List of Semiconductors and ICs products
- classification：Semiconductors and ICs
2161～2175 item / All 4531 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
Extruded heat sink with hole processing for TO-3, TO-66, SOT-9, and SOT-32 packages.
- Other semiconductors
The LAM7 series in W70mm x H70mm is finally here.
- Other semiconductors
It can fix a TO-247 package semiconductor without screw holes to a heat sink.
- Other semiconductors
Introduced with a variety of diverse options! Non-touch frames and semi-self-checkout systems, etc.
- Dedicated IC
- Entrance and exit control system
We have two in-house quality assurance centers, and we have completed ISO 9001 international standard certification!
- Other semiconductors
- Other electronic parts
- Interior parts
SMT clips for 0.65mm blade fuses (reel product)
- Other semiconductors
It is a clip that can secure TO-247 and TO-264 package transistors to a heat sink without screws.
- Other semiconductors
Low-frequency specialized current probe
- inverter
- Other semiconductors
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Thermal elements of fine ceramic semiconductors! Explaining physical properties.
- Other semiconductors
Are you struggling with implementing AI in your environment? We solve the challenges of AI implementation in harsh conditions for devices with AI chips suitable for industrial applications.
- Dedicated IC
- Embedded Board Computers
- Expansion Boards
We have released a white paper on approaches to implementing image AI and edge AI in harsh environments.
Recently, various AI applications have reached a practical level. Their uses are diverse, and there are expectations for their application in various locations. However, implementing them at the edge requires addressing the heat dissipation of high-heat-generating components while ensuring coordination with machine control and maintaining strict environmental durability through temperature management, vibration control, and mechanical design. Analog Tech has compiled an approach for implementing image AI and edge AI in field environments, along with platform information for implementation, in a white paper. Please refer to it. You can find more information in the following catalog download from Ipros: https://premium.ipros.jp/analogtech/catalog/detail/619854/
◆915nm, 976nm ◆Low NA design ◆High fiber coupling efficiency ◆1040–1200nm return light protection
- Other optical parts
- Other physicochemical equipment
- Other semiconductors
Optimal for efficient heat dissipation of transistors during substrate mounting.
- Other semiconductors
Optimal for efficient heat dissipation of transistors during substrate mounting.
- Other semiconductors
Efficient heat dissipation achieved with a hollow-type heat sink and axial fan.
- Other semiconductors
Efficient heat dissipation achieved with a hollow-type heat sink and axial fan.
- Other semiconductors