List of Semiconductors and ICs products
- classification：Semiconductors and ICs
331～345 item / All 4584 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
New CVS analysis device "894 Professional CVS" for measuring organic additives in copper sulfate plating baths and tin/lead baths.
- Analytical Equipment and Devices
- Plating Equipment
- Wafer
"894 Professional CVS Analyzer" capable of multi-sample continuous automatic analysis by combining a sample changer and an electric burette.
- Analytical Equipment and Devices
- Plating Equipment
- Wafer
Custom formulations for important applications
- Other semiconductors
- Other medical supplies and cosmetic manufacturing materials
FFKM solutions designed for harsh operating conditions.
- Other semiconductors
For heat dissipation of surface mount packages such as DPAK, D2PAK, and SO-8. Our compact design reliably solves thermal issues in power converters and power supply boards.
- Other semiconductors
We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!
- Other semiconductors
A page on "Cleaning evaluation of organic residue remaining after sintering" has been added.
In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean solder bonding technology, sintering bonding is fundamentally designed to be "no-clean." However, the currently mainstream sintering bonding methods are conducted under high temperature and high pressure conditions, which can lead to the generation and adhesion of residues during the bonding process, potentially affecting subsequent processes and long-term reliability. Cleaning is one proposed solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. Detailed content of the technical column can be viewed through the related link.
From margin design that protects by looking at temperature to confident design that attacks by looking at heat flow.
- Dedicated IC
Ideal for high-aspect ratio filling, from research and development to mass production.
- Printing Machinery
- Other semiconductors
- Printed Circuit Board
Designed for a wavelength range of 760 to 2900 nm with an accuracy of ±10 nm.
- Other semiconductors
QCL optimal for high-precision gas detection using TDLAS.
- Other semiconductors
High-output DFB laser with a maximum of 40mW
- Other semiconductors
Battery-operated with low noise! Products that have built-in power supply and monitor display.
- diode
Equipped with a waveguide-integrated photodiode! Achieving a flat frequency response characteristic in both amplitude and phase.
- diode
Development of technologies for adhesion, control, and monitoring! Comprehensive support from design to manufacturing.
- Other semiconductors
- Wafer
- Other conveying machines