List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

1621~1665 item / All 5248 items

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It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

  • Sensors

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We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

  • Other semiconductors
  • Processing Contract
  • Wafer

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Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.

  • Bonding Equipment

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Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.

  • Bonding Equipment

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Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.

  • Bonding Equipment

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We offer a tabletop manual wire bonder with over 9,000 units in operation worldwide, including wedge bonding tools. Our support system is also robust.

  • Other semiconductor manufacturing equipment

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Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.

  • Bonding Equipment

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Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.

  • Bonding Equipment

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We create tapered capillaries with a constant inner diameter using our unique manufacturing technology.

  • Analytical Equipment and Devices
  • Other machine elements
  • Semiconductor inspection/test equipment

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We will exhibit at the 2024 Japan Proteomics Society Annual Meeting and the 20th Joint Meeting of the Japanese Clinical Proteogenomics Society.

Our company will be exhibiting at the Joint Conference of the 2024 Annual Meeting of the Japanese Proteomics Society and the 20th Annual Meeting of the Japanese Clinical Proteogenomics Society, which will be held at Link Station Hall Aomori from June 26 to 28, 2024. At our booth, we will showcase a complete set of interfaces that enable high-sensitivity measurements using capillary electrophoresis-mass spectrometry (CE-MS). We invite anyone using CE-MS, as well as those who own an MS and are interested in utilizing capillary electrophoresis, to visit our booth.

[Domestic Authorized Dealer] LEVITRONIX Bearingless Pump Achieves liquid delivery performance and control performance that meet the demands of advanced processes!

  • CMP Equipment

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Enhance the supply pressure of pure water within the factory to eliminate pressure shortages! Furthermore, suppress fluctuations in pure water supply pressure to achieve a stable supply of pure water.

  • Other semiconductor manufacturing equipment

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Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!

  • Sputtering Equipment

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Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on resin films and metal foils!

  • CVD Equipment

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For experimental use in companies and university laboratories! A compact slit coater that accommodates various coating conditions and materials, achieving high precision in coating uniformity.

  • Coater

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A compact slit coater (die coater) that flexibly accommodates various coating conditions and materials, achieving high-precision coating uniformity.

  • Coater

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For experimental use in companies and university laboratories! A high-precision and compact slit coater (die coater) that accommodates various coating conditions and materials.

  • Coater

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Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on flat substrates such as glass and metal!

  • CVD Equipment

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It is a manual polishing device for a luminescence spectroscopic analysis apparatus.

  • Wafer processing/polishing equipment

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With a space-saving design, the vacuum pump module can be installed up to 18 meters away from the process module.

  • CVD Equipment

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Supports wafers up to φ200mm! This is a plasma CVD system capable of both film deposition and etching.

  • Etching Equipment

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Kyoto, the ever-evolving hub of precision sheet metal! Adapting to flexible manufacturing.

  • 3D CAD
  • Other CAD
  • Wafer processing/polishing equipment

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Samples will be displayed at the exhibition. Improved separation from printed circuit boards! Chemical resistance including organic solvents and alkali.

  • Photomask

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The corresponding pipe sizes are OD 38.1mm to 76.2mm! Introducing our pipe outer surface polishing machine.

  • Wafer processing/polishing equipment

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Non-contact transport of wafers and glass substrates using ultrasound! It's a clean transport technology! No contamination from contact! No contamination risk from air blow!

  • Other semiconductor manufacturing equipment
  • Secondary Cells/Batteries
  • Other conveying machines

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We will provide you with the latest information on "Majesty-DI."

  • Printed Circuit Board
  • Photomask
  • Substrate transport device (loader/unloader)

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Conducting ultra-precision grinding processing for core pins of molds for mobile phone connectors!

  • Wafer processing/polishing equipment
  • Processing Contract

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We provide sapphire components with wide transparency characteristics, hardness, chemical stability, heat resistance, and good thermal conductivity.

  • Etching Equipment

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Achieving high-precision coating on a lab scale. Compatible with a variety of materials in the experimental and prototype stages, from low viscosity to high viscosity.

  • Other painting machines
  • Coater
  • Other surface treatment equipment

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Demo available at our company! New technology launched in the market. CVD with atmospheric pressure plasma. Capable of handling small quantities and a variety of products.

  • CVD Equipment
  • Other painting machines
  • Other processing machines

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No warm-up/cool-down time. High-quality continuous annealing processing is possible.

  • Annealing furnace
  • Other processing machines

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A brush processed into a cylindrical shape with high precision from woven pile products.

