List of Inspection Equipment and Devices products

  • classification:Inspection Equipment and Devices

1996~2010 item / All 8201 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

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  • air conditioning

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PCIe/104 Processing Unit, equipped with the 14th generation Meteor Lake-H Ultra 7 165H/155H.

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  • Embedded Board Computers
  • Evaluation Board
  • Industrial PCs

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The outline of the work emerges clearly! It greatly contributes to improving the workability of the inspection process.

  • Other inspection equipment and devices
  • Image Processing Equipment
  • Inspection fixture

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Introducing a camera equipped with a CMOS sensor that enhances sensitivity in the near-infrared range, suitable for various inspections, agriculture, and biological/medical applications!

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  • Other inspection equipment and devices

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【NEW!】CIS Product Comprehensive Catalog【March 2020】

A variety of cameras are packed with features such as compact size, high speed, high image quality, high resolution, the adoption of new interfaces, and the inclusion of a CIS original image processing engine! [Contents of this issue] ■ CoaXpress cameras ■ CameraLink cameras ■ Pixel-shift cameras ■ Board cameras (GigE/USB3.0) ■ Accessories ■ Semi-custom lenses ■ Cameras equipped with our proprietary technology "Clairvu" ■ Case studies on image processing system development In addition to the models that have been well-received so far, we are excited to introduce new products: "50M high-resolution CXP camera," "25M high-speed CXP camera," "RGB+Depth information acquisition capable USB3.0 I/F ToF camera development kit," "4K high-speed Clairvu-equipped camera," and "4K camera with 18x zoom lens and Clairvu." There is a wide range of cameras suitable for various industrial applications such as traffic monitoring, broadcasting, medical, heavy steel plants, logistics, robot vision, and various inspections. Please take a look at the enhanced lineup of CIS cameras! *For more detailed information or to request an English version of the catalog, please contact our sales department.

Speedy processing of ultra-thin coaxial cables, with extensive experience. Capable of handling ultra-thin wires of AWG50 and pitch as narrow as 0.2mm.

  • Contract manufacturing
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  • Harness

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[No need for equipment such as FT-IR and EDX] E-learning on simple inspection of foreign substances. Includes a [testing reagent set] that can be used in practical applications.

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  • Other inspection equipment and devices

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Designed and manufactured according to examination purposes! Continuous operation is possible through programming.

  • Evaluation Board

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The vibration analysis program SX-A1VA is a program that adds vibration measurement and analysis functions to the multifunction measurement system SA-A1.

  • Other inspection equipment and devices

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Kyowa Kogyo Co., Ltd. responds to a wide range of customer needs through the design and manufacturing of conveyors and automated specialized machinery, as well as material sales and machining.

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  • High pressure cleaner
  • Defect Inspection Equipment
  • Mixer/agitator

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Fully automatic measurement device for water contact angle. It measures surface energy (wettability) as a replacement for the dyne value.

  • Analytical Equipment and Devices
  • Other inspection equipment and devices

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Easily check the phase sequence and missing phase at a glance! No battery required as it is powered from the measurement target.

  • Other inspection equipment and devices

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We provide latch-up testing services to evaluate the resistance of CMOS ICs and semiconductor products containing them to latch-up destruction.

  • Contract Inspection
  • Other contract services
  • Other inspection equipment and devices

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Some overseas manufactured parts and products may have quality issues. We provide quality evaluation services for reliability testing and assessment for these.

  • Contract Inspection
  • Testing Equipment and Devices
  • Other inspection equipment and devices

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Cryogenic ion milling cross-section processing example (rubber products)

We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.

We are equipped with a variety of devices to meet your needs, including dimension measurement of various parts and surface roughness measurement!

  • Visual Inspection Equipment
  • Other measurement, recording and measuring instruments
  • Other contract services

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Observation of thermal deformation using a 3D shape measuring machine (VR-6200)

This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.

In-Situ Continuous Measurement Reliability Evaluation Testing Service

  • Contract Inspection
  • Testing Equipment and Devices
  • Other inspection equipment and devices

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Observation of substrate deformation using a 3D shape measuring device (VR-6200)

I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.

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