List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

271~285 item / All 4625 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

  • small-mistcollector.png
  • air conditioning

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It is a resin that can be cured in a short time by exposing it to ultraviolet light with a wavelength of 200 to 400 nm.

  • Other semiconductors

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PEEK is a thermoplastic super heat-resistant resin that combines excellent mechanical properties and functionality.

  • Other semiconductors

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Excellent corrosion resistance (e.g., hundreds of times that of stainless steel in the case of concentrated hydrochloric acid)

  • Other semiconductors

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It is an abrasive with strong crushing strength and thermal stability.

  • Other semiconductors

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A lineup of 5 types of grain sizes.

  • Other semiconductors

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As of April 1, 2016, the old product name YUPIMORE(R) has been changed to SEPLAS SA.

  • SA101板.jpg
  • SA201板.jpg
  • Other semiconductors

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We have assembled equipment that is strong in the analysis of organic materials such as resin and carbon composites.

  • diode
  • Contract measurement
  • Composite Materials

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hihakai_img.jpg

Announcement of the Start of Non-Destructive Testing Services from April 2018

On April 2, 2018, MST will introduce the latest processing and analysis equipment and begin offering non-destructive analysis services. We will provide analysis services across a wide range of fields, including product development and quality control in electronic devices, pharmaceuticals, and food. Non-destructive analysis is a technology that visualizes the internal condition of a product without destroying it. With the introduction of the latest processing and analysis equipment, MST will now be able to conduct non-destructive analysis. We will offer analysis services on a contract basis.

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You can investigate the changes in degassing intensity while maintaining the temperature.

  • Contract Analysis
  • Memory

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The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).

  • Contract Analysis
  • Transistor

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The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.

  • Contract Analysis
  • magnet
  • Memory

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Microscopic structural analysis of amorphous films is possible through simulation.

  • Contract Analysis
  • Memory

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It is possible to confirm the stress distribution in the sample cross-section.

  • Contract Analysis
  • Wafer

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It is possible to evaluate trace metals in ppm orders.

  • Contract Analysis
  • Ceramics
  • Wafer

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