  • Other semiconductor manufacturing equipment

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We will provide proposals and offerings that can contribute to cost reduction for our customers, from consumable parts to repairs.

  • Other semiconductor manufacturing equipment

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Essential for precision screen printing. Mastering the straightness and smoothness of the squeegee.

  • Wafer processing/polishing equipment

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Test printing is possible! Printing on polyimide coverings and more can be done with high precision and fully automatically.

  • Photomask

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Tabletop cleaning and modification device with a radiation size of 400×400mm.

  • Other semiconductor manufacturing equipment

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CDSEM, boasting an overwhelming market share, along with the Hitachi S8000 and S9000 series. We have a constant inventory of equipment and a complete demonstration system in place.

  • Semiconductor inspection/test equipment

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Mirror projection mask aligner, a unit that enables double-sided exposure with contact aligners. There is also a proven track record for IR (near-infrared) specifications.

  • Photomask

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For now, this! You can understand it in just 5 swipes! The basics of photomasks that beginners can’t ask about anymore!

  • Photomask

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Sheet substrate electrical testing system! (Continuity testing, insulation testing, four-terminal testing, micro-short detection) FPC, flexible substrates, PCB, PKG

  • DS202.png
  • Other inspection equipment and devices
  • Circuit Board Inspection Equipment
  • Semiconductor inspection/test equipment

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【TTL】Board Power-On Test Device 'TY-CHECKER DS401' Semi-Automatic Type, a power-on testing machine for printed circuit boards, capable of high-frequency testing in a semi-automatic manner (continuity testing, insulation testing, four-terminal testing, micro-short detection).

The "TY-CHECKER DS401" is a powered inspection system that adds X-direction movement (horizontal movement) to the conventional Y-direction step-and-repeat transport. Since the device is semi-automatic, the entire front of the machine is almost open, making it easy to handle the workpieces. It is designed to be useful in product development and manufacturing environments. Transitioning to mass production can also be done smoothly by adopting the AT type. *We also assist with the supply of jigs! It supports both a unique dedicated plate holding method that does not apply tension and a tension holding method, allowing selection according to the product. By swapping the measurement unit, high-frequency characteristic testing can be performed either on sheets or individual pieces, leveraging the advantages of jig fixation to achieve stable automatic/semi-automatic high-frequency testing. 【Features】 ■ Maximum substrate size: 305mm x 510mm ■ Step-and-repeat transport in the XY direction ■ Contributes to downsizing of jig head (reducing jig costs) ■ Continuity, insulation, 4-terminal testing, micro-short detection ■ High-frequency characteristic testing compatible with 'VNA, LCR, TDR' *For more details, please refer to the PDF document or feel free to contact us.

Do you know about plastic "welding"...?

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  • Other semiconductor manufacturing equipment
  • Plating Equipment
  • Other cleaning machines

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Do you know about plastic "welding"? We have started a contract service for resin processing. (Re)

【Resin Processing, Plastic Processing, Plastic Welding】 In addition to "molding" and "cutting," there is a technique called "welding" for processing plastics. We cut, grind, bend, assemble, weld, and finish plastic sheets... We handle everything from small items to large equipment, one by one. To meet the various requests of our customers and deliver products and services that satisfy them, we utilize the skills, experience, and know-how we have cultivated over the years to craft each item by hand. 【Water Treatment Related, Semiconductor Cleaning Tanks, LCD Panel Manufacturing Lines】

Fusing the "design capabilities" of machinery, electronics, and software! We respond to needs in a one-stop manner.

  • Semiconductor inspection/test equipment

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A high-performance compact polishing machine powered by batteries, usable in various optical connection sites!

  • Wafer processing/polishing equipment

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Dross and oxide film adhesion! We will introduce our achievements in reaching a mirror finish after fluid polishing.

  • Wafer processing/polishing equipment

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Challenge to "Injection Needles That Do Not Damage Cells" - Algovision Technologies Develops New Technology Supporting Regenerative Medicine - A New Era of Inner Surface Processing for Injection Needles.

"Algovision Technologies Co., Ltd. (Headquarters: Kyoto Prefecture, CEO: Shoichi Tachibana) has developed a new technology that utilizes its flagship product, fluid polishing equipment, to smoothly polish the inner surface of injection needles used in regenerative medicine. This has revealed the potential to reduce the 'risk of cell damage within the injection needle,' which has been a challenge when delivering cells directly into a patient's body, and it is expected to further accelerate the practical application of regenerative medicine." - A press release has been distributed.

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