ6mm tube connection ■ Case material: SUS304 ■ Target clamp material: Al or SUS304 ■ Bellows (*Flexi-head type) material: SUS316 ■ Insulating material: PEEK/PTFE ■ Sealing material: Viton ■ High-strength magnet pack: NiFe

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Image of 【nanoCVD-8G】

☆★☆★【nanoCVD-8G】Graphene Synthesis Device ☆★☆★

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◉ High-efficiency and high-precision process control using cold wall method ◉ Rapid heating: 1100℃ in approximately 3 minutes ◉ High-precision temperature control: ±1℃ ◉ High-precision APC automatic pressure control system: 3 gas lines (Ar, H2, CH4) ◉ Standard recipe for graphene production included ◉ Compact size: 405(W) x 415(D) x 280(H)mm ◆Features◆ - Easy operation! Operation and recipe management via 5-inch touch panel - Up to 30 recipes and 30-step program creation possible - PC software included with USB cable connection, offline recipe creation on PC → upload/download to/from the device, CSV data output - Maximum sample size: 40 x 40mm: copper (nickel) foil, SiO2/Si, Al2O3/Si substrates, etc. ◆Model: nanoCVD-8G◆ - Standard program for graphene included - High vacuum process, high-precision process pressure control - Rotary pump included as standard - 3 gas supply lines (Ar, H2, CH4) - Sample heating stage (high-purity graphite) Max 1100℃ - K-type thermocouple

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テルモセラ・ジャパン

テルモセラ・ジャパン 本社

Industrial Electrical Equipment

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【Endless possibility_thermal engineering...】 Our company sells vacuum thin film devices for semiconductor and electronic device fundamental research, ultra-high temperature heaters for CVD substrate heating, experimental furnaces, temperature measurement equipment, and more. To meet the endless demand for "heat," which is indispensable in any era, and to respond to various requests in the field of fundamental technology development, we aim to introduce the latest equipment and contribute to research and development in Japan.

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The related categories of Sputtering Equipment

  • Manufacturing and processing machinery
  • Semiconductor Manufacturing Equipment
  • Sputtering Equipment
  • Evaporation Equipment
  • Etching Equipment
          

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