List of Semiconductors and ICs products
- classification：Semiconductors and ICs
586～600 item / All 4588 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
Analysis of gas flow under low pressure conditions; analysis software compatible with rarefied gases (rarefied fluids).
- Vacuum pump
- Vacuum Equipment
- Wafer
July 3 (Wed) - July 5 (Fri) [Exhibition Participation] Announcement of ISSP2024 Corporate Exhibition Corner Participation
The International Symposium on Sputtering and Plasma Processes 2024 (ISSP2024) will be held from July 3 (Wednesday) to July 5 (Friday), 2024, organized by the Surface Vacuum Society. Our company will be exhibiting at the corporate exhibition corner. ■ Exhibition Homepage https://www.issp-jvss.org/ ISSP is an international exhibition focused on sputtering and plasma process technology. This will be the first event in five years since ISSP2019 was held in 2019. Please be sure to stop by our exhibition corner. We will also be holding consultation sessions with our technical staff and demonstrating our developed software, such as Particle-PLUS and DSMC-Neutrals!! We sincerely look forward to your visit.
High-performance heat sink suitable for forced air cooling (rivet type) W300mm x H83.5mm
- Other semiconductors
W15 mm x H25 mm Transistor clip compatible aluminum heat sink
- Other semiconductors
Aluminum heat sink for board mounting that can secure a transistor without screws (W20 mm x H50 mm)
- Other semiconductors
Bending processing tailored to usage is also available! It is also possible to combine various functional materials for punching processing.
- Other semiconductors
- Processing Contract
Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W165mm x H84mm
- Other semiconductors
Width 47.8mm Height 33mm Length 50mm Extruded heat sink for PCB mounting Compatible with transistor clips
- Other semiconductors
Aluminum heat sink for mounting on a board, capable of securing a transistor with a clip, measuring 35 mm wide x 30 mm high.
- Other semiconductors