List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

2551~2565 item / All 4531 items

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For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

  • TRON 1000.PNG
  • TRON 5000 black n white.JPG
  • TRON 5000.JPG
  • CSM.JPG
  • Butyl Smooth.JPG
  • Work gloves

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Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.

Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.

Even with a 10mm corner, it is possible depending on the processing method! During prototype development, we can process from just one piece.

  • Processing Contract
  • Circuit board design and manufacturing
  • Other semiconductors

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A semiconductor package that supports miniaturization and high density through unique cavity structure formation technology.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Other semiconductors

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From the design and manufacturing of molds to the assembly of stamping molds, we mass-produce and supply various lead frames with high precision and high quality.

  • Other semiconductors
  • Other molds

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Mass production of high-precision, high-quality lead frames for high-quality semiconductor devices, including deep pressing and bending!

From the design and manufacturing of molds to the assembly of stamping molds, we mass-produce and supply various lead frames with high precision and high quality. There are many types of lead frames used in semiconductor devices. At Rohm Mecatech, we produce lead frames using stamping molds and have numerous achievements in lead frames that require deep pressing/bending. If you could provide us with the desired shape of the frame, we will consider whether we can accommodate it and conduct a technical review, so please feel free to let us know. 【Process for Requesting Lead Frames】 ■ Send the drawings of the lead frame you wish to manufacture ■ After a technical review to determine feasibility, we will submit a quotation ■ Order and manufacture the stamping mold ■ Begin mass production after the stamping mold is completed *For more details, please refer to the PDF materials or feel free to contact us.

The achievements in lead frame support are diverse! We are mass-producing and supplying with high precision and high quality.

  • Other semiconductors
  • Other molds

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[Technical Introduction] Lead Frames for Semiconductor Transistors

The achievements in lead frame support are diverse! We are mass-producing and supplying with high precision and high quality. At Rohm Mecatec, we produce lead frames for transistors using stamping molds. We have established a large-scale production system both in Japan and overseas, allowing us to respond quickly to customer requests with ample capacity. If you could provide us with the desired shape of the frame, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Process for Lead Frame Requests】 ■ Send us the drawings of the lead frame you wish to produce. ■ After a technical review to determine feasibility, we will submit a quotation. ■ Place an order for the stamping mold and proceed with production. ■ Once the stamping mold is completed, mass production will begin. *For more details, please refer to the PDF document or feel free to contact us.

Leave the lead frames for tantalum capacitors to us.

  • Other semiconductors
  • Other molds

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Lead frame experts: Rohm Mecatech offers the best manufacturing solutions for tantalum capacitors.

Please leave the lead frames for tantalum capacitors to us. At Rohm Mecatech, we produce lead frames for tantalum capacitors using stamping molds. We have a large-scale production system both in Japan and overseas, with ample capacity to respond quickly to customer requests at any time. If you could provide us with the desired shape of the frame, we will conduct a technical review to see if we can accommodate it, so please feel free to reach out. [Process for Requesting Lead Frames] ■ Send us the drawings of the lead frame you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Order and production of the stamping mold ■ Start mass production after the stamping mold is completed *For more details, please refer to the PDF materials or feel free to contact us.

Large-scale production system! There are various types of lead frames used in semiconductor devices.

  • Other semiconductors
  • Other molds

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A wide variety of lead frame manufacturing achievements! We respond quickly to our customers' requests at any time.

  • Other semiconductors
  • Other molds

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The DRAMless, BiCS5 NAND equipped PCIe interface SSD MEA3K0E allows for high-speed access and is ideal for industrial applications.

  • Memory

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Data retention of Silicon Power's industrial NAND flash products.

NAND flash technology is affected by physical degradation, which can ultimately lead to device failure. There are two end-of-life parameters that define the performance of NAND flash products: write/erase endurance and data retention. This application note provides insights into the reliability testing methods for NAND flash technology and discusses the impact of important factors from the perspective of data retention. For more details, please refer to the related materials! Link: https://www.ipros.jp/news/detail/128591/attachFile/

The DRAMless BiCS5 equipped SATAIII interface SSD MDA3K0E supports large capacities up to 1TB, making it ideal for industrial applications.

  • Memory

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Definition and Terminology of Industrial SSD Temperature - Part I

When the temperature rises, both physical and chemical processes are accelerated. This is particularly true regarding damage to NAND flash memory cells. In other words, using NAND flash at high temperatures can significantly reduce its durability. Due to its sensitivity to changes in the characteristics of the insulating layer, this effect is more pronounced in high-density flash that stores multiple threshold levels. To maximize the lifespan of NAND flash, the flash memory controller needs to monitor and adapt to these changes. Both variations in ambient temperature and temperature cycles caused by powering the device on and off exert physical stress on the components, as different materials expand and contract at different rates. This can ultimately lead to the failure of electrical connections. For more details, please refer to the related materials! Link: https://www.ipros.jp/news/detail/130425/attachFile/

High-performance BiCS5 NAND equipped, M.2 2280 SATA interface SSD for industrial MDC3K0E series.

  • Memory

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Data retention of Silicon Power's industrial NAND flash products.

NAND flash technology is affected by physical degradation, which can ultimately lead to device failure. There are two end-of-life parameters that define the performance of NAND flash products: write/erase endurance and data retention. This application note provides insights into the reliability testing methods for NAND flash technology and discusses the impact of important factors from the perspective of data retention. For more details, please refer to the related materials! Link: https://www.ipros.jp/news/detail/128591/attachFile/

High-performance BiCS5 NAND equipped, M.2 2280 NVMe SSD for industrial use, MEC3K0E series.

  • Memory

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Explanation of SSS Device Performance Benchmark_PART 1_Steady-State Throughput Performance

Introduction to the Performance Benchmark of Solid State Storage (SSS) Devices The performance of Solid State Storage (SSS) devices heavily depends on the following factors: 1. Write history and preconditioning: The state of the device before testing 2. Workload pattern: The I/O pattern (R/W mix ratio, block size, access, etc.) 3. Data pattern: The actual bits of the data payload written to the device Typical SSS devices, when exposed to workloads in a fresh-out-of-the-box (FOB) state, usually experience a performance increase for a short period before transitioning to a steady state. For more details, please refer to the related materials! Link: https://www.ipros.jp/news/detail/119902/attachFile/

We are a total supplier of dopant materials used in the growth of crystalline silicon.

  • Other semiconductors
  • others

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Leave the semiconductor silicon wafers to us.

  • Processing Contract
  • Wafer

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