List of Semiconductors and ICs products
- classification:Semiconductors and ICs
271~285 item / All 4625 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
It is a resin that can be cured in a short time by exposing it to ultraviolet light with a wavelength of 200 to 400 nm.
- Other semiconductors
PEEK is a thermoplastic super heat-resistant resin that combines excellent mechanical properties and functionality.
- Other semiconductors
Excellent corrosion resistance (e.g., hundreds of times that of stainless steel in the case of concentrated hydrochloric acid)
- Other semiconductors
It is an abrasive with strong crushing strength and thermal stability.
- Other semiconductors
A lineup of 5 types of grain sizes.
- Other semiconductors
As of April 1, 2016, the old product name YUPIMORE(R) has been changed to SEPLAS SA.
- Other semiconductors
We have assembled equipment that is strong in the analysis of organic materials such as resin and carbon composites.
- diode
- Contract measurement
- Composite Materials
Announcement of the Start of Non-Destructive Testing Services from April 2018
On April 2, 2018, MST will introduce the latest processing and analysis equipment and begin offering non-destructive analysis services. We will provide analysis services across a wide range of fields, including product development and quality control in electronic devices, pharmaceuticals, and food. Non-destructive analysis is a technology that visualizes the internal condition of a product without destroying it. With the introduction of the latest processing and analysis equipment, MST will now be able to conduct non-destructive analysis. We will offer analysis services on a contract basis.
GC/MS: Gas Chromatography-Mass Spectrometry
- Contract Analysis
- Memory
AFM: Atomic Force Microscopy Method
- Contract Analysis
- Wafer
You can investigate the changes in degassing intensity while maintaining the temperature.
- Contract Analysis
- Memory
The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).
- Contract Analysis
- Transistor
The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.
- Contract Analysis
- magnet
- Memory
Microscopic structural analysis of amorphous films is possible through simulation.
- Contract Analysis
- Memory
It is possible to confirm the stress distribution in the sample cross-section.
- Contract Analysis
- Wafer
It is possible to evaluate trace metals in ppm orders.
- Contract Analysis
- Ceramics
- Wafer